GRINDING MOUNT HOLDER ASSEMBLY, APPARATUS AND METHOD FOR MANUFACTURING A SAMPLE

- Samsung Electronics

Provided are a grinding mount holder assembly and an apparatus and method for manufacturing a sample using the grinding mount holder assembly. In an embodiment, the grinding mount holder assembly includes a mount in which a sample is fitted, a holder in which the mount is inserted, and a base on which the holder is installed so that it is capable of rotating. The base has a pressing member for pressing down the mount inserted in the holder. First one surface of the sample is exposed to one or more grinding wheels for grinding and polishing. Then the sample is flipped to expose the other side to the grinding wheels by rotating the holder 180 degrees within the base, and pressing the now-flipped sample downward through the holder until it is forced against the grinding wheel.

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Description
CROSS-REFERENCE TO RELATED APPLICATIONS

This U.S. non-provisional patent application claims priority under 35 U.S.C. §119 of Korean Patent Application No. 10-2006-12187, filed on Feb. 8, 2006, the entire contents of which are hereby incorporated by reference.

BACKGROUND

The embodiments disclosed herein relate to a grinding mount holder assembly, and more particularly, to a grinding mount holder assembly used for manufacturing a semiconductor sample, and an apparatus and method for manufacturing a semiconductor sample using the grinding mount holder assembly.

Because the size of the semiconductor device has been greatly reduced, a transmission electronic microscope (TEM) is often widely used to analyze semiconductor device defects. To analyze the semiconductor using the TEM, a semiconductor sample for a TEM analysis must be prepared. The sample manufacturing process must be precise to process a target analyzing point of a semiconductor wafer that is very thin (e.g., 50 nm). Therefore, manufacturing the semiconductor sample for the TEM analysis requires a great deal of labor and time. Considering the rapid growth of the semiconductor industry, there is a need to quickly perform a precise process for a TEM analysis sample.

In a conventional method of manufacturing the semiconductor sample for the TEM analysis, stack, cutting, grinding, dimpling, and ion-milling processes are generally performed in this order. The grinding process includes a front surface grinding process, a mirror surface polishing process, and a rear surface grinding process. That is, since the sample is ground through the front surface grinding, mirror surface polishing, and rear surface grinding processes, two mounts (one is for the front and rear surface grinding processes and the other is for the mirror surface polishing process) are necessary. In addition, since the sample moves three times in the conventional grinding process, the number of process steps increases. Therefore, according to the conventional method, a great deal of labor and time is required to manufacture the semiconductor sample for the TEM analysis.

SUMMARY

Embodiments presented here provide a grinding mount holder assembly that can reduce time and labor for performing a grinding process, and an apparatus and method for manufacturing a sample using the grinding process.

Embodiments provide grinding mount holder assemblies having a mount holder that can rotate by 180°.

In other embodiments, grinding mount holder assemblies may include: a mount in which a sample is fitted; a holder in which the mount is inserted; and a base on which the holder is installed to be capable of rotating, the base having a pressing or biasing member adapted to press down the mount inserted in the holder.

In some embodiments, the mount may have a space for exposing only one surface of the sample. The holder may have a space in which the mount is inserted, the space of the holder having upper and lower opened ends. The base may include a fixing part for rotatably fixing the holder. The holder may include a groove in which the fixing part is fitted.

In still other embodiments, grinding mount holder assemblies may include: a cylindrical mount having a cylindrical end wall on which one of front and rear surfaces of a sample is fixed, and a cylindrical vertical wall enclosing a side surface of the sample, the mount mounting the sample so that the other of the front and rear surfaces of the sample is exposed; a cylindrical holder having a vertical wall defining a cylindrical opened space in which the mount is inserted and provided at an outer-middle portion with a groove; and a base having a cylindrical vertical wall defining a cylindrical space in which the holder is rotatably installed and having a fixing part fitted in the groove and a pressing member for pushing out the mount inserted in the cylindrical opened space of the holder.

In some embodiments, the holder may have an inner diameter equal to or greater than a diameter of the mount and a height greater than that of the mount. The pressing member may be cylindrical to push the mount in the cylindrical open space of the cylindrical holder. The holder may rotate about an axis of the fixing part. The fixing part may be a screw.

In still yet other embodiments, grinding mount holder assemblies may include: a mount in which a sample is fitted so that one of front and rear surfaces of the sample is exposed; a holder having an inner space having upper and lower opened ends, the mount being inserted in the inner space of the holder; a base to which the holder is rotatably screw-coupled; wherein a pressing member for pressing down the mount inserted in the holder, the pressing member being provided in the base, wherein the grinding mount holder assembly allows one of the front and rear surfaces of the sample to be ground, rotates the holder 180°, and allows the other surface of the front and rear surfaces of the sample to be ground without replacing the mount.

