Method for selective electroless attachment of contacts to electrochemically-active molecules
A solution-based method for attaching metal contacts to molecular films is described. The metal contacts are attached to functional groups on individual molecules in the molecular film. The chemical state of the functional group is controlled to induce electroless metal deposition preferentially at the functional group site. The functionalized molecules may also be patterned on a surface to give spatial control over the location of the metal contacts in a more complex structure. Spatial control is limited only by the ability to pattern the molecular film. To demonstrate the feasibility of this concept, self-assembled monolayers of model, molecular-electronic compounds have been prepared on gold surfaces, and these surfaces were subsequently exposed to electroless deposition plating baths. These samples exhibited selective metal contact attachment, even on patterned surfaces.
This application is a divisional of U.S. patent application Ser. No. 10/246,148, entitled “Selective Electroless Attachment of Contacts to Electrochemically-Active Molecules,” filed Sep. 17, 2002 by Christopher Zangmeister and Roger Van Zee, which was based upon and claims the benefit of U.S. provisional application No. 60/359,623, entitled “Selective Electroless Attachment Of Contacts To Electrochemically-Active Molecules”, filed Feb. 26, 2002, the entire disclosure of which is herein specifically incorporated by reference for all that they disclose and teach.
BACKGROUND OF THE INVENTION1. Field of the Invention
The present invention generally pertains to molecular electronics and more specifically to the formation of metal contacts connected to molecules and molecular films.
2. Description of the Background
Nearly all modern electronic devices are based on the complementary metal-oxide-silicon field-effect transistors (CMOS-FET). Manufacturing improvements of solid-state devices, such as the CMOS-FET, have nearly doubled computing powers every eighteen months for the past thirty years. These improvements are a direct result of the miniaturization of devices used in computer processors. Unfortunately, CMOS technology is beginning to show limits associated with the fundamental physical laws governing device performance and technical problems associated with manufacturing. Thus, alternative technologies are being sought which are unlike FET devices that operate based upon the movement of electrons in bulk material. These new technologies operate in the realm of quantum mechanical phenomena that emerge and dictate electron dynamics at the nanometer (10−9 m) scale.
A specific area that has shown considerable promise in the miniaturization of computer processor devices is a component technology that uses individual molecules or arrays of molecules, that is termed molecular electronics. This relatively new approach exploits the fact that molecules are naturally occurring nanometric structures. By devising molecular structures to act as electrical switches, then by combining these switches into complex circuit structures, computational nanocircuitry can be achieved. In this manner, conductive electrodes are attached to a molecule within a layer of molecules, and thus the layer may perform functions in an analogous fashion to a solid-state device. The application of molecular electronics greatly reduces the scale of individual devices to nanometers per device; therefore, more than a billion devices may be contained per square centimeter.
A typical molecular electronic device is composed of two or more contacts (sometimes called gates or terminals) and a molecular film or a molecule that is attached to these contacts. The fabrication procedure involves forming a molecular film (MF), which can be as thin as one molecular layer, on one contact. Additional contacts are then attached to the molecule. These devices function by modulating electron flow between the contacts through the MF. The flow of current through the molecule and performance of the device are specifically dependent upon the chemical and molecular structure of the molecule and the strength of the interaction between the molecular layer and each of the contacts. In most cases, the first contact formed in these devices is a covalent chemical bond formed in solution. The second contact must be formed on top of the MF.
In order for the molecular electronic device to function properly, each of the contacts must be electrically isolated from one another. Achieving this isolation is complicated by the length scale between contacts, which is defined by the length of the molecule (1 nm-5 nm). To ensure electrical isolation, and long-term performance of the device, a strong interaction between the metal contacts and the MF is required. Additionally, this strong interaction between the molecule and the contacts eliminates some unwanted device characteristics (e.g. device shorting).
Presently, metal contacts in molecular electronic devices are formed by evaporating a metal layer to the surface-bound MFs. This technique is performed within a vacuum chamber and is called vapor deposition. The interaction between the evaporated metal layer and the molecule is highly dependent on the metal and the chemical composition of the MF. This interaction between the metal and a MF may be changed through the introduction of a functional group to the molecular structure. For example, amine or carboxylic acid functional groups decrease the extent of metal penetration through a MF when metal contacts are grown on top of the monolayer by evaporation that can cause degradation or shorting of the electrical contacts.
