Abstract: A semi-automatic adjustment device for suppressing tension fluctuations during a rolling process of an ultra-thin strip includes a semi-automatic tension regulator, a semi-automatic tuned mass damper of variable stiffness and damping, a coiler, a tension roller and a twenty-high roller system. The semi-automatic tension regulator is disposed between the coiler and the tension roller, the semi-automatic tuned mass damper of variable stiffness and damping is disposed between the tension roller and the twenty-high roller system. The semi-automatic adjustment device can be used to reduce a short-time fluctuation impact of tension during startup and shutdown of a twenty-high roll mill when the twenty-high rolling mill rolls an ultra-thin strip, improve system stability, absorb the continuous micro disturbances generated during the rolling process of the twenty-high roll mill, and achieve flexible and stable adjustment of tension during the rolling process.

Abstract: An alginate hydrogel-based thin-film heat flux sensor for billet crystallizer includes an alginate hydrogel substrate. The alginate hydrogel substrate is configured in a U-shaped planar structure. The U-shaped planar structure includes a first side and a second side, and the first side is longer than the second side. An inner surface of the alginate hydrogel substrate is provided with a first film thermocouple and a second film thermocouple. The first film thermocouple is in crosslinking connection with the second film thermocouple.

Abstract: Disclosed is an electromagnetic-induction heating device for a thin film thermocouple on a ceramic blade, including a spiral coil. The ceramic blade is enveloped in the spiral coil, and two ends of the spiral coil are both connected to an electromagnetic-induction heater. The ceramic blade is arranged in an alumina ceramic chamber, and the thin-film thermocouple is arranged on a surface of the ceramic blade. One end of the air channel is connected to an end of the alumina ceramic chamber, and the other end of the air channel is connected to an infrared nod temperature instrument and a vacuum pump. The infrared nod temperature instrument, the electromagnetic-induction heater, and the vacuum pump controller are electrically connected to the controller.

Abstract: Provided herein is a tungsten-rhenium composite thin film thermocouple based on a surface micropillar array with gas holes. A tungsten-rhenium thin film thermocouple is arranged on a surface of a flat alumina ceramic substrate. Two tails of the tungsten-rhenium thin film thermocouple are respectively connected to a lead wire. A surface of the tungsten-rhenium thin film thermocouple is arrayed with a plurality of micron alumina micropillars to form an alumina micropillar array. Air is filled between the micron alumina micropillars to form the gas holes. The flat alumina ceramic substrate, the tungsten-rhenium thin film thermocouple and the alumina micropillar array form a three-layered laminated structure.

Abstract: Provided herein is a tungsten-rhenium composite thin film thermocouple based on a surface micropillar array with gas holes. A tungsten-rhenium thin film thermocouple is arranged on a surface of a flat alumina ceramic substrate. Two tails of the tungsten-rhenium thin film thermocouple are respectively connected to a lead wire. A surface of the tungsten-rhenium thin film thermocouple is arrayed with a plurality of micron alumina micropillars to form an alumina micropillar array. Air is filled between the micron alumina micropillars to form the gas holes. The flat alumina ceramic substrate, the tungsten-rhenium thin film thermocouple and the alumina micropillar array form a three-layered laminated structure.

Abstract: A thin-film thermocouple probe includes a columnar substrate, a tungsten-26% rhenium film and an indium oxide (In2O3) film. A side surface of the columnar substrate is provided with a first straight groove and a second straight groove. The tungsten-26% rhenium film is arranged on a front end surface of the columnar substrate and in the first straight groove. The indium oxide film is arranged on the front end surface of the columnar substrate and in the second straight groove. The indium oxide film on the front end surface of the columnar substrate is connected to the tungsten-26% rhenium film on the front end surface of the columnar substrate. A first metal lead wire is connected to the tungsten-26% rhenium film, and a second metal lead wire is connected to the indium oxide film. A method of preparing the thin-film thermocouple probe is provided.

Abstract: A thin-film thermocouple probe includes a columnar substrate, a tungsten-26% rhenium film and an indium oxide (In2O3) film. A side surface of the columnar substrate is provided with a first straight groove and a second straight groove. The tungsten-26% rhenium film is arranged on a front end surface of the columnar substrate and in the first straight groove. The indium oxide film is arranged on the front end surface of the columnar substrate and in the second straight groove. The indium oxide film on the front end surface of the columnar substrate is connected to the tungsten-26% rhenium film on the front end surface of the columnar substrate. A first metal lead wire is connected to the tungsten-26% rhenium film, and a second metal lead wire is connected to the indium oxide film. A method of preparing the thin-film thermocouple probe is provided.

Abstract: Method for transmitting packet in resilient packet intersect ring includes: at least two resilient packet intersect ring intersect each other on two intersect node, the intersect node receives a broadcast packet from the first resilient packet ring, and copies the said broadcast packet; the said intersect node judges whether allowing to insert the said broadcast packet into the second resilient packet ring by spanning the ring according to the identification information included in the said copied broadcast packet, if so, inserting into the second resilient packet ring by spanning the ring and broadcasting, otherwise, discarding the said broadcast packet, the control condition of allowing to broadcast by spanning the ring of all intersect nodes is null. The invention can ensure that when all intersect nodes can transmit spanning ring server, it avoids spanning ring broadcast storm. The invention is applied to the case that several resilient packet rings intersect each other.