In some embodiments, the holder may be cylindrical so that the mount can be inserted therein to be moveable. The holder may be cylindrical and have a height greater than that of the mount. The base may include a screw rotatably fixing the holder and the holder may be provided with a groove to which the screw is coupled.

In still yet another embodiments, sample manufacturing apparatuses may include: a main body having a plurality of rotational disks; an arm installed on the main body to be capable of moving leftward and rightward; and a grinding mount holder assembly installed on an extreme end of the arm to be capable of moving frontward and rearward, the grinding mount holder assembly mounting a sample being ground by the rotation of the rotational disks and reversing front and rear surfaces of the sample.

In some embodiments, the grinding mount holder assembly may include: a mount in which a sample is fitted so that one of front and rear surfaces of the sample is exposed; a holder having an inner space having upper and lower opened ends, the mount being inserted in the inner space of the holder; a base to which the holder is rotatably screw-coupled; a pressing member for pressing down the mount inserted in the holder, the pressing member being provided in the base, wherein the grinding mount holder assembly allows one of the front and rear surfaces of the sample to be ground, rotates the holder 180°, and allows the other surface of the front and rear surfaces of the sample to be ground without replacing the mount.

In other embodiments, the base may include a screw rotatably fixing the holder, and the holder may be provided with a groove to which the screw is coupled. The holder may be cylindrical so that the mount can be inserted therein to be moveable. The holder may be cylindrical and have a height greater than that of the mount. The mount may be formed of brass.

In still other embodiments, methods for manufacturing a sample may include: disposing the sample fitted in a mount inserted in a holder so that a front surface of the sample faces a lapping disk by pushing the holder using a pressing member; grinding the front surface of the sample by rotating the lapping disk; mirror-polishing the front surface of the sample; rotating the holder by 180° on an axis that is perpendicular to an axis of rotation of the lapping disk after the pressing member is retracted; disposing the sample so that a rear surface of the sample faces the lapping disk by pushing the pressing member; and grinding the rear surface of the sample by rotating the lapping disk.

In some embodiments, one of the grinding of the front surface and the grinding of the rear surface may use a plurality of lapping disks classified by grinding thicknesses. The grinding of the rear surface may include exposing the rear surface of the sample by grinding the mount.

In yet other embodiments, methods for manufacturing a sample using a grinding mount holder include providing a mount in which the sample is fitted so that a front surface of the sample is exposed, a holder in which the mount is inserted, a base to which the holder is rotatably screw-coupled, and a pressing member on the base to press down the mount inserted in the holder. The methods may include: grinding the front surface of the sample; mirror-polishing the front surface of the sample; rotating the holder having upper and lower opened ends; rotatably screw-coupling the holder to a base; rotating the holder by 180°; and grinding a rear surface of the sample without replacing the mount.

According to some embodiments, since the mount holder can rotate by 180°, the grinding and mirror surface polishing processes for the front surface of the sample and the grinding process for the rear surface of the sample can be accomplished using only one mount. Therefore, to manufacture the sample for the TEM analysis, the grinding process is automated, thereby reducing the expended time and effort, while improving the working efficiency.

BRIEF DESCRIPTION OF THE FIGURES

Non-limiting and non-exhaustive embodiments will be described with reference to the following figures, wherein like reference numerals refer to like parts throughout the various figures unless otherwise specified. In the figures:

FIG. 1 is a perspective view of a sample manufacturing apparatus according to an embodiment;

FIG. 2 is a cross-sectional view of a grinding mount holder assembly according to an embodiment;

FIGS. 3A and 3B are, respectively, cross-sectional and bottom views of a part of FIG. 2;

FIGS. 4A and 4B are, respectively, cross-sectional and bottom views of another part of FIG. 2;

FIGS. 5A and 5B are, respectively, cross-sectional and bottom views of yet another part of FIG. 2; and

FIGS. 6 through 13 are cross-sectional views illustrating operational steps of the grinding mount holder assembly of FIG. 2.

 DETAILED DESCRIPTION OF PREFERRED EMBODIMENTS

Preferred embodiments of the present invention will be described below in more detail with reference to the accompanying drawings. The present invention may, however, be embodied in different forms and should not be constructed as limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete, and will fully convey the scope of the present invention to those skilled in the art.

Like reference numerals in the drawings refer to like elements.

An exemplary embodiment will now be described in conjunction with the accompanying drawings.

FIG. 1 is a perspective view of a sample manufacturing apparatus according to an embodiment.

