Internal/external circuit board connection structure
A circuit board structure includes a first circuit board, a second circuit board and a plurality of first connection portions. The first circuit board has a first opening, and the second circuit board is disposed inside the first opening of the first circuit board. The first circuit board and the second circuit board are electrically independent from each other. The first connection portions are connected to the first circuit board and the second circuit board.
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This application claims the priority benefit of China application no. 201610674438.7, filed on Aug. 16, 2016. The entirety of the above-mentioned patent application is hereby incorporated by reference herein and made a part of this specification.
BACKGROUNDField of the Invention
The invention is directed to a circuit board structure and more particularly, to a circuit board with preferable economic efficiency.
Description of Related Art
Generally, a shape and device configuration of a circuit board of an electronic apparatus has to be adaptively adjusted according to a containing space planned for the electron apparatus in compliance with safety regulations. In other words, when the containing space of the electronic apparatus is limited, or in order to comply with the safety regulations, a designer needs to perform an operation, such as chamfering, punching or holing, on the circuit board, and thus, there are waste materials generated. Therefore, it is an important object to provide the circuit board for reducing the generation of the waste materials to conform to the recent environmental awareness and meet economic efficiency.
SUMMARYThe invention provides a circuit board structure capable of effectively reducing generation of waste of circuit boards and having better economic efficiency.
A circuit board structure of the invention includes a first circuit board, a second circuit board and a plurality of first connection portions. The first circuit board has a first opening, and the second circuit board is disposed inside the first opening of the first circuit board. The first circuit board and the second circuit board are electrically independent from each other. The first connection portions are connected to the first circuit board and the second circuit board.
In an embodiment of the invention, the circuit board structure further includes: a mainboard and a plurality of second connection portions. The mainboard has a second opening, and the first circuit board and the second circuit board are disposed inside the second opening. The second connection portions are connected to the mainboard and the first circuit board.
In an embodiment of the invention, the mainboard, the first circuit board and the second circuit board are located on a same plane.
In an embodiment of the invention, the first circuit board includes a plurality of first pads separated from one another, and the second circuit board includes a plurality of second pads separated from one another. The first pads are located on a first side surface of the first circuit board relatively far away from the second circuit board, and the second pads are located on a second side surface of the second circuit board relatively adjacent to the first circuit board.
In an embodiment of the invention, the first connection portions and the second pads are misaligned, and the second connection portions and the first pads are misaligned.
In an embodiment of the invention, the first circuit board further includes a plurality of first lines, and the second circuit board further includes a plurality of second lines. The first lines are connected to part of the first pads, and the second lines are connected to part of the second pads.
In an embodiment of the invention, the circuit board structure further includes: an insulation layer at least disposed on the first circuit board, the second circuit board and the first connection portions. The insulation layer at least covers the first lines, the second lines and the first connection portions and exposes the first pads and the second pads.
In an embodiment of the invention, the insulation layer further covers a first outer surface of each of the first pads.
In an embodiment of the invention, the insulation layer further covers a second outer surface of each of the second pads.
In an embodiment of the invention, contour outlines of the first circuit board and the second circuit board include a circular or a polygon shape.
To sum up, the circuit board structure of the invention has the first circuit board and the second circuit board that are electrically independent from each other, and the second circuit board is disposed inside the first opening of the first circuit board. Namely, in the invention, a waste region (i.e., the first opening) of the first circuit board is sufficiently utilized and planned to serve as the second circuit board. Thereby, in the circuit board structure of the invention, the generation of waste materials and product material cost can be effectively reduced, and the first circuit board can be sufficiently utilized to achieve the preferable economic efficiency.
To make the above features and advantages of the invention more comprehensible, embodiments accompanied with drawings are described in detail below.
The accompanying drawings are included to provide a further understanding of the invention, and are incorporated in and constitute a part of this specification. The drawings illustrate embodiments of the invention and, together with the description, serve to explain the principles of the invention.
Specifically, as illustrated in
The circuit board structure 100a of the present embodiment has the first circuit board 110a and the second circuit board 120a that are electrically independent from each other, and the second circuit board 120a is disposed inside the first opening 112a of the first circuit board 110a. Namely, a waste region (i.e., the first opening 112a) of the first circuit board 110a is sufficiently utilized and planned to serve as the second circuit board 120a in the present embodiment. Thereby, in the circuit board structure 100a of the present embodiment, the generation of waste materials and product material cost can be effectively reduced, and the first circuit board 110a can be sufficiently utilized to achieve the preferable economic efficiency.
It should be noted that the reference numerals and a part of the contents in the previous embodiment are used in the following embodiments, in which identical reference numerals indicate identical or similar components, and repeated description of the same technical contents is omitted. For a detailed description of the omitted parts, reference can be found in the previous embodiment, and no repeated description is contained in the following embodiments.
