Abstract: A method for manufacturing a semiconductor device includes: providing a wafer-bonding stack structure having a sidewall layer and an exposed first component layer; forming a photoresist layer on the first component layer; performing an edge trimming process to at least remove the sidewall layer; and removing the photoresist layer. In this way, contaminant particles generated from the blade during the edge trimming process may fall on the photoresist layer but not fall on the first component layer, so as to protect the first component layer from being contaminated.

Abstract: A gold finger connector and a memory storage device are disclosed. The gold finger connector includes: a connector body, a pin carrier, a plurality of first pins, a plurality of second pins, and at least one signal shielding structure. The pin carrier is protruded out of the connector body. The first pins are disposed on a first surface of the pin carrier. The second pins are disposed on the first surface and at least partially staggered with the first pins. The at least one signal shielding structure is disposed on the pin carrier and configured to conduct at least one target pin in the second pins to at least one ground layer.

Abstract: Provided is a method for treating cancer by administering to a subject in need thereof with a pharmaceutical composition including a benzenesulfonamide derivative in combination with a cancer immunotherapeutic agent such as the immune check point inhibitor (ICI).

Abstract: A method for manufacturing a semiconductor device includes: providing a wafer-bonding stack structure having a sidewall layer and an exposed first component layer; forming a photoresist layer on the first component layer; performing an edge trimming process to at least remove the sidewall layer; and removing the photoresist layer. In this way, contaminant particles generated from the blade during the edge trimming process may fall on the photoresist layer but not fall on the first component layer, so as to protect the first component layer from being contaminated.

Abstract: A fiber waveguide optical subassembly uses the multi-mode fiber to increase the alignment tolerance between the active optical element and the waveguide. The filter is thinner to lower the dispersion due to the optical coupling gap. The subassembly further combines the optical bench to achieve passive positioning. Therefore it reduces the cost and enhances the transmission rate.

Abstract: The eject-lever apparatus of the present invention is arranged in an optical transceiver having a substrate, where the optical transceiver is being received in a housing having a slot arranged therein with the substrate being plugged into the slot, the apparatus comprising: at least a lever having a cam arranged therein, being disposed at the receiving end of the optic fiber of the optical transceiver; and at least a linkage rod, being deposed on a side of the optical transceiver, wherein the lever is actuated to rotate about an axis from a first location thereof to a second position thereof by exerting a force thereon while driving the cam to rotate accordingly for transmitting the force to an end of the linkage rod enabling the linkage rod to exert a force on the housing so as to generate a reacting force acting on the lever and thus cause the optical transceiver to move out to compress an elastic body and be ejected from the slot gradually; finally, the substrate is totally released from the slot for freei

Abstract: The eject-lever apparatus of the present invention is arranged in an optical transceiver having a substrate, where the optical transceiver is being received in a housing having a slot arranged therein with the substrate being plugged into the slot, the apparatus comprising: at least a lever having a cam arranged therein, being disposed at the receiving end of the optic fiber of the optical transceiver; and at least a linkage rod, being deposed on a side of the optical transceiver, wherein the lever is actuated to rotate about an axis from a first location thereof to a second position thereof by exerting a force thereon while driving the cam to rotate accordingly for transmitting the force to an end of the linkage rod enabling the linkage rod to exert a force on the housing so as to generate a reacting force acting on the lever and thus cause the optical transceiver to move out to compress an elastic body and be ejected from the slot gradually; finally, the substrate is totally released from the slot for freei

Abstract: A fiber waveguide optical subassembly uses the multi-mode fiber to increase the alignment tolerance between the active optical element and the waveguide. The filter is thinner to lower the dispersion due to the optical coupling gap. The subassembly further combines the optical bench to achieve passive positioning. Therefore it reduces the cost and enhances the transmission rate.