Abstract: The present invention discloses a built-in detection device and a detection method thereof for disposable diapers which relates to the technical field of intelligent diapers and includes a circuit substrate attached inside the diaper and an alarm module placed outside the diaper, wherein the circuit substrate is provided with a core circuit region, a temperature sensor, a urine-wet sensor group and a bioelectrogenesis module. The core circuit region includes a power management module, a data acquisition module and a wireless transmitting module. The data acquisition module is electrically connected to the power management module, the urine-wet sensor group, the wireless transmitting module, and the temperature sensor, respectively. The power management module is electrically connected to the bioelectrogenesis module. The wireless transmitting module is connected to the alarm module in wireless transmission.

Abstract: The invention includes a system and method of using a laser for singulation of a polymer resin mold compound substrate into packages or chips by a laser ablation process. A metal jig used for holding the substrate includes trenches to allow the laser beam to penetrate during cutting. Built-in piping allows water to circulate in a base around the jig to cool the substrate during cutting. The laser beam can pass through a cutting nozzle along with compressed gas or air to cool the substrate and remove debris. A pulsed laser beam can be used in the cutting process, so that a combination of passes at different speeds and laser parameters can be achieved. This allows single pass singulation of units at high speed.

Abstract: The present invention discloses a built-in detection device and a detection method thereof for disposable diapers which relates to the technical field of intelligent diapers and includes a circuit substrate attached inside the diaper and an alarm module placed outside the diaper, wherein the circuit substrate is provided with a core circuit region, a temperature sensor, a urine-wet sensor group and a bioelectrogenesis module. The core circuit region includes a power management module, a data acquisition module and a wireless transmitting module. The data acquisition module is electrically connected to the power management module, the urine-wet sensor group, the wireless transmitting module, and the temperature sensor, respectively. The power management module is electrically connected to the bioelectrogenesis module. The wireless transmitting module is connected to the alarm module in wireless transmission.

Abstract: A method for cutting a semiconductor wafer by generating a crack within the wafer, and a system thereof, are provided. The method comprises irradiating a laser beam towards a surface of the wafer and converging the laser beam to form a focal point so that a focal volume defined by the focal point and a boundary of the laser beam within the wafer is formed. Energy encompassed within the focal volume causes the wafer located at the periphery of the focal volume to contract faster than the wafer located within the focal volume, thereby generating a crack within the wafer.

Abstract: A secure memory system and a method of maintaining the security of memory contents. One embodiment of the system includes: (1) a security control module configured to transmit a system memory secure mode signal and processor secure mode signal to place the system in a secure mode, (2) a secure memory bridge coupled to the security control and system memory and configured to encrypt and decrypt data associated with the system memory based on a state of the system memory secure mode signal and (3) a boot processor coupled to the security control module and the secure memory bridge and configured to transmit requests to the secure memory bridge in the secure mode and an unsecure mode.

Abstract: A method for cutting a semiconductor wafer by generating a crack within the wafer, and a system thereof, are provided. The method comprises irradiating a laser beam towards a surface of the wafer and converging the laser beam to form a focal point so that a focal volume defined by the focal point and a boundary of the laser beam within the wafer is formed. Energy encompassed within the focal volume causes the wafer located at the periphery of the focal volume to contract faster than the wafer located within the focal volume, thereby generating a crack within the wafer.

Abstract: A secure memory system and a method of maintaining the security of memory contents. One embodiment of the system includes: (1) a security control module configured to transmit a system memory secure mode signal and processor secure mode signal to place the system in a secure mode, (2) a secure memory bridge coupled to the security control and system memory and configured to encrypt and decrypt data associated with the system memory based on a state of the system memory secure mode signal and (3) a boot processor coupled to the security control module and the secure memory bridge and configured to transmit requests to the secure memory bridge in the secure mode and an unsecure mode.

Abstract: Generally, methods and apparatus are provided for deriving an integrated circuit (IC) clock signal with a frequency that is offset from the IC system clock. An offset clock having a frequency that is offset from a system clock is generated by configuring a ring oscillator in a first mode to generate the system clock having a desired frequency; and adjusting the configuration of the ring oscillator in a second mode to generate the offset clock having the frequency that is offset from the system clock. The configuration of the ring oscillator is adjusted in the second mode by adjusting (i) a power supply value applied to the ring oscillator in the second mode relative to a power supply value applied in the first mode; or (ii) a number of delay line elements that are active in the ring oscillator loop.

Abstract: Generally, methods and apparatus are provided for deriving an integrated circuit (IC) clock signal with a frequency that is offset from the IC system clock. An offset clock having a frequency that is offset from a system clock is generated by configuring a ring oscillator in a first mode to generate the system clock having a desired frequency; and adjusting the configuration of the ring oscillator in a second mode to generate the offset clock having the frequency that is offset from the system clock. The configuration of the ring oscillator is adjusted in the second mode by adjusting (i) a power supply value applied to the ring oscillator in the second mode relative to a power supply value applied in the first mode; or (ii) a number of delay line elements that are active in the ring oscillator loop.