WAFER PACKING
The present invention provides a wafer packing. The wafer packing includes a box, at least two sponges, at least two hollow support pads, and a plurality of wafers. The sponges are put on a bottom and under a lid of the box, the hollow support pads are put between sponges, and each wafer is put between adjacent hollow support pads touching a non-complete wafer area of each wafer.
1. Field of the Invention
The invention relates to wafer packing, and more particularly, to wafer packing that avoids wafer pollution and saves space.
2. Description of the Prior Art
The manufacturing of semiconductor wafers includes many complex processes. Processes for forming transistors or other devices on semiconductor wafers and processes for packaging wafers are usually undertaken by different manufacturers, or performed in different factories. When a wafer manufacturer ships the wafers to a packager, the wafers are stored in cartons or wafer transfer apparatuses, for delivery to the packager.
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It is therefore a primary objective of the claimed invention to provide a wafer packing to solve the above-mentioned problems.
According to the claimed invention, the present invention provides a wafer packing. The wafer packing includes a box, at least two sponges, at least two hollow support pads, and a plurality of wafers. The sponges are deposited on a bottom and under a lid of the box, the hollow support pads are deposited on and between the sponges, and each wafer is deposited on and between two adjacent hollow support pads that contact a non-complete wafer area of each wafer edge.
The present invention utilizes hollow support pads inserted between each wafer in the wafer packing, in order to separate stacked wafers. The present invention can avoid the pollution and scraping of the wafers from the wafers touching with interleafs, and decreases the volume of wafer packing, reducing shipping costs. Furthermore, the present invention can prevent the damage from shaking of the wafers during shipment.
These and other objectives of the present invention will no doubt become obvious to those of ordinary skill in the art after reading the following detailed description of the preferred embodiment that is illustrated in the various figures and drawings.
BRIEF DESCRIPTION OF THE DRAWINGS
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The materials of the hollow support pads 76 can be plastic, an electrical conductor, or magnetic materials, having a width ((external diameter of the pad—internal diameter of the pad) divided by 2) greater than 3 mm, and a thickness greater than 1 mm. Besides, as shown in
The present invention utilizes the hollow support pads 76 to separate wafers 74. The complete wafer area of wafers 74 does not touch the hollow support pads 76, so the surface of the wafers 74 does not get polluted and scraped by touching the hollow support pads 76. Moreover, the present invention wafer packing 70 stacks the wafers 74, and uses the cassette 72 to fix and prevent movement of the wafers 74, so the diameter of the hollow support pads 76 is the same size as the wafers 74. Therefore, we can use the original cassette 72, without a need to change the width or height of the cassette. The present invention can effectively decrease the volume of wafer packing 70 by holding more wafers 74 in a single cassette while not decreasing the quantity of wafer packings 70 in a carton, and therefore decreases shipping costs.
To sum up, when related to the wafer packing of prior art, the present invention utilizes hollow support pads in the wafer packing and can be applied to ship 12″ wafers and thin wafers. Not only can the present invention avoid the polluting and scraping of the wafer from the wafer touching an interleaf, but it also decreases the volume problem of the FOSB wafer packing when the hollow support pads separate the wafers. In addition, the pads of prior art cannot solve the volume, pollution, and abrasion problems at which the present invention is directed. The present invention can eliminate the above-mentioned problems, and further decrease shipping costs.
Those skilled in the art will readily observe that numerous modifications and alterations of the device and method may be made while retaining the teachings of the invention. Accordingly, the above disclosure should be construed as limited only by the metes and bounds of the appended claims.
Claims
1. A wafer packing, the wafer packing comprising:
- a cassette;
- at least two sponges, the sponges respectively put on a bottom and under a lid of the cassette;
- a plurality of hollow support pads, the hollow support pads put between the sponges on the bottom and under the lid of the cassette;
- a plurality of wafers arranged in alternation with the plurality of hollow support pads, a non-complete wafer area of the each wafer touching adjacent hollow support pads.
2. The wafer packing of claim 1 wherein the hollow support pads are rounded pads, C-shaped pads, near rounded pads, and at least two arc pads.
3. The wafer packing of claim 2 wherein an angle of the C-shaped is larger than 180 degree.
4. The wafer packing of claim 2 wherein at least one of peripheries of the hollow support pads is toothlike in shape.
5. The wafer packing of claim 1 wherein a material of the hollow support pads is a plastic material, an electrically conducting material, or a magnetic material.
6. The wafer packing of claim 1 wherein a thickness of the hollow support pads is greater than 1 mm.
7. The wafer packing of claim 1 wherein a width of the hollow support pads is greater than 3 mm.
Type: Application
Filed: Sep 29, 2005
Publication Date: Mar 29, 2007
Inventor: Huang-Ting Hsiao (Tao-Yuan Hsien)
Application Number: 11/162,950
International Classification: B65D 85/00 (20060101);