Abstract: Aspects of the invention include a connection mechanism and a bed therewith. The connection mechanism comprises a first bracket having a body plate, and two tabs and vertically extended/bent from two opposite side edges of the body plate to define a first angle relative to the body plate; and a second bracket having a body plate, and two tabs and vertically extended/bent from two opposite side edges of the body plate to define a second angle relative to the body plate. The first angle of the first bracket and the second angle of the second bracket are supplementary to each other such that one of the first bracket and the second bracket is complementarily and tightly receivable in another one of the first bracket and the second bracket.

Abstract: Described are polypeptides having glucoamylase activity, compositions comprising such polypeptides, and methods of using such polypeptides and compositions.

Abstract: An embolic coil conveying device and a preparation method thereof are disclosed. The embolic coil conveying device includes a pusher and an embolic coil. A distal end of the pusher and a proximal end of the embolic coil are connected to serve as a detachment section. A stretch-resistant thread is disposed in the embolic coil. The stretch-resistant thread is fixed at the proximal end of the embolic coil. A conductive wire is disposed in the pusher. The stretch-resistant thread is connected to the conductive wire. Compared with the prior art, the present invention has the advantages that the stretch-resistant thread is fixed at the proximal end of the embolic coil, so that the stretch-resistant thread is connected to the conductive wire, thereby reducing the length of the detachment section, making the detachment section more flexible, and avoiding kick-out of a microcatheter due to release of the embolic coil.

Abstract: An example system includes prediction workers, training workers, and a parameter server. The prediction workers store a local copy of a machine-learned model and run the mode exclusively in serving mode. The training workers store a local copy of a machine-learned model and a local snapshot and run the local copy exclusively in training mode and compare the local model or state to the snapshot after training to send delta updates to the parameter server after training. The parameter server aggregates received delta updates into a master copy of the model, sends the aggregated updates back to training workers and provides two types of updates; a real-time update based on a comparison of the master model with a local snapshot, and a full update. The real-time update occurs at least an order of magnitude more frequently than the full update and includes a subset of the weights in the model.

Abstract: An embolic coil conveying device and a preparation method thereof are disclosed. The embolic coil conveying device includes a pusher and an embolic coil. A distal end of the pusher and a proximal end of the embolic coil are connected to serve as a detachment section. A stretch-resistant thread is disposed in the embolic coil. The stretch-resistant thread is fixed at the proximal end of the embolic coil. A conductive wire is disposed in the pusher. The stretch-resistant thread is connected to the conductive wire. Compared with the prior art, the present invention has the advantages that the stretch-resistant thread is fixed at the proximal end of the embolic coil, so that the stretch-resistant thread is connected to the conductive wire, thereby reducing the length of the detachment section, making the detachment section more flexible, and avoiding kick-out of a microcatheter due to release of the embolic coil.

Abstract: Described are methods of saccharifying starch-containing materials using a glucoamylase, as well as the methods of producing fermentation products and the fermentation products produced by the method thereof.

Abstract: Novel aspartic proteases, compositions containing these proteases and uses thereof are disclosed.

Abstract: The present disclosure relates to polypeptides having alpha-glucosidase activity isolated, derived or derivable from Rasamsonia or engineered polypeptides having alpha-glucosidase activity isolated, derived or derivable from Rasamsonia homologs. The present disclosure also pertains to polynucleotides encoding the polypeptides, nucleic acid constructs, vectors, host cells and mutant cells comprising the polynucleotides. The disclosure further pertains to compositions comprising such polypeptides, methods of producing the polypeptides and compositions, as well as methods for using such polypeptides and compositions for industrial applications.

Abstract: The present disclosure relates to polypeptides having alpha-glucosidase activity isolated, derived or derivable from Rasamsonia or engineered polypeptides having alpha-glucosidase activity isolated, derived or derivable from Rasamsonia homologs. The present disclosure also pertains to polynucleotides encoding the polypeptides, nucleic acid constructs, vectors, host cells and mutant cells comprising the polynucleotides. The disclosure further pertains to compositions comprising such polypeptides, methods of producing the polypeptides and compositions, as well as methods for using such polypeptides and compositions for industrial applications.

Abstract: Methods of fabricating a multi-layer semiconductor structure are provided. In one embodiment, a method includes depositing a first dielectric layer over a semiconductor structure, depositing a first metal layer over the first dielectric layer, patterning the first metal layer to form a plurality of first metal lines, and depositing a second dielectric layer over the first metal lines and the first dielectric layer. The method also includes removing a portion of the second dielectric layer over selected first metal lines to expose a respective top surface of each of the selected first metal lines. The method further includes reducing a thickness of the selected first metal lines to be less than a thickness of the unselected first metal lines. A multi-layer semiconductor structure is also provided.

Abstract: The present invention discloses a coronary artery vascular stent with drug carrying slots (2), comprising a plurality of main supporting unit rings (1,8) and connecting rods (4,6). Said main supporting unit rings comprise a plurality of unit waves. There are drug carrying slots (2) at the outer surface of the rods of said unit waves, characterized in that the total slot length of the drug carrying slots (2) is 60%-75% of the total wave rod length of the main supporting unit rings (1,8).

