Patents by Inventor Zhi-Wei Lai

Zhi-Wei Lai has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240074063
    Abstract: A photosensitive assembly includes a circuit board and a photosensitive chip disposed on the circuit board. A first direction is defined as a direction from the circuit board to the photosensitive chip. The circuit board is convex in the first direction or an opposite direction of the first direction. The photosensitive chip is in the first direction or the opposite direction of the first direction. A bending direction of the circuit board is the same as a bending direction of the photosensitive chip.
    Type: Application
    Filed: November 22, 2022
    Publication date: February 29, 2024
    Inventors: WEN-CHING LAI, WAN-LI ZHANG, ZHI-WEI LI, YA-JIE NIU
  • Publication number: 20150013929
    Abstract: The present invention discloses a die-casting mold structure for a thin-walled mini zinc alloy shell. The mold structure includes a longitudinal runner, a transverse runner, an end runner, and a mold cavity all connected serially to provide a path for a liquid metal. The end runner and the mold cavity are connected through an in-gate. The liquid metal flows through the in-gate and enters the mold cavity at an incidence angle of approximately 30 to 45 degrees. The liquid metal is incident on the mold cavity near the rear end surface of the mold cavity. The direction of the liquid metal flow is controlled as the liquid metal flows through the runners and into the cavity so as to reduce the amount of air mixed into the liquid metal. The result is that the liquid metal can fill the mold cavity more satisfactorily, reducing casting defects and increasing product yield.
    Type: Application
    Filed: July 11, 2014
    Publication date: January 15, 2015
    Inventor: Zhi Wei LAI
  • Publication number: 20150013930
    Abstract: The present invention discloses a die-casting mold structure for a thin-walled shell for electrical connectors and a method for designing the mold structure. The runner of the mold structure includes a longitudinal runner, a transverse runner, an end runner, and an in-gate connected sequentially. The cross-sectional areas of the longitudinal runner, the transverse runner, the end runner, and the in-gate decrease progressively. The cross sections of the longitudinal runner and the transverse runner may be oval or circular in shape. The perimeter-to-area ratio of the oval cross section of the longitudinal runner and of the transverse runner is smaller than the ratio for a runner with a rectangular cross section of the same area. The method may be used to calculate the in-gate area. Cold shuts and gas entrapment during the molding process are reduced, enhancing the quality of the thin-walled shell and raising the efficiency of the design process.
    Type: Application
    Filed: July 11, 2014
    Publication date: January 15, 2015
    Inventor: Zhi Wei LAI
  • Publication number: 20130255117
    Abstract: A display device includes an inner base shell, a backlight panel, a frame unit and an outer base shell. The inner base shell includes a base wall; a surrounding wall extending from the circumference of the base wall at an angle therewith; and, a containing space cooperatively defined by the base and the surrounding walls. The backlight panel is disposed in the containing space. The frame unit formed of plastic and fixed around the surrounding wall has an inner side surface contacting the surrounding wall; an outer side surface opposite to the inner side surface; and, a front side surface connected to front side edges of the inner and the outer side surfaces. The outer base shell covering the inner base shell and the outer side surface of the frame unit has a front opening for exposing the backlight panel and the front side surface of the frame unit.
    Type: Application
    Filed: October 30, 2012
    Publication date: October 3, 2013
    Applicant: Top Victory Investments Ltd.
    Inventor: Zhi-Wei Lai