SUMMARY OF THE INVENTIONThe present invention overcomes the disadvantages and limitations of the prior art by providing a method for attaching metal contacts to individual molecules and/or aggregates of molecules that form a molecular film by using electroless deposition (ELD) to form a metal contact on a MF. ELD is a solution-based technique where a metal is catalytically reduced at a surface.
The present invention may therefore comprise a method of attaching metal contacts to functional groups on individual molecules in a molecular film to facilitate their function as solid-state devices comprising: attaching a functional molecular group to selective portions of a metallic plate to form patterned areas of self-assembled monolayers on a conductive bottom contact, patterning the functionalized molecules on a surface to give spatial control over the location of the metal contacts, placing the patterned surfaces of the self-assembled monolayers into an electroless plating bath for selective metal deposition onto the surfaces, controlling the chemical state of the functional molecular group by preferentially inducing the electroless metal deposition at the functional molecular group site, attaching metal contacts to the patterned portions of the self-assembled monolayers to form a top contact by depositing a metallic layer on the non-metallic surfaces of the self-assembled monolayers with an electroless plating bath consisting of water, formaldehyde, copper sulfate, sodium hydrogen tartrate, adjusting the pH of the electroless plating bath to approximately 12.8 using sodium hydroxide, removing the self-assembled monolayers from the electroless plating bath after a prescribed length of time and rinsing the self-assembled monolayers with water.
The present invention may also comprise a solid-state device made by the process comprising: attaching a functional molecular group to a selective portions of a metallic plate to form patterned areas of self-assembled monolayers on a conductive bottom contact, patterning the functionalized molecules on a surface to give spatial control over the location of the metal contacts, placing the patterned surfaces of the self-assembled monolayers into an electroless plating bath for selective metal deposition onto the surfaces, controlling the chemical state of the functional molecular group by preferentially inducing the electroless metal deposition at the functional molecular group site, attaching metal contacts to the patterned portions of the self-assembled monolayers to form a top contact by depositing a metallic layer on the non-metallic surfaces of the self-assembled monolayers with an electroless plating bath consisting of water, formaldehyde, copper sulfate, sodium hydrogen tartrate, adjusting the pH of the electroless plating bath to approximately 12.8 using sodium hydroxide, removing the self-assembled monolayers from the electroless plating bath after a prescribed length of time and rinsing the self-assembled monolayers with water.
The disclosed embodiments have numerous advantages over prior art. These include the elimination of additional process steps required to make the MF compatible with a vacuum environment and greater control over the chemical state of the MF. With the present embodiment, the chemical state of the MF can be readily varied in solution by changing variables such as pH and ionic strength. The increased control gained by producing the MF in solution greatly increases the type of physiochemical interactions that may be formed between the metal contact and the molecular layer. Additionally, ELD offers spatial control and precision at the required device densities necessary in molecular electronic applications. These advantages make the present embodiment suitable for applications in a variety of areas including, but not limited to, molecular electronics, electrical contacts, metal patterning and electroless deposition.
Numerous advantages and features of the disclosed embodiments will become readily apparent from the following detailed description of the invention and the embodiment thereof, from the claims and from the accompanying drawings in which details of the invention are fully and completely disclosed as a part of this specification.
BRIEF DESCRIPTION OF THE DRAWINGSIn the drawings,
The present embodiment details a method for attaching metal contacts to individual molecules and/or aggregates of molecules that form a molecular film by using ELD to form a metal contact on a MF. These molecules contain a functional group, in one embodiment, carboxylic acid (—COOH), tailored to selectively attach a contact to the molecule or molecular film at the site of the functional group. This contact is attached by growing a metal particle using ELD. ELD is an autocatalytic process where metal ions in solution are reduced at a surface in the absence of an externally applied electric field through surface mediated redox reactions. The deposition of metal at a surface is dependent upon, and fundamentally controlled by, the interaction of metal ions and subsequent reduction. In the case of organically modified surfaces (e.g. self-assembled monolayers), this interaction is often insufficient to initiate ELD. To offset this limitation, these surfaces are frequently exposed to various metal ions or colloids that catalytically activate the surface to ELD. The functionalized molecules may also be patterned to give spatial control over the location of the metal contacts in a more complex structure. The physical dimensions of the areas deposited and the deposition conditions may be altered by controlling such variables as pH and the ionic strength of the solution to control the physical dimensions and degree of interaction between the MF and the contact. For example, the extent of interaction can be highly varied by changing the functional group of the molecule.
