Patents by Inventor Zih-Siang Huang

Zih-Siang Huang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11955298
    Abstract: A button module is provided. The button module comprises a base, a pressing part, and an elastic part. The pressing part includes a fixed end and a free end. The fixed end is pivotally connected to the base in a first axial direction. The elastic part is disposed on a side of the pressing part facing the base. The elastic part includes a first damping portion and a second damping portion selectively pressing against the base, where a hardness of the first damping portion is different from a hardness of the second damping portion.
    Type: Grant
    Filed: August 30, 2022
    Date of Patent: April 9, 2024
    Assignee: ASUSTEK COMPUTER INC.
    Inventors: Te-Wei Huang, Zih-Siang Huang, Jhih-Wei Rao, Hung-Chieh Wu, Liang-Jen Lin
  • Publication number: 20240008217
    Abstract: A thermal dissipation device for a handheld electronic device is provided. The thermal dissipation device includes a thermoelectric cooling chip, a temperature sensor, a humidity sensor, and a processing unit. The thermoelectric cooling chip has a cold surface and a hot surface. The cold surface is attached on a heating surface of the handheld electronic device by means of a heat conduction structure, and has a cold surface temperature. The temperature sensor and the humidity sensor are disposed in an area adjacent to the thermoelectric cooling chip for generating an environmental temperature and an environmental humidity respectively. The processing unit is configured to calculate a dew point temperature based on the environmental temperature and the environmental humidity; and determine whether to stop the thermoelectric cooling chip or not based on the cold surface temperature, the dew point temperature, and a heating surface temperature of the handheld electronic device.
    Type: Application
    Filed: January 20, 2023
    Publication date: January 4, 2024
    Inventors: Jyun-Miao HONG, Jhih-Wei RAO, Zih-Siang HUANG, Chieh LI, Chen-Yu HSU, Chih-Hsien YANG, Hung-Chieh WU, Liang-Jen LIN
  • Publication number: 20240008201
    Abstract: A thermal dissipation holder for a handheld electronic device is provided. The thermal dissipation holder includes a main structure, a movable element, an elastic element, and a locker. The main structure has a front surface and a rear surface. The movable element is movably connected to the main structure along a first direction and has a clamp portion at a side away from the carrier. One end of the elastic element is connected to the main structure. The other end of the elastic element is connected to the movable element. The elastic element drives the movable element to move along the first direction. The locker is disposed in the main structure and has a locking portion, where a position of the locking portion corresponds to that of the clamp portion, and the locker is selectively engaged with the clamp portion through the locking portion to lock the movable element.
    Type: Application
    Filed: January 13, 2023
    Publication date: January 4, 2024
    Inventors: Jhih-Wei RAO, Zih-Siang HUANG, Hung-Chieh WU, Liang-Jen LIN
  • Publication number: 20240008227
    Abstract: A heat dissipation holder applied to a handheld electronic device is provided. The heat dissipation holder includes a base, a cover, a heat dissipation module, and an air guiding structure. The base includes a first side and a second side that are opposite to each other and a front surface and a rear surface that are opposite to each other. The first side includes a first opening. The cover is combined onto the front surface to form an accommodating space with the base. The cover includes an air inlet region. The heat dissipation module is disposed in the accommodating space. The air guiding structure is disposed on the cover and extends to the first opening. The first opening, the air inlet region, and the air guiding structure form an airflow channel between the heat dissipation module and the cover.
    Type: Application
    Filed: January 13, 2023
    Publication date: January 4, 2024
    Inventors: Jhih-Wei RAO, Zih-Siang HUANG, Hung-Chieh WU, Liang-Jen LIN
  • Publication number: 20230223218
    Abstract: A button module is provided. The button module comprises a base, a pressing part, and an elastic part. The pressing part includes a fixed end and a free end. The fixed end is pivotally connected to the base in a first axial direction. The elastic part is disposed on a side of the pressing part facing the base. The elastic part includes a first damping portion and a second damping portion selectively pressing against the base, where a hardness of the first damping portion is different from a hardness of the second damping portion.
    Type: Application
    Filed: August 30, 2022
    Publication date: July 13, 2023
    Inventors: Te-Wei HUANG, Zih-Siang HUANG, Jhih-Wei RAO, Hung-Chieh WU, Liang-Jen LIN
  • Patent number: D884689
    Type: Grant
    Filed: September 27, 2018
    Date of Patent: May 19, 2020
    Assignee: ASUSTeK COMPUTER INC.
    Inventors: Chui-Hung Chen, Zih-Siang Huang, Hung-Chieh Wu, Liang-Jen Lin, Ching-Yuan Yang, Cheng-Han Chung, Chia-Min Cheng
  • Patent number: D888700
    Type: Grant
    Filed: August 17, 2018
    Date of Patent: June 30, 2020
    Assignee: ASUSTEK COMPUTER INC.
    Inventors: Zih-Siang Huang, Yan-Jhang Cheng, Liang-Jen Lin, Hung-Chieh Wu, Min-Chieh Yang, Chung-Wei Wu, Hsin-Hua Hsieh