Abstract: A method for maintaining equipment by remote operation and assistance, applied in an electronic device, obtains on-site information in response to a failure notification, and queries maintenance guidance information according to the on-site information. When the maintenance guidance information exists, the electronic device displays or plays the maintenance guidance information by Augmented Reality (AR) glasses, collects user operation data of a maintenance operation in real time, compares the user operation data with the maintenance guidance information, and prompts a user to correct a maintenance operation when a comparison indicates that a current repair or maintenance operation is erroneous. When the maintenance guidance information does not exist, the electronic device establishes a connection with a remote expert terminal by the AR glasses, and obtains real-time guidance from the remote expert terminal.

Abstract: A method for monitoring defects of a product implemented in an electronic device obtains product data in real time and determines whether a product is defective based on the product data; when the product is defective, outputting first warning information based on the number of defects of the product which satisfy a first preset condition; obtaining a rate of defects of the product every first preset time period, and outputting second warning information based on the rate of defects of the product when the rate of defects satisfies at least one of a second, third, and fourth preset conditions; when any warning information is output, analyzing distribution of the defects of the product; and predicting at least one cause of each defect of the product according to historical maintenance data of the product and a self-learning record of the electronic device.

Abstract: A method of estimating employee turnover rates obtains original employee data from a preset data source. First data processing is applied to the original employee data to obtain first processed employee data. A training set and a first verification set are selected from the first processed employee data. The training set is used to train a machine learning model to obtain a turnover estimation model. The first verification set is used to verify the turnover estimation model to obtain a first estimation result. The turnover estimation model is optimized according to the first estimation result to obtain an optimized turnover estimation model. Updated employee data and a corresponding employee turnover rate of a second time period are obtained. The method helps to replenish manpower in time and avoids over-recruitment.

Abstract: A circuit board detection method includes obtaining an input circuit board image, performing a detection on designated components of a circuit board in the circuit board image according to a preset detection method, determining whether a designated component in the circuit board image that fails the detection is allowed to shift within a preset angle range, and determining that the circuit board passes the detection when the designated component that fails the detection is allowed to shift within the preset angle range. The designated components include one or both of silkscreened components and non-silkscreened components.

Abstract: A method for adjusting furnace temperature of a reflow oven by AI, through obtaining product data of the reflow oven, obtaining initial characteristic data of a preceding work station and calculating mean values of temperatures of an upper furnace and a lower furnace, and taking the mean values as initial reflow characteristic data. Data as to first reflow characteristics of each reflow temperature zone and second reflow characteristics data of each zone are obtained, and data of the first and second reflow characteristics data are obtained. The electronic device further combines the characteristic data of the preceding work station with the combined reflow characteristics and combines results into a trained neural network model to output a temperature prediction, the oven temperature being adjusted according to the temperature prediction.

Abstract: A solder paste printing quality inspection (SPI) method includes establishing at least one data inspection model, acquiring real-time test data, preprocessing the real-time test data, and determining a type of the real-time test data and inputting the real-time test data into the data inspection model corresponding to the type of the real-time test data to obtain a judgment result of the solder paste printing quality inspection. The real-time test data includes one or both of a test image and a test value of solder paste printing quality inspection. The preprocessing includes obtaining key parameters of the test value or obtaining image data of the test image and standardizing the real-time test data.

Abstract: A circuit board testing device electrically coupled to a measurement gauge tests a circuit board. The circuit board testing device includes a processor configured to configure measurement parameters of the measurement gauge, configure measurement rules for testing the circuit board, confirm a circuit of the circuit board to be tested according to the record of test data, control the measurement gauge to test the circuit of the circuit board to be tested when the measurement gauge is electrically coupled to the circuit of the circuit board to be tested, receive measurement data returned by the measurement gauge, and analyze a faulty region of the circuit board according to the record of test data and the measurement data.

Abstract: A solder paste printing quality inspection (SPI) method includes establishing at least one data inspection model, acquiring real-time test data, preprocessing the real-time test data, and determining a type of the real-time test data and inputting the real-time test data into the data inspection model corresponding to the type of the real-time test data to obtain a judgment result of the solder paste printing quality inspection. The real-time test data includes one or both of a test image and a test value of solder paste printing quality inspection. The preprocessing includes obtaining key parameters of the test value or obtaining image data of the test image and standardizing the real-time test data.

Abstract: A circuit board testing device electrically coupled to a measurement gauge tests a circuit board. The circuit board testing device includes a processor configured to configure measurement parameters of the measurement gauge, configure measurement rules for testing the circuit board, confirm a circuit of the circuit board to be tested according to the record of test data, control the measurement gauge to test the circuit of the circuit board to be tested when the measurement gauge is electrically coupled to the circuit of the circuit board to be tested, receive measurement data returned by the measurement gauge, and analyze a faulty region of the circuit board according to the record of test data and the measurement data.