Referring to FIG. 1, a sample manufacturing apparatus 100 is a polishing machine for grinding a sample for use in a TEM analysis. The polishing machine 100 may include a main body 102 and a grinding mount holder assembly 200 installed on a lower portion of an extreme end of an arm 104 that can move in the body 102. The grinding mount holder assembly 200 is configured to hold a sample. The arm 104 may be assembled with the main body 102 to be capable of moving leftward and rightward. The grinding mount holder assembly 200 may be assembled with the arm 104 to be capable of moving frontward and rearward.

The main body 102 has a plurality of lapping disks, or grinding wheels, 106a through 106g configured to rotate at a predetermined RPM. The reason for providing the plurality of the lapping disks 106a through 106g is to be able to grind the sample by a multitude of grinding thicknesses. For example, the lapping disk 106a is provided to grind the sample by 40 μm, the lapping disk 106b is provided to grind the sample by 15 μm, the lapping disk 106c is provided to grind the sample by 5 μm, and the lapping disk 106d is provided to grind the sample by 1 μm. The lapping disks 106e through 106g may be provided to perform a mirror surface polishing process.

As the grinding mount holder assembly 200 contacts surfaces of the lapping disks 106a through 106g, the sample is ground. When the sample is ground, slurry is supplied from the arm 104 to the lapping disks 106a through 106g. When the grinder mount holder assembly 200 finishes a grinding job at one (e.g., the lapping disk 106a) of the lapping disks 106a through 106g and then moves to perform a grinding job at another lapping disk 106b, deionized water may be sprayed to clean the just-used lapping disk (e.g., 106a).

Control boxes 108a and 108b may be provided in the main body 102. The polishing machine 100 may operate according to values or data assigned by the control boxes 108a and 108b. A monitor 109 may be provided to let a worker identify a device state and a working condition.

FIG. 2 is a cross-sectional view of a grinding mount holder assembly according to an embodiment. FIGS. 3A and 3B are, respectively, cross-sectional and bottom views of a part of FIG. 2. FIGS. 4A and 4B are, respectively, cross-sectional and bottom views of another part of FIG. 2. FIGS. 5A and 5B are, respectively, cross-sectional and bottom views of another part of FIG. 2.

Referring to the embodiment of FIG. 2, the grinding mount holder assembly 200 includes a base 210 that may be assembled onto the arm 104. This assembly may then be capable of sliding frontward and rearward. A holder 220 that is, in turn, assembled on the base 210 is capable of rotating around an axis parallel to an exposed surface of the sample 300 and perpendicular to an axis of rotation of the lapping disks 106a through 106g by means disclosed further below. Furthermore, a mount 230 that is inserted in the holder 220 may be capable of moving vertically as by sliding within an open space defined between the vertical walls of the holder 220. A sample 300 is fixedly fitted in the mount 230. A pressing member 218 for forcing the mount 230 downward within the open space of the holder 220 and against a lapping disk (e.g. lapping disk 106a) is provided on the base 210.

For example, the mount 230 may have a cylindrical shape so that the disk-shaped sample 300 can be easily fitted therein. Likewise, the holder 220 may also have a cylindrical shape so that the cylindrical mount 230 can be easily inserted therein. Likewise, the base 210 may also have a cylindrical shape so that the cylindrical holder 220 can be easily assembled therewith. It is understood, however, that the base 210 must be shaped and sized to allow rotational movement of the holder 220 therewithin so that either the top or bottom face of the mount 230 (and thus sample 300) may be exposed to one or more of the lapping disks.

As shown in FIGS. 3A and 3B, the base 210 may include a laterally expansive upper portion 212, a vertical wall 216 defining a space 217 in which the holder 220 may be installed, and a vertical wall 214 defining a space 215 in which the pressing member 218 may be installed. The vertical walls 214 and 216 and the pressing member 218 may have a cylindrical shape but, again, should be shaped and sized to allow rotational/pivotal movement of the holder 220 therewithin.

An inner diameter D1 of the vertical wall 216, i.e., a diameter D1 of the space 217, may be greater than an inner diameter D2 of the vertical wall 214, i.e., a diameter D2 of the space 215. The vertical wall 216 may be provided with a fixing part such as screws 219 that can fix the holder 220 in the space 217. The screws 219 may penetrate the vertical wall 216 from outside the vertical wall 216 to inside.

As shown in FIGS. 4A and 4B, the holder 220 may include a vertical wall 222 having a height HI. The vertical wall 222 defines a space 224 having upper and lower opened ends. Grooves 226 in which the screws 219 are fitted may be formed on an outer circumferential middle portion. As the screws 219 are fitted in the grooves 226, the holder 220 can be fixed in the space 217 of the vertical wall 216 of the base 210. The holder 220 may be configured to rotate about an axis defined by both screws 219. Since the holder 220 must be capable of rotating in the space 217 of the base 210, an outer diameter D3 and the height H1 of the vertical wall 222 of the holder 220 is preferably less than the dimensional diameter D1 of the space 217 of the base 210. The holder 220 may be a thin disk with the height H1 less than its diameter D3 The inner space 224 of the holder 220 preferably has a sufficient diameter D4 for receiving the mount 230.

