Patents by Inventor Ziehl-Neelsen L. Co

Ziehl-Neelsen L. Co has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 8409898
    Abstract: Assembly system for photovoltaic packages. According an embodiment, the present invention provides a system for assembling photovoltaic packages. The system includes a base plate member, which comprises a plurality of coupling elements. The plurality of coupling elements are characterized by a first length. The plurality of coupling elements is aligned according to a predetermined configuration. The plurality of coupling elements includes first and second coupling elements. The system also includes a top plate member, which includes a plurality of openings and a plurality of locator elements. The plurality of openings is characterized by a second length. The second length is greater than the first length. The openings and the locator elements are aligned according to the first predetermined configurations. The top plate member is disengageably coupled to the base plate member by the coupling elements and the openings.
    Type: Grant
    Filed: September 22, 2010
    Date of Patent: April 2, 2013
    Assignee: Solaria Corporation
    Inventors: Douglas R. Battaglia, Jr., Ziehl-Neelsen L. Co
  • Patent number: 7095103
    Abstract: A media card comprising a leadframe having first and second die pads, a plurality of contacts, and a plurality of conductive traces extending from respective ones of the contacts towards the first and second die pads. The second die pad is bent in a manner facilitating the formation of a cavity therein. Attached to the first die pad is a semiconductor die which is electrically connected to the leadframe. Disposed within the cavity and electrically connected to the leadframe is an electronic component. A body at least partially encapsulates the leadframe, the semiconductor die and the electronic component such that the contacts are exposed in the bottom surface defined by the body. The electronic component is shielded from radio frequency as a result of its receipt into the cavity defined by the second die pad of the lead frame.
    Type: Grant
    Filed: May 1, 2003
    Date of Patent: August 22, 2006
    Assignee: Amkor Technology, Inc.
    Inventors: Jeffrey Alan Miks, Curtis Michael Zwenger, Ziehl-Neelsen L. Co