Abstract: The present disclosure relates to a wide-range perpendicular sensitive magnetic sensor and the method for manufacturing the same, the magnetic sensor includes a substrate, a plurality of magnetic tunnel junctions, a plurality of magnetic flux regulators, a first output port and a second output port.

Abstract: The present disclosure relates to a wide-range perpendicular sensitive magnetic sensor and the method for manufacturing the same, the magnetic sensor includes a substrate, a plurality of magnetic tunnel junctions, a plurality of magnetic flux regulators, a first output port and a second output port.

Abstract: The present disclosure relates to an AC/DC closed-loop current sensor, including a magnetism gathering iron core, a TMR chip, a signal processing circuit, a signal generator, and a feedback coil. The TMR chip is arranged at an air gap of the magnetism gathering iron core and connected to the signal processing circuit. The signal processing circuit is connected to the signal generator. The feedback coil is wound around the magnetism gathering iron core and connected to the signal generator. The signal processing circuit is configured to select from the induced signal of the TMR chip and make an amplification to obtain a current signal component and send the current signal component to the signal generator. The signal generator is configured to adjust a current output to the feedback coil based on the current signal component, and output a measurement result of the selected current signal component.

Abstract: A serological detection system and a serological method of detecting a specific immunoglobulin (Ig) isotype against a target antigen in a sample, the serological detection system comprising: (a) a first probe having a first tag, the first probe having general binding affinity for all Ig having the same isotype as the specific Ig isotype in the sample, (b) a second probe having a second tag, the second probe being the target antigen of the specific Ig isotype in the sample, (c) a third tag, the third tag having binding affinity for the first tag and for the second tag so as to form a reporter complex in the presence of the specific IgG antibodies, and (d) a suitable substrate that generates an optically detectable signal in the presence of the reporter complex. In aspects, the serological detection system and the serological method are quantifiable.

Abstract: A system and method for detecting interactions between a first protein or fragment thereof (bait protein) and a second protein or fragment thereof (prey protein) comprising: (a) a bait construct comprising the bait protein, a first epitope tag and an intein N-terminal fragment (IN); and (b) a prey construct comprising the prey protein, a second epitope tag, and an intein C-terminal fragment (IC).

Abstract: Disclosed is a method for manufacturing a vertically-growing open carbon nanotube thin film. The method comprises: grinding the surface of a ceramic film by using metallographical sandpaper, performing ultrasonic cleaning by using acetone and performing boiling with water, and performing drying to obtain a ceramic film substrate; dissolving a catalyst ferrocene in a carbon source dimethylbenzene in an ultrasonic manner, and adding a carbon nanotube growth promoting agent thiophene to form a mixed solution; putting the ceramic film substrate in a tubular furnace reactor, introducing nitrogen, and slowly injecting the mixed solution at a constant speed to perform a high-temperature vapor deposition reaction; and further performing plasma etching and nitric acid reflux heating treatment to open closed ends of carbon nanotubes, and removing catalyst particles on the carbon nanotube thin film to obtain the open carbon nanotube thin film that is highly vertically aligned.

Abstract: This invention discloses a method for preparing an antibacterial and dust-removal membrane. The method comprises the following steps: depositing a layer of nano-ZnO on the immersed membrane surface as the seed crystal with the atomic layer deposition instrument (ALD instrument); vertically immersing the membrane covered with nano-ZnO layer in a hydrothermal reactor filled with crystal growth solution, heating it for a period of time, taking the membrane out and cooling it to the room temperate, and removing it from the substrate; finally, heating this membrane in a drier, and purging it with nitrogen to remove the paraffin within the membrane pore to obtain the porous membrane with nano-ZnO arrays growing on the surface.

Abstract: This invention discloses a method for preparing an antibacterial and dust-removal membrane. The method comprises the following steps: depositing a layer of nano-ZnO on the immersed membrane surface as the seed crystal with the atomic layer deposition instrument (ALD instrument); vertically immersing the membrane covered with nano-ZnO layer in a hydrothermal reactor filled with crystal growth solution, heating it for a period of time, taking the membrane out and cooling it to the room temperate, and removing it from the substrate; finally, heating this membrane in a drier, and purging it with nitrogen to remove the paraffin within the membrane pore to obtain the porous membrane with nano-ZnO arrays growing on the surface.

