Patents by Inventor Ziv Shmuely

Ziv Shmuely has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20110248745
    Abstract: According to various embodiments, a differential transmitter includes a driver and a predriver. In various embodiments, the predriver may include pull-up transistors and pull-down transistors configured in various ways to produce a staged output signal during a pull-up transition, wherein the higher bits of the input signal are switched slower in comparison with the lower bits of the input signal, while at the same time maintaining the simultaneous pull-down transition among all the bits. In various embodiments, the staged output of a predriver may further be dynamically disabled during a deemphasis exit transition. Other embodiments may be described and claimed.
    Type: Application
    Filed: April 7, 2010
    Publication date: October 13, 2011
    Inventors: Eugene Avner, Ofer Ginzberg, Ziv Shmuely
  • Patent number: 8030968
    Abstract: According to various embodiments, a differential transmitter includes a driver and a predriver. In various embodiments, the predriver may include pull-up transistors and pull-down transistors configured in various ways to produce a staged output signal during a pull-up transition, wherein the higher bits of the input signal are switched slower in comparison with the lower bits of the input signal, while at the same time maintaining the simultaneous pull-down transition among all the bits. In various embodiments, the staged output of a predriver may further be dynamically disabled during a deemphasis exit transition. Other embodiments may be described and claimed.
    Type: Grant
    Filed: April 7, 2010
    Date of Patent: October 4, 2011
    Assignee: Intel Corporation
    Inventors: Eugene Avner, Ofer Ginzberg, Ziv Shmuely
  • Patent number: 7504856
    Abstract: Methods and systems provide for a semiconductor die that is compatible with a wide variety of industry standard sockets, where each type of socket is identified by a different pin map. In one embodiment, the die has a plurality of signal lines, one or more surface contacts and one or more signal selectors coupled to the signal lines and the surface contacts. Each signal selector electrically connects one of the signal lines to one of the surface contacts based on a programming signal. In a particularl embodiment, each signal selector includes a multiplexer and a fuse element, where the multiplexer routes one of its input ports to its output port based on a programming value of the fuse element. The programming value can be set by the programming signal.
    Type: Grant
    Filed: May 7, 2007
    Date of Patent: March 17, 2009
    Assignee: Intel Corporation
    Inventors: Tsvika Kurts, Alex Waizman, Marcelo Yuffe, Ziv Shmuely
  • Publication number: 20070285123
    Abstract: Methods and systems provide for a semiconductor die that is compatible with a wide variety of industry standard sockets, where each type of socket is identified by a different pin map. In one embodiment, the die has a plurality of signal lines, one or more surface contacts and one or more signal selectors coupled to the signal lines and the surface contacts. Each signal selector electrically connects one of the signal lines to one of the surface contacts based on a programming signal. In a particularl embodiment, each signal selector includes a multiplexer and a fuse element, where the multiplexer routes one of its input ports to its output port based on a programming value of the fuse element. The programming value can be set by the programming signal.
    Type: Application
    Filed: May 7, 2007
    Publication date: December 13, 2007
    Applicant: INTEL CORPORATION
    Inventors: Tsvika Kurts, Alex Waizman, Marcelo Yuffe, Ziv Shmuely
  • Patent number: 7230450
    Abstract: Methods and systems provide for a semiconductor die that is compatible with a wide variety of industry standard sockets, where each type of socket is identified by a different pin map. In one embodiment, the die has a plurality of signal lines, one or more surface contacts and one or more signal selectors coupled to the signal lines and the surface contacts. Each signal selector electrically connects one of the signal lines to one of the surface contacts based on a programming signal. In a particularl embodiment, each signal selector includes a multiplexer and a fuse element, where the multiplexer routes one of its input ports to its output port based on a programming value of the fuse element. The programming value can be set by the programming signal.
    Type: Grant
    Filed: May 18, 2004
    Date of Patent: June 12, 2007
    Assignee: Intel Corporation
    Inventors: Tsvika Kurts, Alex Waizman, Marcelo Yuffe, Ziv Shmuely
  • Publication number: 20050258861
    Abstract: Methods and systems provide for a semiconductor die that is compatible with a wide variety of industry standard sockets, where each type of socket is identified by a different pin map. In one embodiment, the die has a plurality of signal lines, one or more surface contacts and one or more signal selectors coupled to the signal lines and the surface contacts. Each signal selector electrically connects one of the signal lines to one of the surface contacts based on a programming signal. In a particularl embodiment, each signal selector includes a multiplexer and a fuse element, where the multiplexer routes one of its input ports to its output port based on a programming value of the fuse element. The programming value can be set by the programming signal.
    Type: Application
    Filed: May 18, 2004
    Publication date: November 24, 2005
    Inventors: Tsvika Kurts, Alex Waizman, Marcelo Yuffe, Ziv Shmuely