Patents by Inventor Zhu Bin

Zhu Bin has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240159865
    Abstract: A system is provided for measuring a power radiated pattern of an incident radio frequency (RF) signal indicating spatial distribution characteristics of a device under test (DUT). The system includes multiple antenna elements arranged in an array, where the antenna elements include antennas and diodes coupled to the antennas, respectively. Each antenna has a radar cross-section (RCS) that is too small for the antenna elements to operate in a reflect mode. Each diode is zero biased, such that the diodes receive the incident RF signal through the antennas to which the diodes are respectively coupled, and rectify the incident RF signal to DC voltages that are proportional to power of the incident RF signal, enabling the antenna elements to operate in a detect mode.
    Type: Application
    Filed: September 8, 2023
    Publication date: May 16, 2024
    Inventors: Zhu Wen, Xiong Bin Liao, Li Cao, Zi Quan Bai, Sheng Qi Zhang
  • Patent number: 11249110
    Abstract: Resistivity probes can be used to test integrated circuits. In one example, a resistivity probe has a substrate with multiple vias and multiple metal pins. Each of the metal pins is disposed in one of the vias. The metal pins extend out of the substrate. Interconnects provide an electrical connection to the metal pins. In another example, a resistivity probe has a substrate with a top surface and multiple elements extending from the substrate. Each of the elements curves from the substrate to a tip of the element such that each of the elements is non-parallel to the top surface of the substrate.
    Type: Grant
    Filed: November 10, 2019
    Date of Patent: February 15, 2022
    Assignee: KLA-Tencor Corporation
    Inventors: Walter H. Johnson, III, Nanchang Zhu, Xianghua Liu, Jianli Cui, Zhu-bin Shi, Zhuoxian Zhang, Haiyang You, Lu Yu, Jianou Shi, Fan Zhang
  • Patent number: 11001574
    Abstract: The present invention relates to a process for preparing lifitegrast or a salt thereof, wherein the process comprises hydrogenation of compound II in a mixture comprising at least one solvent selected from the group consisting of acetonitrile, a ketone solvent, an ester solvent and a mixture thereof, preferably acetonitrile.
    Type: Grant
    Filed: November 16, 2018
    Date of Patent: May 11, 2021
    Assignee: Medichem S.A.
    Inventors: Zhu Bin, Rao Lingxiang, Jordi Puig Serrano, Ernesto Durán López
  • Publication number: 20200369651
    Abstract: The present invention relates to a process for preparing lifitegrast or a salt thereof, wherein the process comprises hydrogenation of compound II in a mixture comprising at least one solvent selected from the group consisting of acetonitrile, a ketone solvent, an ester solvent and a mixture thereof, preferably acetonitrile.
    Type: Application
    Filed: November 16, 2018
    Publication date: November 26, 2020
    Inventors: Zhu BIN, Rao LINGXIANG, Jordi PUIG SERRANO, Ernesto DURÁN LÓPEZ
  • Publication number: 20200072869
    Abstract: Resistivity probes can be used to test integrated circuits. In one example, a resistivity probe has a substrate with multiple vias and multiple metal pins. Each of the metal pins is disposed in one of the vias. The metal pins extend out of the substrate. Interconnects provide an electrical connection to the metal pins. In another example, a resistivity probe has a substrate with a top surface and multiple elements extending from the substrate. Each of the elements curves from the substrate to a tip of the element such that each of the elements is non-parallel to the top surface of the substrate.
    Type: Application
    Filed: November 10, 2019
    Publication date: March 5, 2020
    Inventors: Walter H. Johnson, III, Nanchang Zhu, Xianghua Liu, Jianli Cui, Zhu-bin Shi, Zhuoxian Zhang, Haiyang You, Lu Yu, Jianou Shi, Fan Zhang
  • Patent number: 10514391
    Abstract: Resistivity probes can be used to test integrated circuits. In one example, a resistivity probe has a substrate with multiple vias and multiple metal pins. Each of the metal pins is disposed in one of the vias. The metal pins extend out of the substrate. Interconnects provide an electrical connection to the metal pins. In another example, a resistivity probe has a substrate with a top surface and multiple elements extending from the substrate. Each of the elements curves from the substrate to a tip of the element such that each of the elements is non-parallel to the top surface of the substrate.
    Type: Grant
    Filed: August 1, 2017
    Date of Patent: December 24, 2019
    Assignee: KLA-Tencor Corporation
    Inventors: Walter H. Johnson, III, Nanchang Zhu, Xianghua Liu, Jianli Cui, Zhu-bin Shi, Zhuoxian Zhang, Haiyang You, Lu Yu, Jianou Shi, Fan Zhang
  • Publication number: 20180052189
    Abstract: Resistivity probes can be used to test integrated circuits. In one example, a resistivity probe has a substrate with multiple vias and multiple metal pins. Each of the metal pins is disposed in one of the vias. The metal pins extend out of the substrate. Interconnects provide an electrical connection to the metal pins. In another example, a resistivity probe has a substrate with a top surface and multiple elements extending from the substrate. Each of the elements curves from the substrate to a tip of the element such that each of the elements is non-parallel to the top surface of the substrate.
    Type: Application
    Filed: August 1, 2017
    Publication date: February 22, 2018
    Inventors: Walter H. Johnson, III, Nanchang Zhu, Xianghua Liu, Jianli Cui, Zhu-bin Shi, Zhuoxian Zhang, Haiyang You, Lu Yu, Jianou Shi, Fan Zhang
  • Patent number: 9075695
    Abstract: According to an aspect of the present invention, there is provided a method, system, and computer program product for version conflict checking of installable units (IUs). The method includes receiving a request for version conflict checking of specified IU, the request including a version dependency relationship between IUs that are in a dependency relationship with the specified IU. A version dependency relationship between installed IUs is obtained. The version dependency relationship between the installed IUs is updated according to the version dependency relationships between the IUs that are in a dependency relationship with the specified IU. It is checked whether the specified IU has a version conflict with the updated version dependency relationship between the installed IUs.
    Type: Grant
    Filed: February 26, 2013
    Date of Patent: July 7, 2015
    Assignee: International Business Machines Corporation
    Inventors: Yang Pei, Zhen Zhang, Zhu Bin, Zhao Bing Han