Specifically, referring to
Furthermore, referring to
Additionally, the first circuit board 110b of the present embodiment further includes a plurality of first lines 116b, and the second circuit board 120b further includes a plurality of second lines 126b. The first lines 116b are connected to part of the first pads 114b, and the second lines 126b are connected to part of the first pads 124b. In this circumstance, the first circuit board 110b may be electrically connected to a first external circuit (not shown) through the first pads 114b and the second circuit board 120b may be electrically connected to a second external circuit (not shown) through the second pads 124b for electric signal transmission.
Briefly speaking, in the circuit board structure 100b of the present embodiment, at least the first circuit board 110b and the second circuit board 120b which are electrically independent from each other are disposed inside the second opening 142 of the mainboard 140, and the second circuit board 120b is disposed inside the first opening 112b of the first circuit board 110b. Namely, a waste region (i.e., the first opening 112b) of the first circuit board 110b is sufficiently utilized and planned to serve as the second circuit board 120b in the present embodiment. Thereby, in the circuit board structure 100b of the present embodiment, the generation of waste materials and product material cost can be effectively reduced, and the first circuit board 110b can be sufficiently utilized to achieve the preferable economic efficiency.
In the present embodiment, the circuit board structure 100c is disposed with the insulation layer 160c, such that the first lines 116b and the second lines 126b on the first circuit board 110b and the second circuit board 120b can be protected, and the first pads 114b and the second pads 124b exposed by the insulation layer 160c serve for being connected with an external circuit (not shown). Certainly, the invention is not intent to limit the configuration relation of the insulation layer 160c.
In other embodiments, referring to
It should be noted that in other embodiments that are not shown, persons skilled in the art may plan and serve the west region of the circuit board as another small circuit based on actual demands with reference to the description with respect to the embodiments above, thereby mitigating the waste material issue of the circuit, so as to achieve the preferable economic efficiency.
Based on the above, the circuit board structure of the invention has the first circuit board and the second circuit board that are electrically independent from each other, and the second circuit board is disposed inside the first opening of the first circuit board. Namely, in the invention, the waste region (i.e., the first opening) of the first circuit board is sufficiently utilized and planned to serve as the second circuit board. In the circuit board structure of the invention, the generation of waste materials and the product material cost, and the first circuit board can be sufficiently utilized to achieve the preferable economic efficiency.
Although the invention has been disclosed by the above embodiments, they are not intended to limit the invention. It will be apparent to one of ordinary skill in the art that modifications and variations to the invention may be made without departing from the spirit and scope of the invention. Therefore, the scope of the invention will be defined by the appended claims.
Claims
1. A circuit board structure, comprising:
- a first circuit board, having a first opening;
- a second circuit board, disposed inside the first opening of the first circuit board, and the first circuit board and the second circuit board being electrically independent from each other;
- a plurality of first connection portions, connected to the first circuit board and the second circuit board;
- a mainboard, having a second opening, and the first circuit board and the second circuit board being disposed inside the second opening; and
- a plurality of second connection portions, connected to the mainboard and the first circuit board, wherein the first circuit board comprises a plurality of first pads separated from one another, the second circuit board comprises a plurality of second pads separated from one another, the first pads are located on a first side surface of the first circuit board relatively far away from the second circuit board, and the second pads are located on a second side surface of the second circuit board relatively adjacent to the first circuit board,
- wherein the first connection portions and the second pads are misaligned, and the second connection portions and the first pads are misaligned.
2. The circuit board structure as recited in claim 1, wherein contour outlines of the first circuit board and the second circuit board comprise a circular or a polygon shape.
3. The circuit board structure as recited in claim 1, wherein the mainboard, the first circuit board and the second circuit board are located on a same plane.
4. The circuit board structure as recited in claim 1, wherein the first circuit board further comprises a plurality of first lines, the second circuit board further comprises a plurality of second lines, the first lines are connected to part of the first pads, and the second lines are connected to part of the second pads.
5. The circuit board structure as recited in claim 4, further comprising:
- an insulation layer, at least disposed on the first circuit board, the second circuit board and the first connection portions, wherein the insulation layer at least covers the first lines, the second lines and the first connection portions and exposes the first pads and the second pads.
6. The circuit board structure as recited in claim 5, wherein the insulation layer further covers a first outer surface of each of the first pads.
7. The circuit board structure as recited in claim 6, wherein the insulation layer further covers a second outer surface of each of the second pads.
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Type: Grant
Filed: Sep 14, 2016
Date of Patent: Jul 24, 2018
Patent Publication Number: 20180054893
Assignees: LITE-ON ELECTRONICS (GUANGZHOU) LIMITED (Guangzhou), Lite-On Technology Corporation (Taipei)
Inventors: Yi-Hsun Lee (Taipei), Chun-Lung Ho (Taipei), Wu-Chen Lin (Taipei)
Primary Examiner: Dimary Lopez Cruz
Assistant Examiner: Muhammed Azam
Application Number: 15/264,613
International Classification: H05K 1/14 (20060101); H05K 1/11 (20060101);