Abstract: The present invention relates to a preparation method of a P-type high-resistance and ultra-high-resistance Czochralski monocrystalline silicon substrate. According to the present invention, an oxygen concentration in a silicon wafer is controlled to match with a resistivity, so as to realize that a conductive type of the silicon substrate does not change after a device is manufactured, and that the silicon substrate has a high resistivity. The oxygen concentration and the resistivity in silicon crystal can be adjusted separately or together; and operation is flexible, and a yield of a high-resistance silicon crystal is greatly improved.

Abstract: Systems and methods of mitigating Coulomb effect in a multi-beam apparatus are disclosed. The multi-beam apparatus may include a charged-particle source configured to generate a primary charged-particle beam along a primary optical axis, a first aperture array comprising a first plurality of apertures having shapes and configured to generate a plurality of primary beamlets derived from the primary charged-particle beam, a condenser lens comprising a plane adjustable along the primary optical axis, and a second aperture array comprising a second plurality of apertures configured to generate probing beamlets corresponding to the plurality of beamlets, wherein each of the plurality of probing beamlets comprises a portion of charged particles of a corresponding primary beamlet based on at least a position of the plane of the condenser lens and a characteristic of the second aperture array.

Abstract: Provided are a passivation layer for forming a semiconductor bonding structure, a sputtering target making the same, a semiconductor bonding structure and a semiconductor bonding process. The passivation layer is formed on a bonding substrate by sputtering the sputtering target; the passivation layer and the sputtering target comprise a first metal, a second metal or a combination thereof. The bonding substrate comprises a third metal. Based on a total atom number of the surface of the passivation layer, O content of the surface of the passivation layer is less than 30 at %; the third metal content of the surface of the passivation layer is less than or equal to 10 at %. The passivation layer has a polycrystalline structure. The semiconductor bonding structure sequentially comprises a first bonding substrate, a bonding layer and a second bonding substrate: the bonding layer is mainly formed by the passivation layer and the third metal.

Abstract: A multi-beam apparatus for multi-beam inspection with an improved source conversion unit providing more beamlets with high electric safety, mechanical availability and mechanical stabilization has been disclosed. The source-conversion unit comprises an image-forming element array having a plurality of image-forming elements, an aberration compensator array having a plurality of micro-compensators, and a pre-bending element array with a plurality of pre-bending micro-deflectors. In each of the arrays, adjacent elements are placed in different layers, and one element may comprise two or more sub-elements placed in different layers. The sub-elements of a micro-compensator may have different functions such as micro-lens and micro-stigmators.

Abstract: The present disclosure relates to a wide-range perpendicular sensitive magnetic sensor and the method for manufacturing the same, the magnetic sensor includes a substrate, a plurality of magnetic tunnel junctions, a plurality of magnetic flux regulators, a first output port and a second output port.

Abstract: The present disclosure relates to a wide-range perpendicular sensitive magnetic sensor and the method for manufacturing the same, the magnetic sensor includes a substrate, a plurality of magnetic tunnel junctions, a plurality of magnetic flux regulators, a first output port and a second output port.

Abstract: The disclosed system may include a conductive enclosure, a first printed circuit board (PCB) that includes multiple antenna feeds, and a second PCB that includes a grounding layer and one or more sensors. A first antenna feed may be electrically connected to the conductive enclosure, and a second antenna feed may be electrically connected to the grounding layer of the second PCB. As such, the grounding layer of the second PCB may act as a radiating element for a second antenna. Various other mobile electronic devices, apparatuses, and methods of manufacturing are also disclosed.

Abstract: The disclosure relates to an automatic measuring system and a method thereof for drilling fluid parameters measurement. The system includes i. mud container, configured for test drilling fluid preparation and samples collection; ii. heat jacket, configured to keep the drilling fluid in the tank warm iii. heat exchanger, configured to simulate the practical conditions; iv. plunger pump, configured to pump the test drilling fluid to the flowing test device; v. flow test device, configured to simulate the flowing states of drilling fluid in the borehole annulus and drilling string, and also measure the pressure and flow rate of drilling fluid vi. control module, configured to obtain rheological parameters and the best rheological mode of the drilling fluid in the borehole annulus and drilling string based on the pressure and flow rate.

Abstract: A method for modifying engine files, the method performed by at least one processor in one or more servers at a cloud based location, the method comprising receiving, by the one or more servers at the cloud based location from at least one host device, a derived data cache (DDC) generated by the at least one host device; distributing the DDC from the one or more servers at the cloud based location to one or more client locations, the one or more client locations performing at least one modification to the DDC; and receiving the modified DDC, by the one or more servers at the cloud based location from the one or more client locations.

Abstract: The present disclosure relates to an AC/DC closed-loop current sensor, including a magnetism gathering iron core, a TMR chip, a signal processing circuit, a signal generator, and a feedback coil. The TMR chip is arranged at an air gap of the magnetism gathering iron core and connected to the signal processing circuit. The signal processing circuit is connected to the signal generator. The feedback coil is wound around the magnetism gathering iron core and connected to the signal generator. The signal processing circuit is configured to select from the induced signal of the TMR chip and make an amplification to obtain a current signal component and send the current signal component to the signal generator. The signal generator is configured to adjust a current output to the feedback coil based on the current signal component, and output a measurement result of the selected current signal component.

