Abstract: The present invention relates to salts of a PI3Kdelta inhibitor (referred to as “Compound A” hereinafter), preferably fumarate, and the crystalline forms thereof. The present invention also relates to the process of preparation and uses of the salts and crystalline forms of Compound A.

Abstract: Methods are provided for fabricating electrochromic devices that mitigate formation of short circuits under a top bus bar without predetermining where top bus bars will be applied on the device. Devices fabricated using such methods may be deactivated under the top bus bar, or may include active material under the top bus bar. Methods of fabricating devices with active material under a top bus bar include depositing a modified top bus bar, fabricating self-healing layers in the electrochromic device, and modifying a top transparent conductive layer of the device prior to applying bus bars.

Abstract: A heat dissipation structure includes a housing configured to accommodate a heating element of an aerial vehicle. The housing includes a first air vent configured to guide an airflow into the housing and a second air vent configured to guide the airflow out of the housing. The airflow includes a propeller-generated airflow generated by a propeller of the aerial vehicle during rotation. The housing is located at an end of an arm of the aerial vehicle, away from the propeller in a longitudinal direction of the arm. A projection of the housing on a plane on which an area of rotation of the propeller lies at least partially overlaps the area of rotation of the propeller.

Abstract: A chip slot is disclosed, which includes a slot, where a plurality of terminal groups are disposed in the slot, terminals in each terminal group include metal sheets that are symmetrically disposed on two opposite inner side walls of the slot, and each metal sheet has a bending pin that extends outside the slot; bending directions of bending pins on the terminals in each terminal group are same; and for any row of metal sheets in any two adjacent terminal groups, along an arrangement direction of the row of metal sheets, bending pins of the metal sheets in the adjacent terminal groups are alternately arranged on both sides of the row of metal sheets. The bending pins of the row of metal sheets are bent toward two different directions.

Abstract: A heat dissipation structure includes a housing configured to accommodate a heating element of an unmanned aerial vehicle (UAV). The housing includes a first air vent and a second air vent. The first air vent is configured to guide an airflow into the housing. The airflow includes a propeller-generated airflow generated by a propeller of the UAV during rotation. A side projection of the first air vent on a side of the housing at least partially overlaps a side projection of the propeller on the side of the housing. The second air vent is configured to guide the airflow out of the housing.

Abstract: Methods are provided for fabricating electrochromic devices that mitigate formation of short circuits under a top bus bar without predetermining where top bus bars will be applied on the device. Devices fabricated using such methods may be deactivated under the top bus bar, or may include active material under the top bus bar. Methods of fabricating devices with active material under a top bus bar include depositing a modified top bus bar, fabricating self-healing layers in the electrochromic device, and modifying a top transparent conductive layer of the device prior to applying bus bars.

Abstract: Methods are provided for fabricating electrochromic devices that mitigate formation of short circuits under a top bus bar without predetermining where top bus bars will be applied on the device. Devices fabricated using such methods may be deactivated under the top bus bar, or may include active material under the top bus bar. Methods of fabricating devices with active material under a top bus bar include depositing a modified top bus bar, fabricating self-healing layers in the electrochromic device, and modifying a top transparent conductive layer of the device prior to applying bus bars.

Abstract: A UAV includes a camera assembly, a heat generating device, and a heat dissipation structure including a housing, a heat dissipation device, and heat dissipation fan for providing an air flow into the housing. The housing receives the heat generating device and includes a first air inlet and a first air outlet. The heat dissipation device includes heat dissipation fins disposed in parallel. The first air inlet and the camera assembly are located at a same side of the housing. The camera assembly is disposed at a front portion of the housing. A heat dissipation air channel formed between two adjacent heat dissipation fins includes a second air inlet and a second air outlet that is connected with the first air outlet. The heat dissipation fan includes a third air inlet connected with the first air inlet and a third air outlet connected with the second air inlet.

Abstract: A heat dissipation structure includes a housing configured to receive a heat generating device. The housing includes a first air inlet, a first air outlet, and an alloy heat dissipation device disposed in the housing and including heat dissipation fins disposed in parallel. A heat dissipation air channel is formed between two adjacent heat dissipation fins. The heat dissipation air channel includes a second air inlet and a second air outlet, the second air outlet being connected with the first air outlet. The heat dissipation structure further includes a heat dissipation fan configured to provide a heat dissipation air flow to an inside space of the housing. The heat dissipation fan is disposed inside the housing, and includes a third air inlet and a third air outlet. The third air inlet is connected with the first air inlet and the third air outlet is connected with the second air inlet.

Abstract: Methods are provided for fabricating electrochromic devices that mitigate formation of short circuits under a top bus bar without predetermining where top bus bars will be applied on the device. Devices fabricated using such methods may be deactivated under the top bus bar, or may include active material under the top bus bar. Methods of fabricating devices with active material under a top bus bar include depositing a modified top bus bar, fabricating self-healing layers in the electrochromic device, and modifying a top transparent conductive layer of the device prior to applying bus bars.

