Material separation to form segmented product
A method of removing selected portions of material from a base material using a plurality of different depth cuts (e.g., using laser cutting) such that apertured sections (or segments) are expeditiously removed for eventual use with another component or otherwise. In one example, the segmented section so removed can be used to bond various elements of an electronic package which in turn can then be positioned and used within an information handling system such as a computer, server, mainframe, etc.
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This invention relates to material handling and particularly to separation of one material from another wherein the separated material is segmented to subsequently mate with another component for a specific purpose. In one example, the separated segmented material may form an adhesive-type layer to bond various electronic components such as a heat sink to a chip, an electronic package stiffener to a circuitized substrate such as a printed circuit board (PCB), etc.
BACKGROUND OF THE INVENTION Material separation of several different types of materials is, of course, well known in the art of materials handling. The same is true for separation of materials having openings, slots, etc. therein. One example that comes readily to mind is gasket material for such products as manufacturing equipment, automobiles, etc. As will be defined herein, the present invention is particularly directed (but not limited) to the separation of segmented materials for eventual use in electronic products such as electronic packages, several types of which are known in the electronic field. Examples are shown and described in the following U.S. patents:
An electronic package sold by the assignee of this invention is of particular interest. It is sold under the name HyperBGA®, the “BGA” standing for ball (e.g., solder) grid array meaning a pattern of solder balls are used to bond the package to a selected underlying substrate, typically a laminate PCB. (HyperBGA is a registered trademark of Endicott Interconnect Technologies, Inc., the assignee of the present invention.) This particular package also utilizes a pattern of solder balls to couple the package's chip to its own substrate body, thus affording a more dense package than wirebond or the like packages also on the market. Significantly, the HyperBGA® package also preferably includes what is referred to as a “stiffener” to add rigidity to the final structure by bonding the package's substrate (a laminate) to a heat sink spacedly positioned above the substrate for cooling of the chip during package operation. Further description of this particular electronic package will be provided hereinbelow.
Although the invention defined herein is not meant to be limited for use with electronic packages such as described above, it is particularly useful in such applications, especially to bond one or more elements of the aforementioned HyperBGA® package to form the rigidized structure needed. The segmented material product separated in accordance with the unique teachings herein can be formed in a new and unique manner resulting in significant cost savings to the ultimate package consumer.
It is believed that a method for forming a segmented material offering the advantageous features taught herein, especially in the electronic packaging field, would constitute a significant advancement in the art.
OBJECTS AND SUMMARY OF THE INVENTIONIt is a primary object of the invention to enhance the materials handling art.
It is another object of the invention to provide an improved method of separating a particular layer of material from another so as to facilitate subsequent utilization thereof with other components, e.g., so as to effectively bond such components.
It is still another object of the invention to provide such a method which can be accomplished in a facile and less expensive manner than similar methods of material separation known in the materials handling art.
These and other objects are achieved according to one aspect of the invention by the provision of a method comprising the steps of providing a layer of base material, positioning a layer of first material and a layer of release material on the layer of base material such that the layer of release material is located substantially between the layer of base material and the layer of first material, providing a plurality of first cuts substantially only with the layer of first material, providing a plurality of deeper second cuts substantially only within the layer of release material and the layer of first material, and separating the layer of the first material from the layer of base material so as to remove only selected portions of the first material and leave other portions of the first material on the layer of base material.
BRIEF DESCRIPTION OF THE DRAWINGS
For a better understanding of the present invention, together with other and further objects, advantages and capabilities thereof, reference is made to the following disclosure and appended claims in connection with the above-described drawings. It is understood that like numerals will be used to indicate like elements from FIG. to FIG.
As stated above, the separated materials formed herein are useful in many applications but one in particular is in the field of electronic packaging. Examples of such packages are known in the electronic field and examples are provided above. Such packages, typically mounted on an electrically coupled to a circuitized substrate such as a PCB are then usually mounted within a larger electronic system such as a computer, mainframe, server, etc. if utilized in the information handling systems field. By the term “information handling system” as used herein shall mean any instrumentality or aggregate of instrumentalities primarily designed to compute, classify, process, transmit, receive, retrieve, originate, switch, store, display, manifest, measure, detect, record, reproduce, handle or utilize any form of information, intelligence or data for business, scientific, control or other purposes. Examples include the aforementioned personal computers and larger processors such as servers, mainframes, etc. It must be emphasized, however, that the materials formed in accordance with the teachings herein are not limited to such usages, and it is well within the powers of one of ordinary skill in the art to realize that the invention has many additional and distinctly different uses. For ease of description, however, definition of the invention will be with respect to its eventual use within an electronic package and further within an information handling system.