By preparing molecular films in a solution-based environment as exemplified in
Metal/functional group coordination increases the interaction of the deposited metal through the formation of a metal-oxide bond between the top metal contact and the functional group. This interaction is responsible for the specificity of copper deposition that occurs. The interaction between the functional group and metal ions in solution is highly dependent upon the position of the functional group on the molecule. Thus, the placement of organic functionality on molecular electronic molecules may initiate or inhibit metal ELD in these systems. Thus, metallic contacts are able to be controlled spatially through selective surface patterning.
The present embodiment allows one to spatially control the top electrode ELD as a function of functional group modification. Using this scheme, molecular electronic molecules can be patterned on a surface and top contacts formed selectively over the patterned area. To demonstrate this selectivity, patterned SAMs were achieved using micro-contact printing (micro-CP) employed by placing a surface in contact with a PDMS stamp coated with 4-MBA as shown in
Two examples of the spatial selectivity achieved through micro-CP and headgroup modification are shown in
These examples illustrate the specificity of organic functional group modification in the spatial confinement of ELD. These embodiments effectively allow arrays of molecular electronic compounds to be isolated on a surface and provide attachment of a top contact to surface confined molecules. Molecular electronic devices may be built using this scheme.
The foregoing description of the invention has been presented for purposes of illustration and description. It is not intended to be exhaustive or to limit the invention to the precise form disclosed, and other modifications and variations may be possible in light of the above teachings. The embodiment was chosen and described in order to best explain the principles of the invention and its practical application to thereby enable others skilled in the art to best utilize the invention in various embodiments and various modifications as are suited to the particular use contemplated. It is intended that the appended claims be construed to include other alternative embodiments of the invention except insofar as limited by the prior art.
Claims
1. A process of making a solid-state device comprising:
- forming a self-assembled monolayer on a metal substrate; and,
- placing said metal substrate and said self-assembled monolayer in an electroless plating bath to form a metallic layer on said self-assembled monolayer.
2. The process of claim 1 wherein said step of placing said metal substrate and said self-assembled monolayer in an electroless plating bath comprises placing said metal substrate and said self-assembled monolayer in an electroless plating bath comprising: water, formaldehyde, copper sulfate, and sodium hydrogen tartrate.
3. The process of claim 1 wherein said step of placing said metal substrate and said self-assembled monolayer in an electroless plating bath comprises placing said metal substrate and said self-assembled monolayer in an electroless plating bath wherein the pH of said electroless plating bath is adjusted to approximately 12.8.
4. A process of making a solid-state device comprising:
- forming a self-assembled monolayer on a metal substrate; and
- placing said metal substrate and said self-assembled monolayer in an electroless plating bath consisting of water, formaldehyde, copper sulfate, and sodium hydrogen tartrate and adjusted to a pH of approximately 12.8 to form a metallic layer on said self-assembled monolayer.
5. A process of making a solid-state device comprising:
- forming patterned areas of multiple self-assembled monolayers on a metal substrate; and
- placing said metal substrate and said patterned areas of said multiple self-assembled monolayers in an electroless plating bath to form a metallic layer on said patterned areas of said self-assembled monolayers.
6. The process of claim 5 wherein said step of placing said metal substrate and said patterned areas of said multiple self-assembled monolayers in an electroless plating bath comprises placing said metal substrate and said patterned areas of said multiple self-assembled monolayers in an electroless plating bath comprising: water, formaldehyde, copper sulfate, and sodium hydrogen tartrate.
7. The process of claim 5 wherein said step of placing said metal substrate and said patterned areas of said multiple self-assembled monolayers in an electroless plating bath comprises placing said metal substrate and said patterned areas of said multiple self-assembled monolayers in an electroless plating bath wherein the pH of said electroless plating bath is adjusted to approximately 12.8.
8. A process of making a solid-state device comprising:
- forming patterned areas of multiple self-assembled monolayers on a metal substrate; and
- placing said metal substrate and said patterned areas of said multiple self-assembled monolayers in an electroless plating bath consisting of water, formaldehyde, copper sulfate, and sodium hydrogen tartrate and adjusted to a pH of approximately 12.8 to form a metallic layer on said patterned areas of said self-assembled monolayers.
