Apertured conditioning brush for chemical mechanical planarization systems
An apparatus for conditioning the polishing pad of a chemical mechanical planarization (CMP) system including an apertured conditioning disk that is formed to support a plurality of brush bristles in any desired configuration. The bristles are utilized to lift out debris and contaminants that have been lodged within the deep pores of polishing pads, particularly “soft” polishing pads (or polishing felts) that include relatively deep pores. The apertures in the conditioning disk are used to allow for the efficient evacuation of the effluent created during the conditioning process. The apertures may also be used to introduce conditioning fluids as the bristles are brushing the surface to assist in the conditioning process. The utilization of the apertures to evacuate the effluent (via an attached vacuum source) overcomes problems associated with the prior art by immediately removing the dislodged material from the pad surface before it has an opportunity to be re-incorporated into the polishing pad.
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This application claims the benefit of U.S. Provisional Application No. 60/728,126, filed Oct. 19, 2005 and herein incorporated by reference.
TECHNICAL FIELDThe present invention relates to a conditioning brush for use in cleaning the polishing pad of a chemical mechanical planarization (CMP) apparatus and, more particularly, to a conditioning brush formed as disk to include an arrangement of both bristles and apertures to facilitate the cleaning operation.
BACKGROUND OF THE INVENTIONIn the field of chemical mechanical planarization (CMP), a process known as “pad conditioning” or “pad dressing” is used to restore the surface of the polishing pad and remove surface glazing by dislodging particulates and spent polishing slurry from the pad. Pad conditioning may be performed “ex-situ” (i.e., conditioning the polishing pad between wafer polishing cycles) or “in-situ” (i.e., concurrent with, or during, a wafer polishing cycle). In a typical prior art “in-situ” pad conditioning process, a fixed abrasive conditioning disk is moved across the pad surface to remove a small amount of pad material and debris, thus creating new asperities in the pad surface to allow for the free flow of the polishing slurry. The removed pad material and debris then combine with the slurry dispensed during the polishing process and are passively carried away from the pad.
Particulate generation is an on-going problem with known processes of conditioning CMP polishing pads, where particles from any one of the CMP apparatus, slurry, wafer, pad or conditioner remain on the pad's surface after conditioning. Any individual particle remaining on the pad may later scratch a wafer surface during polishing, creating a potential defect or contributing to polishing non-uniformity. For example, a particle disposed on the polishing pad may create a high spot that locally concentrates the forces between the polishing pad and the wafer. If large numbers of particles are present on the polishing pad, local disparities in polishing rates may result in polishing non-uniformities.
In certain types of CMP, for example tungsten CMP or post-planarization buffing, a relatively porous polishing pad is utilized, where this type of pad is characterized by a microstructure exhibiting vertically oriented, open pores. Variously referred to as a “soft” polishing pad, fibrous polishing pad, and the like, such pads may consist of a poromeric coating over a felt substrate, the poromeric coating comprising vertically oriented large pores sitting on top of a smaller, microporous felt layer. The polishing slurry and debris that settles within the lower regions of the pores within these pads can become nearly stagnant and develop recirculating eddy flows that trap even more material and limit the polishing/buffing capabilities of the pad. Over time, the trapped/recirculated materials can resurface and damage the wafer, dilute the process materials, or both. The conventional diamond abrasive conditioning disk is not effective in removing this deeply-trapped material, and has the additional drawback of quickly wearing away the porous pad material. As an alternative, a conditioning “brush” may be used to scour the porous pad surface in a manner that is likely to dislodge deeply embedded particles and move them into the waste stream. Prior art CMP systems utilizing a conditioning brush, however, require a large amount of slurry and rinse waters in an attempt to displace these particulates.
U.S. Pat. NO. 6,386,963 issued to S. Kenji et al. on May 14, 2002 discloses a conditioning element that is formed to support a combination of an abrasive surface and brush bristles. In the Kenji et al. structure, abrasive conditioning material is formed on a ring-shaped plate that is attached to the bottom surface of the conditioner head, leaving the center region of the element open. A plurality of brush bristles is formed on a small disk that is then attached to the center region of the abrasive ring. One problem with this particular arrangement, however, is that the limited positioning of the bristles in the central region of the conditioning element allows some particulate matter to be unaffected by the bristles and thus remain embedded within the pad. Further, the differential in height between the abrasive material and the bristles will likely result in inconsistent conditioning behavior and wear rates for the pad material.