In
As will be described hereinbelow, first material 10 may be used to bond a heat sink to a semiconductor chip in an electronic package or find other uses within this environment, e.g., to bond a stiffener or other component occasionally used in such packaging. Further description will be provided with the description of
Typically, materials such as Pyralux when used in the environment defined herein have been relatively difficult to handle, including specifically when cutting and otherwise forming the openings and the external peripheral walls thereof, which, as understood, must be precisely defined if used in relatively small products such as micro-miniature and the like electronic packages. The present invention overcomes these problems while providing a method which can be accomplished in a relatively facile manner.
In
As defined hereinbelow, the method of this invention results in the formation of desired cuts within the first material 10 such that this material can then be removed from the base material 17 and utilized as desired. As removed, the first material 10 will include desired openings (see
In
Laser cutting is known in the cutting art, with examples being shown and described in the following patents:
Further description of this process, except to indicate various laser processing parameters usable for examples of the invention as noted herein, is not believed necessary.
As understood from the illustration in
In
As thus seen in
In
It is thus understood that a selected, segmented section 22 formed and removed using the unique teachings herein from a base support layer is then utilized to produce an electronic package for eventual use within an information handling system. The product as produced herein is thus attainable utilizing a new and unique bonding structure to greatly facilitate assembly of a larger subassembly (e.g., an electronic package) and an even larger electronic assembly such as an information handling system.
It is again understood, however, that the teachings of this invention are not limited to such electronic applications but may be utilized in many other embodiments in which a segmented piece of material is desired for mating with the corresponding component or the like to provide some needed function (e.g., bonding) for said component. It is thus believed that the present invention represents a significant advancement in the art, wherein such bonding is desired.
While there have been shown and described what are at present the preferred embodiments of the invention, it will be obvious to those skilled in the art that various changes and modifications may be made therein without departing from the scope of the invention as defined by the appended claims.
Claims
1-20. (canceled)
21. A method of bonding an electronic component to a heat sink, said method comprising:
- providing a layer of base material;
- positioning a layer of first material and a layer of release material on said layer of base material such that said layer of release material is located substantially between said layer of base material and said layer of first material,
- providing a plurality of first cuts through said layer of first material;
- providing a plurality of deeper, second cuts through said layer of release material and said layer of first material to substantially fuse said layer of release material to said layer of base material;
- separating said layer of said first material from said layer of base material so as to remove only selected portions of said first material and leave other portions of said first material on said layer of base material;
- providing an electronic component and a heat sink; and
- using said removed selected portions of said first material as a bonding material between said electronic component and said heat sink to bond said electronic component to said heat sink.
22. The method of claim 21 wherein said plurality of first cuts are provided using a laser.
23. The method of claim 21 wherein said plurality of second cuts are provided using a laser.
24. The method of claim 21 wherein said plurality of first cuts are provided using a laser pulse energy of from about 0.05 milli-joules to about 0.15 milli-joules and a pulse spacing within the range of from about five micrometers to about fifteen micrometers.
25. The method of claim 21 wherein said plurality of second cuts are provided using a laser pulse energy of from about 0.07 milli-joules to about 0.20 milli-joules and a pulse spacing within the range of from about two micrometers to about ten micrometers.
26. The method of claim 21 wherein said electronic component is a semiconductor chip.
27. The method of claim 21 wherein said layer of said first material is provided in the form of a first sub-layer of polymer material and second and third sub-layers of adhesive located on opposite sides of said first sub-layer.
28. The method of claim 21 wherein said layer of release material is bonded to said layer of base material during said providing of said first and second cuts.
29. The method of claim 28 wherein said layer of release material is bonded to said layer of base material using a vacuum.
Type: Application
Filed: Jun 13, 2005
Publication Date: Oct 13, 2005
Applicant: Endicott Interconnect Technologies, Inc. (Endicott, NY)
Inventors: Timothy Antesberger (Binghamton, NY), John Kresge (Binghamton, NY)
Application Number: 11/150,198