Patents by Inventor Zhingqiang Jiang

Zhingqiang Jiang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 9051454
    Abstract: The present invention discloses a heat-resistant polyamide composition and application thereof. The composition comprises the following components in percentage by weight: 40% to 90% of heat-resistant polyamide resin, 5% to 35% of mineral fiber A, 0 to 35% of mineral filler B, 0.1% to 1% of light stabilizer, 0.1% to 1% of flow modifier and 0.1% to 1% of antioxidant. In the present invention, heat-resistant polyamide resin with the ratio of amine-terminated group and carboxyl-terminated group between 0.1 and 0.8 is selected to be matched with deformed glass fibers with an aspect ratio of 2 to 6, the mineral filler B and the flow modifier to obtain the heat-resistant polyamide composition.
    Type: Grant
    Filed: December 8, 2011
    Date of Patent: June 9, 2015
    Assignees: KINGFA SCI & TECH CO. LTD., SHANGHAI KINGFA TECHNOLOGY DEVELOPMENT CO., LTD
    Inventors: Qingfeng Yi, Sujun Jiang, Jiehong Mai, Zhingqiang Jiang, Jieming Long, Xia Yan, Kaijun Ning, Tongmin Cai
  • Publication number: 20140303293
    Abstract: The present invention discloses a heat-resistant polyamide composition and application thereof. The composition comprises the following components in percentage by weight: 40% to 90% of heat-resistant polyamide resin, 5% to 35% of mineral fiber A, 0 to 35% of mineral filler B, 0.1% to I% of light stabilizer, 0.1% to 1% of flow modifier and 0.1% to 1% of antioxidant. In the present invention, heat-resistant polyamide resin with the ratio of amine-terminated group and carboxyl-terminated group between 0.1 and 0.8 is selected to be matched with deformed glass fibers with an aspect ratio of 2 to 6, the mineral filler B and the flow modifier to obtain the heat-resistant polyamide composition.
    Type: Application
    Filed: December 8, 2011
    Publication date: October 9, 2014
    Applicants: SHANGHAI KINGFA TECHNOLOGY DEVELOPMENT CO., LTD., KINGFA SCI & TECH CO LTD.
    Inventors: Qingfeng Yi, Sujun Jiang, Jiehong Mai, Zhingqiang Jiang, Jieming Long, Xia Yan, Kaijun Ning, Tongmin Cai