Abstract: Methods are provided for fabricating electrochromic devices that mitigate formation of short circuits under a top bus bar without predetermining where top bus bars will be applied on the device. Devices fabricated using such methods may be deactivated under the top bus bar, or may include active material under the top bus bar. Methods of fabricating devices with active material under a top bus bar include depositing a modified top bus bar, fabricating self-healing layers in the electrochromic device, and modifying a top transparent conductive layer of the device prior to applying bus bars.

Abstract: A heat dissipation structure includes a housing configured to accommodate a heating element of an unmanned aerial vehicle (UAV). The housing includes a first air vent and a second air vent. The first air vent is configured to guide an airflow into the housing. The airflow includes a propeller-generated airflow generated by a propeller of the UAV during rotation. A side projection of the first air vent on a side of the housing at least partially overlaps a side projection of the propeller on the side of the housing. The second air vent is configured to guide the airflow out of the housing.

Abstract: A heat dissipation structure includes a housing configured to receive a heat generating device. The housing includes a first air inlet, a first air outlet, and an alloy heat dissipation device disposed in the housing and including heat dissipation fins disposed in parallel. A heat dissipation air channel is formed between two adjacent heat dissipation fins. The heat dissipation air channel includes a second air inlet and a second air outlet, the second air outlet being connected with the first air outlet. The heat dissipation structure further includes a heat dissipation fan configured to provide a heat dissipation air flow to an inside space of the housing. The heat dissipation fan is disposed inside the housing, and includes a third air inlet and a third air outlet. The third air inlet is connected with the first air inlet and the third air outlet is connected with the second air inlet.

Abstract: Methods are provided for fabricating electrochromic devices that mitigate formation of short circuits under a top bus bar without predetermining where top bus bars will be applied on the device. Devices fabricated using such methods may be deactivated under the top bus bar, or may include active material under the top bus bar. Methods of fabricating devices with active material under a top bus bar include depositing a modified top bus bar, fabricating self-healing layers in the electrochromic device, and modifying a top transparent conductive layer of the device prior to applying bus bars.

Abstract: Methods are provided for fabricating electrochromic devices that mitigate formation of short circuits under a top bus bar without predetermining where top bus bars will be applied on the device. Devices fabricated using such methods may be deactivated under the top bus bar, or may include active material under the top bus bar. Methods of fabricating devices with active material under a top bus bar include depositing a modified top bus bar, fabricating self-healing layers in the electrochromic device, and modifying a top transparent conductive layer of the device prior to applying bus bars.

Abstract: Methods are provided for fabricating electrochromic devices that mitigate formation of short circuits under a top bus bar without predetermining where top bus bars will be applied on the device. Devices fabricated using such methods may be deactivated under the top bus bar, or may include active material under the top bus bar. Methods of fabricating devices with active material under a top bus bar include depositing a modified top bus bar, fabricating self-healing layers in the electrochromic device, and modifying a top transparent conductive layer of the device prior to applying bus bars.

Abstract: Methods are provided for fabricating electrochromic devices that mitigate formation of short circuits under a top bus bar without predetermining where top bus bars will be applied on the device. Devices fabricated using such methods may be deactivated under the top bus bar, or may include active material under the top bus bar. Methods of fabricating devices with active material under a top bus bar include depositing a modified top bus bar, fabricating self-healing layers in the electrochromic device, and modifying a top transparent conductive layer of the device prior to applying bus bars.

Abstract: Disclosed are a Chinese website classification method and system based on characteristic analysis of a website homepage. The method specifically comprises the following steps: S1, crawling website content; S2, labeling a website type; S3, extracting website information; S4, calculating a weight and representing the weight in the form of a characteristic vector; and S5, classifying the website by comparing the characteristic vector. By utilizing the above Chinese website classification method and system, the noise interference can be alleviated to the greatest extent by only extracting a title and meta-information of the website; by means of pre-processing and characteristic vector expression, the characteristics of the website are accurately expressed with the vector, so that the accuracy of classification is increased; and since only the title and meta-information of the website need to be processed, the quantity of data to be processed is small, and the processing speed is high.

Abstract: Structures, deposition systems and deposition processes related generally to a solid oxide fuel cells (SOFC) are provided. A nanometer to submicron laminar structure of LaxSryMnOz is used as an interconnect layer or interface layer between a cathode and an electrolyte for the SOFCs. The SOFC includes a cathode layer, an interface layer coupled to the cathode layer, and an electrolyte coupled to the interface layer. The interface layer includes a plurality of first layers characterized by a first density interleaved with a plurality of second layers characterized by a second density. The first density is lower than the second density. Furthermore, one of the plurality of the first layers is coupled to the cathode layer. Moreover, one of the plurality of the second layers is coupled to the electrolyte. The laminar structure of LaxSryMnOz has been applied to the SOFCs to reduce performance degradation in the SOFCs.

Abstract: Fluorescein and derivatives have use in the treatment of a disease of a living animal body, including human, which disease is responsive to the inhibition of the cystic fibrosis transmembrane conductance regulator chloride channels, for instance polycystic kidney disease and secretory diarrhoea.