Abstract: A bolter miner includes a rack, a cutting device and a bolt support device. The cutting device is configured for a cutting operation and is arranged on the rack to swing up and down. The bolt support device includes a lifting assembly, a work platform, a first drilling frame assembly and a stabilization assembly. The lifting assembly is arranged between the rack and the work platform and is configured to lift the work platform. The first drilling frame assembly and the stabilization assembly are arranged on the work platform. The first drilling frame assembly has a bolt support position and an avoidance position. The work platform can extend and retract to switch the bolt support position and the avoidance position of the first drilling frame assembly. The stabilization assembly can be supported between the cutting device and a tunnel roof, so as to enhance the stability of the first drilling frame assembly during a bolt support operation.

Abstract: The present application provides an organic light emitting diode (OLED) display panel and a method of manufacturing the same, and a display terminal. The OLED display panel includes an array substrate, a protective layer and a cathode. The array substrate includes a first auxiliary electrode, a second auxiliary electrode, and a third auxiliary electrode. The third auxiliary electrode is connected to the first auxiliary electrode and the second auxiliary electrode. The protective layer is provided with an undercut opening exposing a portion of the third auxiliary electrode. The cathode extends into the undercut opening and is connected to the third auxiliary electrode.

Abstract: Systems and methods of monitoring inventory of a product storage facility include an image capture device configured to move about the product storage areas of the product storage facility and capture images of the product storage areas from various angles. A computing device coupled to the image capture device obtains the images of the product storage areas captured by the image capture device and processes the obtained images of the product storage areas to detect individual products captured in the obtained images. Based on detection of the individual products captured in the images, the computing device analyzes each of the obtained images to extract meta data from the packaging the individual products to detect one more keywords and determine the locations of the detected keywords on the packaging, and then utilize this information to predict an identity of the products associated with the packaging.

Abstract: Provided are an overhead line detection method and system based on a cable inspection robot. The cable inspection robot is suspended on the overhead line. An imaging unit and a laser emission unit are disposed at the front end of the cable inspection robot. The imaging unit is at a first angle to the overhead line. The laser emission unit is at a second angle to the overhead line.

Abstract: A bulk acoustic wave resonant structure includes a substrate, and a reflection structure, a first electrode layer, a piezoelectric layer and a second electrode layer, which are sequentially stacked on the substrate, wherein ring-shaped grooves are provided in the piezoelectric layer; and the grooves are located in an active area and are close to an edge of the active area.

Abstract: A foldable substrate is provided that includes a first substrate portion with a first upper surface and a second substrate portion with a second upper surface. A foldable bridge portion couples the first substrate portion to the second substrate portion. The foldable bridge portion includes a coupling strip that extends from the first substrate portion to the second substrate portion with a gap corresponding to a portion of the coupling strip where the gap is defined between the first and second substrate portions by removing portions of a starting wafer substrate. The first and second portions, in one embodiment, include magnetic field sensors and the foldable bridge portion can be bent to arrange the two portions at a predetermined angle to one another. Once bent, the sensor package can be incorporated into a magnetic field sensor assembly to be integrated with other control circuitry.

Abstract: A sensor package has integrated magnetic and acceleration sensor package structures, where a first wafer is bonded to a second wafer with a cavity defined between them. The magnetic sensor is bonded to the bottom of the first wafer and the acceleration sensor is provided within the cavity. Circuitry to drive the accelerometer and interface with the magnetic sensor is provided on the first wafer.