Abstract: Disclosed herein is an apparatus comprising: a first electrically conductive layer, a second electrically conductive layer; a plurality of optics element s between the first electrically conductive layer and the second electrically conductive layer, wherein the plurality of optics elements are configured to influence a plurality of beams of charged particles; a third electrically conductive layer between the first electrically conductive layer and the second electrically conductive layer; and an electrically insulating layer physically connected to the optics elements, wherein the eclectically insulating layer is configured to electrically insulate the optics elements from the first electrically conductive layer, and the second electrically conductive layer.

Abstract: A power module includes a printed circuit board (PCB), a magnetic element, primary and secondary winding circuits and a regulator. The magnetic element is disposed on the PCB and has first to fourth sides. The second side is opposite to the first side, the fourth side is opposite to the third side. The primary winding circuit is disposed on the PCB and positioned in a vicinity of the first or second side. The secondary winding circuit is disposed on the first PCB and positioned in a vicinity of the third or fourth side. The regulator includes a switch disposed on the PCB, and coupled to the primary winding circuit. The at least one switch, the primary winding circuit, and the magnetic element are arranged in a first direction in order. A power device is also disclosed herein.

Abstract: Disclosed herein is an apparatus comprising: a source configured to emit charged particles, an optical system and a stage; wherein the stage is configured to support a sample thereon and configured to move the sample by a first distance in a first direction; wherein the optical system is configured to form probe spots on the sample with the charged particles; wherein the optical system is configured to move the probe spots by the first distance in the first direction and by a second distance in a second direction, simultaneously, while the stage moves the sample by the first distance in the first direction; wherein the optical system is configured to move the probe spots by the first distance less a width of one of the probe spots in an opposite direction of the first direction, after the stage moves the sample by the first distance in the first direction.

Abstract: Various embodiments of the teachings herein include a method for optimizing a gasifier model. Some examples include: virtually partitioning the gasifier by temperature; enabling the gasifier model to input feed split from total feed based on a respective proportion coefficient in each virtual partition to perform gasification reactions independently by each virtual partition; enabling the gasifier model to determine a virtual value of a gasifier parameter after mixing the virtual partitions, quenching and shifting when gasification reactions reach an equilibrium in each virtual partition; determining a measured value of the gasifier parameter when the total feed is input; and adjusting the proportion coefficients based on a comparison result between the measured value and the virtual value of the gasifier parameter.

Abstract: Systems and methods of mitigating Coulomb effect in a multi-beam apparatus are disclosed. The multi-beam apparatus may include a charged-particle source configured to generate a primary charged-particle beam along a primary optical axis, a first aperture array comprising a first plurality of apertures having shapes and configured to generate a plurality of primary beamlets derived from the primary charged-particle beam, a condenser lens comprising a plane adjustable along the primary optical axis, and a second aperture array comprising a second plurality of apertures configured to generate probing beamlets corresponding to the plurality of beamlets, wherein each of the plurality of probing beamlets comprises a portion of charged particles of a corresponding primary beamlet based on at least a position of the plane of the condenser lens and a characteristic of the second aperture array.

Abstract: A multi-beam apparatus for multi-beam inspection with an improved source conversion unit providing more beamlets with high electric safety, mechanical availability and mechanical stabilization has been disclosed. The source-conversion unit comprises an image-forming element array having a plurality of image-forming elements, an aberration compensator array having a plurality of micro-compensators, and a pre-bending element array with a plurality of pre-bending micro-deflectors. In each of the arrays, adjacent elements are placed in different layers, and one element may comprise two or more sub-elements placed in different layers. The sub-elements of a micro-compensator may have different functions such as micro-lens and micro-stigmators.

Abstract: Various embodiments of the teachings herein include a method for optimizing a gasifier model. Some examples include: virtually partitioning the gasifier by temperature; enabling the gasifier model to input feed split from total feed based on a respective proportion coefficient in each virtual partition to perform gasification reactions independently by each virtual partition; enabling the gasifier model to determine a virtual value of a gasifier parameter after mixing the virtual partitions, quenching and shifting when gasification reactions reach an equilibrium in each virtual partition; determining a measured value of the gasifier parameter when the total feed is input; and adjusting the proportion coefficients based on a comparison result between the measured value and the virtual value of the gasifier parameter.

Abstract: Disclosed herein is an apparatus comprising: a source configured to emit charged particles, an optical system and a stage; wherein the stage is configured to support a sample thereon and configured to move the sample by a first distance in a first direction; wherein the optical system is configured to form probe spots on the sample with the charged particles; wherein the optical system is configured to move the probe spots by the first distance in the first direction and by a second distance in a second direction, simultaneously, while the stage moves the sample by the first distance in the first direction; wherein the optical system is configured to move the probe spots by the first distance less a width of one of the probe spots in an opposite direction of the first direction, after the stage moves the sample by the first distance in the first direction.

Abstract: Disclosed herein is an apparatus comprising: a first electrically conductive layer; a second electrically conductive layer; a plurality of optics element s between the first electrically conductive layer and the second electrically conductive layer, wherein the plurality of optics elements are configured to influence a plurality of beams of charged particles; a third electrically conductive layer between the first electrically conductive layer and the second electrically conductive layer; and an electrically insulating layer physically connected to the optics elements, wherein the electrically insulating layer is configured to electrically insulate the optics elements from the first electrically conductive layer, and the second electrically conductive layer.

Abstract: A new multi-beam apparatus with a total FOV variable in size, orientation and incident angle, is proposed. The new apparatus provides more flexibility to speed the sample observation and enable more samples observable. More specifically, as a yield management tool to inspect and/or review defects on wafers/masks in semiconductor manufacturing industry, the new apparatus provide more possibilities to achieve a high throughput and detect more kinds of defects.