9. A process of making a solid-state device comprising:
- depositing a self-assembled monolayer on a metal substrate, said self-assembled monolayer having a functional group that provides increased interaction with metal ions in an electroless plating bath, said self-assembled monolayer being selectively deposited on predetermined areas of said metal substrate; and
- placing said self-assembled monolayer, that is deposited on said metal substrate, together with said functional group, in an electroless plating bath so that metal ions in solution in said electroless plating bath are reduced on said self-assembled monolayer through interaction with said functional group to form a metallic contact layer such that said metallic contact layer does not penetrate said self-assembled monolayer and does not form a short circuit to said metal substrate.
10. The process of claim 9 wherein said functional group comprises carboxylic acid.
11. The process of claim 9 wherein said self-assembled monolayer comprises 4-mercaptobenzoic acid.
12. A method of attaching metal contacts to molecular films to produce a solid-state device comprising:
- attaching a functional molecular group to a metallic plate to form a self-assembled monolayer with a conductive bottom contact;
- attaching a metal contact to said self-assembled monolayer by depositing a metallic layer on a non-metallic surface of said self-assembled monolayer with an electroless plating bath for metal deposition onto said surface;
- removing said self-assembled monolayer from said electroless plating bath after a prescribed length of time; and
- rinsing said self-assembled monolayer with water.
13. A method of claim 12 wherein said electroless plating bath comprises:
- water, formaldehyde, copper sulfate, sodium hydrogen tartrate.
14. A method of claim 13 wherein the pH of said electroless plating bath is adjusted to approximately 12.8
15. A method of attaching metal contacts to molecular films to produce a solid-state device comprising:
- attaching a functional molecular group to a metallic plate to a to form a self-assembled monolayer with a conductive bottom contact;
- placing a non-metallic surface of said self-assembled monolayer into an electroless plating bath for metal deposition onto said surface;
- attaching a metal contact to said self-assembled monolayer to form a top contact by depositing a metallic layer on said non-metallic surface of said self-assembled monolayer with an electroless plating bath consisting of water, formaldehyde, copper sulfate, sodium hydrogen tartrate;
- adjusting the pH of said electroless plating bath to approximately 12.8;
- removing said self-assembled monolayer from said electroless plating bath after a prescribed length of time; and
- rinsing said self-assembled monolayer with water.
16. A method of attaching metal contacts to molecular films to produce a solid-state device comprising:
- attaching a functional molecular group to selective portions of a metallic plate to form patterned areas of self-assembled monolayers on a conductive bottom contact;
- placing patterned surfaces of said self-assembled monolayers into an electroless plating bath for selective metal deposition onto said surfaces; and
- attaching metal contacts to said patterned portions of said self-assembled monolayers to form top contacts by depositing a metallic layer on said patterned surfaces of said self-assembled monolayers with said electroless plating bath.
17. A method of claim 16 wherein said attachment of a functional molecular group to selective portions of a metallic plate to form patterned areas of self-assembled monolayers on a conductive bottom contact further comprises:
- controlling the chemical state of said functional molecular group by preferentially inducing said electroless metal deposition at a functional molecular group site.
18. A method of claim 16 wherein said attachment of a functional molecular group to selective portions of a metallic plate to form patterned areas of self-assembled monolayers on a conductive bottom contact further comprises:
- patterning the functionalized molecules on a surface to give spatial control over the location of the metal contacts.
19. A method of attaching metal contacts to functional groups on individual molecules in a molecular film to produce solid-state devices comprising:
- attaching a functional molecular group to selective portions of a metallic plate to form patterned areas of self-assembled monolayers on a conductive bottom contact;
- patterning the functionalized molecules on a surface to give spatial control over the location of the metal contacts;
- placing patterned surfaces of said self-assembled monolayers into an electroless plating bath for selective metal deposition onto said surfaces;
- controlling the chemical state of said functional molecular group by preferentially inducing said electroless metal deposition at a functional molecular group site;
- attaching metal contacts to said patterned portions of said self-assembled monolayers to form top contacts by depositing a metallic layer on said patterned surfaces of said self-assembled monolayers with said electroless plating bath comprising water, formaldehyde, copper sulfate, sodium hydrogen tartrate;
- adjusting the pH of said electroless plating bath to approximately 12.8;
- removing said self-assembled monolayers from said electroless plating bath after a prescribed length of time; and
- rinsing said self-assembled monolayers with water.
Type: Application
Filed: Oct 19, 2004
Publication Date: May 26, 2005
Inventors: Christopher Zangmeister (Gaithersburg, MD), Roger Van Zee (Takoma Park, MD)
Application Number: 10/969,510