Abstract: A method of forming a film is described. The method begins by forming a mixture including a polymer and a plurality of unordered nanomaterial. The film is dried and a plurality of pores is formed within the film. A sensitive film transducer capable of detecting changes in pressure and applied force can be made using this method.

Abstract: A method of producing a titanium dioxide film with dopant uniformly dispersed throughout the entirety of the film The method involves deposition of dopant, concurrently or sequentially, with titanium before oxidation of the titanium. No separate doping step is required in this invention since the doping step occurs in-situ during oxidation process. The amount of dopant incorporated into a titanium dioxide film is controllable by varying the thickness and/or number of dopant layers deposited. Furthermore, dispersion of dopant throughout the titanium dioxide film is more uniform in this invention as multiple layers of dopant may be employed.

Abstract: A method of forming a film is described. The method begins by forming a mixture including a polymer and a plurality of unordered nanomaterial. The film is dried and a plurality of pores is formed within the film. A sensitive film transducer capable of detecting changes in pressure and applied force can be made using this method.

Abstract: A method of constructing an electrical contact on an electronic component comprises first forming a protruding electrically conducting stud at a contact location by wire bonding a metal wire to a contact pad of the component. The stud is then contacted with solder, without using a mask, so that a solder bump is deposited on and adheres to the metal stud to form a composite solder contact which is able to form with a contact of another component a solder joint which has good electrical and mechanical properties and which may be reliable fabricated at high density by a low cost method. An electronic component provided with such solder contacts and an electronics component package including such a component are also disclosed.

Abstract: A method of constructing an electrical contact on an electronic component comprises first forming a protruding electrically conducting stud at a contact location by wire bonding a metal wire to a contact pad of the component. The stud is then contacted with solder, without using a mask, so that a solder bump is deposited on and adheres to the metal stud to form a composite solder contact which is able to form with a contact of another component a solder joint which has good electrical and mechanical properties and which may be reliable fabricated at high density by a low cost method. An electronic component provided with such solder contacts and an electronics component package including such a component are also disclosed.