Abstract: Described herein are methods and systems for the optical imaging of a physical specimen of interest that is in contact with, or in close proximity to, the backplane of a high refractive index solid-immersion lens (SIL), wherein the specimen comprises features of interest that act as a local high-refractive index regions. The SIL lens preferably comprises fiducial markers.

Abstract: Described herein are methods and systems for the optical imaging of a physical specimen of interest that is in contact with, or in close proximity to, the backplane of a high refractive index solid-immersion lens (SIL), wherein the specimen comprises features of interest that act as a local high-refractive index regions. The SIL lens preferably comprises fiducial markers.

Abstract: An optical imaging system with microlens array with integral structure includes a microlens array having a back surface for depositing sample material to be imaged and one or more microlenses on a front surface. At least one of the one or more microlenses are aligned to the deposited sample material. A plate is attached to the microlens array. A microscope objective is positioned proximate to the plurality of microlenses.

Abstract: An optical imaging system with microlens array with integral structure includes a microlens array having a back surface for depositing sample material to be imaged and one or more microlenses on a front surface. At least one of the one or more microlenses are aligned to the deposited sample material. A plate is attached to the microlens array. A microscope objective is positioned proximate to the plurality of microlenses.

Abstract: A fluidic super resolution optical imaging system includes a microlens array chip comprising at least one lenslet on a first surface. An objective lens is positioned proximate to the at least one lenslet. A fluid jet is positioned proximate to a second surface of the microlens array that flows at least one of a fluid comprising a material to be imaged or a material that enables imaging of a second material through a focal area of the objective lens and the at least one lenslet.

Abstract: A sub-millimeter solid immersion lens (SIL), comprises a body of a high-index material transparent to electromagnetic radiation in a frequency band to be observed, the body having a flat bottom surface which receives an object to be observed, and the body further having a first upper surface whose limits approximate a zone of a spherical segment and a second upper surface defined by an upper bound of the zone of the spherical segment which prevents passage of electromagnetic radiation in the frequency band to be observed. The SIL may be incorporated into an array, according to other aspects.

Abstract: A sub-millimeter solid immersion lens (SIL), comprises a body of a high-index material transparent to electromagnetic radiation in a frequency band to be observed, the body having a flat bottom surface which receives an object to be observed, and the body further having a first upper surface whose limits approximate a zone of a spherical segment and a second upper surface defined by an upper bound of the zone of the spherical segment which prevents passage of electromagnetic radiation in the frequency band to be observed. The SIL may be incorporated into an array, according to other aspects.

Abstract: A technique for creating alignment feature in mass transported substrates yields alignment features that can be located with high degrees of accuracy. Specifically, structures such as concave or convex lenses are created that yield a light pattern in transmission or reflection when the part of the substrate is imaged or a plane near the substrate is imaged. This light pattern is then used to align the substrate during subsequent lithography or packaging processes.

Abstract: In bonding a first crystalline semiconductor substrate to a second crystalline semiconductor substrate, a liquid is applied to a first surface of the first substrate and to a first surface of the second substrate to wet both substrate first surfaces. The first surface of the first substrate is brought together with the first surface of the second substrate while the liquid substantially remains on both first surfaces, and then the liquid is evaporated from the substrate first surfaces, while the substrate first faces are together, at an evaporation temperature that is below the boiling point of the liquid at ambient pressure. The substrates are then heat treated at a temperature above the evaporation temperature. Surface channels can be formed in a first surface of at least one of the first and second substrates, and during the heat treatment, a crystal growth promotion vapor can be supplied to the substrates.

Abstract: A technique for creating alignment feature in mass transported substrates yields alignment features that can be located with high degrees of accuracy. Specifically, structures such as concave or convex lenses are created that yield a light pattern in transmission or reflection when the part of the substrate is imaged or a plane near the substrate is imaged. This light pattern is then used to align the substrate during subsequent lithography or packaging processes.

Abstract: An apparatus and method for creating a supply of group V vapor required for various material processing applications such as crystal growth or the mass transport process, when applied to III-V materials (e.g., GaP) comprises a stable source of group V material (e.g., a GaP wafer), a process tube, and inner tube, a three-zone furnace incorporating a cold trap zone for the group III material, and a “loose” plug for the process tube. The phosphorus vapor is generated by using a source GaP wafer placed at a higher temperature than that of the main process wafer in the mass transport process. When high phosphorous vapor concentration is desired, other solid sources such as InP or red P can be used. To minimize vapor loss to the ambient, both wafers are enclosed in a quartz tube equipped with a quartz plug. However, the source wafer generates not only phosphorus but also gallium vapor. The latter interferes with mass transport and needs to be filtered out.