Another prior art arrangement is disclosed in U.S. Pat. No. 7,033,253, issued to F. L. Dunn on Apr. 25, 2006. In the Dunn arrangement, brush bristles are disposed in any desired pattern on the bottom surface of a conditioning element, with the remaining portion of the surface covered by an abrasive material. The relative hardness of the bristles and the abrasive material may be controlled to best condition a particular pad material.
While both the Dunn and Kenji et al. arrangements provide an improvement in implementing a conditioning brush within a conventional CMP conditioning element, problems remain in that the material dislodged by the bristles (and the abrasive material) may be re-introduced to the pad surface before the conditioning process has an opportunity to flush the debris away.
Thus, a need remains in the art for a conditioning arrangement that provides the brushing motion preferred for large pore, fibrous or soft polishing pads/felts, while efficiently removing the debris from the polishing pad surface.
SUMMARY OF THE INVENTIONThe need remaining in the prior art is addressed by the present invention, which relates to a conditioning brush for use in cleaning the polishing pad of a chemical mechanical planarization (CMP) apparatus and, more particularly, to a conditioning brush formed as a disk to include an arrangement of both bristles and apertures to facilitate the cleaning operation.
In accordance with the present invention, an apertured conditioning disk is formed to support a plurality of brush bristles in any desired configuration. The apertures in the conditioning disk are used to allow for the efficient evacuation of the effluent created during the conditioning process, including both the debris dislodged by the bristles and slurry material remaining in the pores. The apertures may also be used to introduce conditioning fluids to assist in the conditioning process. The utilization of the apertures to evacuate the effluent (via an attached vacuum source) overcomes problems associated with the prior art by immediately removing the dislodged and/or accumulated material from the pad surface before it has an opportunity to be re-incorporated into the polishing pad.
In one embodiment of the present invention, the conditioning disk is formed of a stiff material capable of supporting the bristles in position such that the bristles have a slight stand-off from the bottom surface of the disk, allowing for the conditioner head to maintain a vacuum seal while the bristles engage the pores of the pad material. In an alternative embodiment, the conditioning disk may be formed of an abrasive material to permit simultaneous abrading and brushing of the polishing pad surface. In yet another embodiment, the bristles themselves may be formed of an abrasive-filled composite material.
Other and further embodiments and aspects of the present invention will become apparent during the course of the following discussion and by reference to the accompanying drawings.
BRIEF DESCRIPTION OF THE DRAWINGSReferring now to the drawings,
As mentioned above, it is necessary to “condition” or “redress” surface 18 of polishing pad 14 to remove the glaze/build-up of polishing slurry from the pad's surface, as well as to remove accumulated debris and other materials associated with the polishing process itself. In the arrangement as shown in
Referring back to
It is to be understood that the apertured conditioning brush of the present invention can be used in association with any type of polishing pad, or polishing felt, but is preferably intended for use with the fibrous polishing and/or buffing pads as discussed above that consist of deep, soft-walled, vertically-oriented pores conducive to the creation of recirculating eddy currents deep within the pad that trap the debris and spent slurry. The apertured conditioning brush of the present invention may also be utilized with conventional (i.e., relatively “hard”) polishing pads, where abrasive bristles provide sufficient surface abrasion, with lower pad wear rates, than traditional abrasive conditioning disks. Moreover, the arrangement of the bristles and apertures across the surface of the conditioning brush may be modified, as need be, to suit the needs of the particular CMP system. Indeed, the subject matter of the present invention is intended to be limited only by the scope of the claims appended hereto.
Claims
1. An apparatus for conditioning a polishing pad utilized in a chemical mechanical planarization (CMP) system, the apparatus comprising
- a conditioner head housing including an inlet port for introducing conditioning fluids onto the polishing pad and an outlet port for evacuating conditioning effluent from a conditioned area of said polishing pad; and
- a conditioning disk disposed within the housing so as to contact a top major surface of the polishing pad surface during conditioning, the conditioning disk comprising a brush for sweeping the top major surface of the polishing pad and dislodging debris therefrom, and a plurality of apertures for dispensing conditioning fluids to, and evacuating conditioning effluent from, the polishing pad.