Abstract: Methods of fabricating a multi-layer semiconductor structure are provided. In one embodiment, a method includes depositing a first dielectric layer over a semiconductor structure, depositing a first metal layer over the first dielectric layer, patterning the first metal layer to form a plurality of first metal lines, and depositing a second dielectric layer over the first metal lines and the first dielectric layer. The method also includes removing a portion of the second dielectric layer over selected first metal lines to expose a respective top surface of each of the selected first metal lines. The method further includes reducing a thickness of the selected first metal lines to be less than a thickness of the unselected first metal lines. A multi-layer semiconductor structure is also provided.

Abstract: Methods of fabricating a multi-layer semiconductor structure are provided. In one embodiment, a method includes depositing a first dielectric layer over a semiconductor structure, depositing a first metal layer over the first dielectric layer, patterning the first metal layer to form a plurality of first metal lines, and depositing a second dielectric layer over the first metal lines and the first dielectric layer. The method also includes removing a portion of the second dielectric layer over selected first metal lines to expose a respective top surface of each of the selected first metal lines. The method further includes reducing a thickness of the selected first metal lines to be less than a thickness of the unselected first metal lines. A multi-layer semiconductor structure is also provided.

Abstract: A method for producing carbon paper, including: 1) employing a polyacrylonitrile-based carbon fiber as a reinforcing material, a phenolic resin or epoxy resin as a bonding agent, and molding and preparing the carbon fiber into a carbon fiber blank by a dry paper-making method; and 2) stacking and putting a product obtained in step 1) into a reaction furnace for deposition process, the pressure in the reaction furnace being 1 kPa to 1 atmosphere, with methane, propene, or liquefied petroleum gas as a carbon source gas, nitrogen or argon gas as a diluent gas, the concentration of the carbon source gas being 5-100%, the gas flow rate being 0.1-5 L/min, and the temperature in the reaction furnace being controlled at between 800° C. and 1100° C., and the time of deposition process being 1-5 h.

Abstract: The present application discloses a surgical apparatus for aneurysms comprising: a stent, a delivery guide wire, an introducer sheath and a microcatheter, wherein: the stent is a self-expanding stent; the delivery guide wire outside of which the stent is restrained to is provided in a lumen of the introducer sheath; the introducer sheather is connected with the microcatheter, with lumnes communicating, to form a passageway through which the delivery guide wire and the stent are delivered into a human body. The surgical apparatus for aneurysms provided in the examples of the present application is able to deliver and release the stent which has high density and is super soft to a vascular lesion. A lattice structure of the stent is of high coverage at the vascular lesion such that the stent released into the vessel prodeces the same effects as healing of parent vessel, and thus improves the treatment of vascular aneurysms.

Abstract: A medical guide wire comprises a metal core (1), a coil (2), a delivery element (3) and a boss (4). The metal core (1) has a variable-diameter structure, which consists of a linear structure (1-3), a stepped structure (1-2) and a linear structure (1-1) from a proximal end to a distal end. The number of the coil (2) is one or more, and the coil(s) is/are fixed on the linear structure (1-1) and the stepped structure (1-2) at the distal end of the metal core (1). The number of the delivery element (3) is one or more, and the delivery element(s) is/are fixed to the stepped structure (1-2) of the metal core (1). The boss (4) is fixed on the stepped structure (1-2) of the metal core (1) behind the delivery element (3).

Abstract: A method for producing carbon paper, including: 1) employing a polyacrylonitrile-based carbon fiber as a reinforcing material, a phenolic resin or epoxy resin as a bonding agent, and molding and preparing the carbon fiber into a carbon fiber blank by a dry paper-making method; and 2) stacking and putting a product obtained in step 1) into a reaction furnace for deposition process, the pressure in the reaction furnace being 1 kPa to 1 atmosphere, with methane, propene, or liquefied petroleum gas as a carbon source gas, nitrogen or argon gas as a diluent gas, the concentration of the carbon source gas being 5-100%, the gas flow rate being 0.1-5 L/min, and the temperature in the reaction furnace being controlled at between 800° C. and 1100° C., and the time of deposition process being 1-5 h.

Abstract: The present invention discloses a coronary artery vascular stent with drug carrying slots (2), comprising a plurality of main supporting unit rings (1,8) and connecting rods (4,6). Said main supporting unit rings comprise a plurality of unit waves. There are drug carrying slots (2) at the outer surface of the rods of said unit waves, characterized in that the total slot length of the drug carrying slots (2) is 60%-75% of the total wave rod length of the main supporting unit rings (1,8).

Abstract: Methods of fabricating a multi-layer semiconductor structure are provided. In one embodiment, a method includes depositing a first dielectric layer over a semiconductor structure, depositing a first metal layer over the first dielectric layer, patterning the first metal layer to form a plurality of first metal lines, and depositing a second dielectric layer over the first metal lines and the first dielectric layer. The method also includes removing a portion of the second dielectric layer over selected first metal lines to expose a respective top surface of each of the selected first metal lines. The method further includes reducing a thickness of the selected first metal lines to be less than a thickness of the unselected first metal lines. A multi-layer semiconductor structure is also provided.