Abstract: Disclosed is a method for manufacturing a vertically-growing open carbon nanotube thin film. The method comprises: grinding the surface of a ceramic film by using metallographical sandpaper, performing ultrasonic cleaning by using acetone and performing boiling with water, and performing drying to obtain a ceramic film substrate; dissolving a catalyst ferrocene in a carbon source dimethylbenzene in an ultrasonic manner, and adding a carbon nanotube growth promoting agent thiophene to form a mixed solution; putting the ceramic film substrate in a tubular furnace reactor, introducing nitrogen, and slowly injecting the mixed solution at a constant speed to perform a high-temperature vapor deposition reaction; and further performing plasma etching and nitric acid reflux heating treatment to open closed ends of carbon nanotubes, and removing catalyst particles on the carbon nanotube thin film to obtain the open carbon nanotube thin film that is highly vertically aligned.

Abstract: A method, system, and computer program product are disclosed for performing RC extraction. The present approach can consider multiple types of manufacturing processes, and allows location-based prediction data to be used in the context of net-based analysis. RC extraction can be more accurately performed based upon net-specific top and bottom adjustments to thickness prediction that are location-based. The net-based prediction data can be used for other purposes as well, such as to perform electrical hotspot analysis, to visually display physical properties of the nets, or allow queries for other data analysis purposes.

Abstract: A method, system, and computer program product are disclosed for performing RC extraction from the perspective of the block level. A translation mechanism is employed to convert from a full-chip design domain to a block-level design domain. This allows model-based prediction results to be used in the early design implementation flow when parasitic RC and timing extractions are performed, where the model-based prediction results relate to predictions of manufacturing variations such as thickness and topography.

Abstract: A method, system, and computer program product are disclosed for performing RC extraction. The present approach can consider multiple types of manufacturing processes, and allows location-based prediction data to be used in the context of net-based analysis. RC extraction can be more accurately performed based upon net-specific top and bottom adjustments to thickness prediction that are location-based. The net-based prediction data can be used for other purposes as well, such as to perform electrical hotspot analysis, to visually display physical properties of the nets, or allow queries for other data analysis purposes.

Abstract: A method, system, and computer program product are disclosed for performing RC extraction from the perspective of the block level. A translation mechanism is employed to convert from a full-chip design domain to a block-level design domain. This allows model-based prediction results to be used in the early design implementation flow when parasitic RC and timing extractions are performed, where the model-based prediction results relate to predictions of manufacturing variations such as thickness and topography.

Abstract: A method of forming a pre-molded lead frame having increased stand-offs includes the steps of attaching a first tape to a first side of the lead frame and a second tape to a second side of the lead frame. The taped lead frame is placed in a mold and a first flow of mold compound is initiated. The first flow of the mold compound fills a space between the first tape and an upper mold chase of the mold. A second flow of the mold compound then is initiated. The second flow of the mold compound fills the spaces between a die pad and leads of the lead frame. The first and second tapes then are removed from the lead frame. Improved stand-offs are provided because the first tape was depressed by the first flow of the mold compound.

Abstract: A semiconductor package and method of forming the package, including a substrate having an opening formed therein. Contact pads are formed about a periphery of the opening on a first side of the substrate and a second opposing side of the substrate. A flip chip die is mounted to the substrate, having an active side mounted on a first side of the substrate and in electrical communication with at least some of the contact pads formed on the first side of the substrate. At least one wire bond die is mounted through the opening, with a non-active side mounted on the active side of the flip chip die. The wire bond die is in electrical communication with at least some of the plurality of contact pads formed on the second opposing side of the substrate.

Abstract: A method of forming a pre-molded lead frame having increased stand-offs includes the steps of attaching a first tape to a first side of the lead frame and a second tape to a second side of the lead frame. The taped lead frame is placed in a mold and a first flow of mold compound is initiated. The first flow of the mold compound fills a space between the first tape and an upper mold chase of the mold. A second flow of the mold compound then is initiated. The second flow of the mold compound fills the spaces between a die pad and leads of the lead frame. The first and second tapes then are removed from the lead frame. Improved stand-offs are provided because the first tape was depressed by the first flow of the mold compound.

Abstract: A semiconductor package (100, 150, 200, 250), and method of forming the package, including a substrate (102, 102?, 202, 202?) having an opening (104, 104?, 204, 204?) formed therein. Contact pads (112, 112?, 212, 212?) are formed about a periphery of the opening on a first side of the substrate (106, 106?, 206, 206?) and a second opposing side (132, 132?, 232, 232?) of the substrate. A flip chip die (120, 120?, 220, 220?) is mounted to the substrate, having an active side (114, 114?, 214, 214?) mounted on a first side of the substrate and in electrical communication with at least some of the contact pads formed on the first side of the substrate. At least one wire bond die (110, 110?, 210, 210?) is mounted through the opening, with a non-active side mounted on the active side of the flip chip die. The wire bond die is in electrical communication with at least some of the plurality of contact pads formed on the second opposing side of the substrate.