2. An apparatus as defined in claim 1 wherein the brush comprises a plurality of bristles.
3. An apparatus as defined in claim 1 wherein the conditioning disk comprises an abrasive material.
4. An apparatus as defined in claim 2 wherein the plurality of bristles comprises an inert material.
5. An apparatus as defined in claim 4 wherein the inert material comprises nylon.
6. An apparatus as defined in claim 2 wherein the plurality of bristles comprises a composite abrasive-filled material.
7. An apparatus as defined in claim 2 wherein the plurality of bristles is disposed in a series of nested V-patterns across the conditioning disk, with the apertures disposed therebetween.
8. An apparatus as defined in claim 2 wherein the plurality of bristles is disposed in a series of concentric circles across the conditioning disk.
9. An apparatus as defined in claim 2 wherein the plurality of bristles is disposed in a plurality of spiral arms emanating from a central region of the conditioning disk.
10. An apparatus as defined in claim 2 wherein the plurality of bristles stand off a predetermined distance below the conditioner head housing so as to allow for the bristles to enter the polishing pad material without interrupting the evacuation of effluent therefrom.
11. An apparatus as defined in claim 1 wherein the conditioning disk further comprises a hex key alignment structure for providing aligned attachment between the conditioning disk and the conditioner head housing, providing alignment between the plurality of apertures of said conditioning disk and the inlet and outlet ports of said conditioner head housing.
12. A conditioning disk for use in dressing a polishing pad within a chemical mechanical planarization (CMP) apparatus, the conditioning disk comprising a plurality of apertures for dispensing conditioning fluids to, and evacuating conditioning effluent from, the polishing pad surface; and
- a brush for sweeping across the fibrous polishing pad and dislodging debris therefrom.
13. A conditioning disk as defined in claim 12 wherein the brush comprises a plurality of bristles.
14. A conditioning disk as defined in claim 12 wherein the disk comprises an abrasive material suitable for dressing the polishing pad.
15. A conditioning disk as defined in claim 13 wherein the plurality of bristles comprises an inert material.
16. A conditioning disk as defined in claim 15 where the inert material comprises nylon.
17. A conditioning disk as defined in claim 13 wherein the plurality of bristles comprises a composite abrasive-filled material.
18. A conditioning disk as defined in claim 13 wherein the plurality of bristles is disposed in a series of nested V-patterns across the conditioning disk, with the plurality of apertures disposed therebetween.
19. A conditioning disk as defined in claim 13 wherein the plurality of bristles is disposed in a series of concentric circles across the conditioning disk.
20. A conditioning disk as defined in claim 13 wherein the plurality of bristles is disposed in a plurality of spiral arms emanating from a central region of the conditioning disk.
21. A method of conditioning a polishing pad utilized in a chemical mechanical planarization system, the method comprising the steps of:
- presenting an apertured conditioning brush against a top major surface of the polishing pad, the apertured conditioning brush comprising a plurality of bristles and a plurality of apertures;
- providing a downforce on the apertured conditioning brush sufficient to push the plurality of bristles into the pores of the polishing pad;
- moving said apertured conditioning brush across the surface of said polishing pad such that the plurality of bristles dislodge accumulated debris from the pores; and
- applying a vacuum force sufficient to evacuate the dislodged accumulated debris through the plurality of apertures and away from the chemical mechanical planarization system.
22. The method as defined in claim 21 wherein the method further comprises the step of
- dispensing processing fluids onto the surface of the polishing pad as the apertured conditioning brush is moved across the surface of the polishing pad.
23. The method as defined in claim 21 wherein the applied downforce and the vacuum force are controlled so as to allow for the plurality of bristles to engage the pores of the polishing pad without interrupting the vacuum-controlled evacuation of the dislodged debris therefrom.
Type: Application
Filed: Oct 18, 2006
Publication Date: Apr 19, 2007
Applicant:
Inventor: Stephen Benner (Lansdale, PA)
Application Number: 11/582,711
International Classification: B24B 1/00 (20060101); B24B 29/00 (20060101); B24B 21/18 (20060101);