Abstract: A smooth contoured structure is formed from a planar surface by etching mesas of equal height into the surface and heat treating the structure to mass transport material above the desired contour to fill in voids below the desired contour. In an alternate embodiment, an optical element is formed using a patterned layer of sacrificial material and thermally treating the sacrificial layer to form a precursor contour line. The line is then transformed onto a substrate and smoothed to form the optical element.

Abstract: In an apparatus and method for aligning a microlens relative to an edge-emitting semiconductor laser, the components are aligned and coupled without the need for intermediate optics. An edge-emitting semiconductor laser is mounted to a support body which preferably operates as a heat sink. The support body has a side face, which is substantially parallel by the emitting face of the laser. The microlens is formed on a lens substrate. The lens substrate is mounted adjacent the emitting face of the laser and further mounted adjacent the side face of the support body such that the optical axis of the lens substantially aligns with the optical axis of the laser. A substantial portion of the lens substrate extends along the plane of the side face of the support body. The invention has applications in coupling high-power laser energy into fiber optics and in optical computing devices requiring arrays of lasers.

Abstract: A smooth contoured structure is formed from a planar surface by etching mesas of equal height into the surface and heat treating the structure to mass transport material above the desired contour to fill in voids below the desired contour. In an alternate embodiment, an optical element is formed using a patterned layer of sacrificial material and thermally treating the sacrificial layer to form a precursor contour line. The line is then transformed onto a substrate and smoothed to form the optical element.

Abstract: A method and apparatus for forming a monolithic surface emitting laser diode array by providing vertical partly light transmissive mirror surfaces opposite parabolic light reflective mirror surfaces formed adjacent the active buried layer of a heterostructure diode laser. The mirror surfaces are preferably formed using a mass-transport heating process. Other mirror shapes may be formed in accordance with the invention.

Abstract: A surface emitting laser is described with a monolithic integrated lens formed in one side of an optical semiconductor substrate aligned with a parabolic light reflective mirror surface formed adjacent an edge emitting laser formed on, or in, the other side of the substrate. An optional optical feedback spherical mirror is formed concentric to the lens.

Abstract: A method and apparatus for forming a monolithic surface emitting laser diode array by providing vertical partly light transmissive mirror surfaces opposite parabolic light reflective mirror surfaces formed adjacent the active buried layer of a heterostructure diode laser. The mirror surfaces are preferably formed using a mass-transport heating process. Other mirror shapes may be formed in accordance with the invention.

Abstract: A method and apparatus for forming a monolithic surface emitting laser diode array by providing vertical partly light transmissive mirror surfaces opposite parabolic light reflective mirror surfaces formed adjacent the active buried layer of a heterostructure diode laser. The mirror surfaces are preferably formed using a mass-transport heating process. Other mirror shapes may be formed in accordance with the invention.

Abstract: A distributed feedback (DFB) type laser and a method and apparatus for forming same wherein a quaternary semiconductor active lasing strip of material is buried between a substrate of binary compound of one type conductivity material and a mesa binary compound body of opposite type conductivity and a periodic grating structure is etched into the plateau of the mesa. In one embodiment, ohmic contacts are provided on either side of the grating structure and the mesa is undercut adjacent the active strip to partly isolate the ohmic contacts from the homojunction formed when the active strip is buried, preferably using a mass-transport process. In another embodiment, the ohmic contacts are formed on the top of a deeply etched grating structure. A buried layer double heterostructure (DH) laser is also described with DFB grating formed on the side walls of the layer. Additionally, a surface emitting diode laser with DFB is described.

Abstract: A distributed feedback (DFB) type laser and a method and apparatus for forming same wherein a quaternary semiconductor active lasing strip of material is buried between a substrate of binary compound of one type conductivity material and a mesa binary compound body of opposite type conductivity and a periodic grating structure is etched into the plateau of the mesa. In one embodiment, ohmic contacts are provided on either side of the grating structure and the mesa is undercut adjacent the active strip to partly isolate the ohmic contacts from the homojunction formed when the active strip is buried, preferably using a mass-transport process. In another embodiment, the ohmic contacts are formed on the top of a deeply etched grating structure. A buried layer double heterostructure (DH) laser is also described with DFB grating formed on the side wallsGOVERNMENT SUPPORTThe Government has rights in this invention pursuant to Contract No. F19628-85C-0002, awarded by the Department of the Air Force.