The pressing member 218 is configured to extend downward into space 224 of the holder 220 and press down or downwardly bias the mount 230 inserted in the space 224. Therefore, the pressing member 218 must be capable of vertically sliding. A diameter D8 of the pressing member 218 is slightly less than a diameter D4 of the space 224, i.e., an inner diameter D4 of the holder 220.

When the rotation of the holder 220 is realized by a driving source such as a motor, it is convenient to automate the grinding work.

As shown in FIGS. 5A and 5B, the mount 230 has an end wall 232 and a vertical wall 234 to define a space 235 having an open side. The sample 300 may be fitted in the space 235 in a state where a front surface 302 of the sample 300 is exposed and a rear surface 304 of the sample 300 contacts an inner surface 232a of the end wall 232. Since the space 235 can receive the sample 300, a diameter D6 of the space 235, i.e., an inner diameter D6 of the vertical wall 234, is equal to or slightly greater than a diameter D7 of the sample 300. In addition, since the front surface 302 of the sample 300 contacts the lapping disks 106a through 106g during the grinding process, a height H3 of the space 235 is preferably equal to or slightly less than a thickness T of the sample 300.

Since the mount 230 is inserted in the holder 220, a diameter D5 of the mount 230, i.e., an outer diameter D5 of the vertical wall 234, is preferably slightly less than the diameter D4 of the inner space 224 of the holder 220. Then, since the mount 230 is inserted in the inner space 224 of the holder 220 to be capable of vertically sliding, the height H2 of the mount 230 is preferably less than the height HI of the holder 220.

The mount 230 may be considered an expendable element. That is, the mount 230 may be formed of a material that can be easily worn when the sample 300 is ground. For example, when the sample 300 is formed of a silicon material, the mount 230 may be formed of silicon or brass.

When the sample 300, for example, has a diameter D7 of 3 mm and a thickness T of 1 mm, the diameter D6 and height H3 of the space 235 in which the sample 300 may be fitted may be respectively 3.2 mm and 1 mm. When the diameter D5 and height H2 of the mount 230 are respectively 1 cm and 2 mm, the diameter D3 and height H1 of the space 224 in which the mount 230 will be fitted may be 5 cm and 3 cm.

FIGS. 6 through 13 are cross-sectional views illustrating operational steps of the grinding mount holder assembly of FIG. 2, according to some embodiments.

As shown in FIG. 6, a mount wax (not shown) may be deposited on the inner surface 232a of the end wall 232 of the mount 230, before which the mount 230 may be pre-heated up to, for example, 100-150° C. so that the mount wax can be easily melted. Then, the sample 300 may be fitted into the space 235 so that the rear surface 304 of the sample 300 faces the inner surface 232a on which the mount wax is deposited. Then, the sample 300 may be fixed in the mount 230 with the front surface 302 exposed.

As shown in FIG. 7, when the sample 300 is fitted in the mount 230 with the front surface 302 exposed, the mount 230 is inserted into the inner space 224 of the holder 220 so that the vertical wall 234 of the mount 230 may contact the vertical wall 222 of the holder 220. Then the front surface 302 of the sample 300 is exposed to an external side of the holder 220.

As shown in FIG. 8, when the mount 230 is inserted in the holder 220, the holder 220 is mounted in the space 217 formed by the vertical wall 216 of the base 210. The vertical wall 222 of the holder 220 faces the vertical wall 216 of the base 210 so that the screws 219 can be fitted in the grooves 226. When the screws 219 are fitted in the grooves 226, the holder 220 is pivotally mounted on the base 210 and is capable of rotating about an axis defined by the screws 219 and grooves 226. In a first presented position, the front surface 302 of the sample 300 may face the lapping disk 106a.

As shown in FIG. 9, when the holder 220 is installed in the base 210, the base 210 may be lowered so that the front surface 302 of the sample 300 comes near or contacts the lapping disk 106a. The pressing member 218 can move downward to press down the mount 230. The front surface 302 of the sample 300 can then be ground by the rotation of the lapping disk 106a. The slurry and/or deionized water may be supplied to the lapping disk 106a. When the grinding process using the lapping disk 106a is finished, the base 210 may be moved above the lapping disks 106b-106d to perform a subsequent grinding process.

For example, as shown for the embodiment of FIG. 10, when the grinding process for the front surface 302 of the sample 300 is finished, the base 210 is moved above the lapping disk 106e to perform the mirror surface polishing process.

As shown in FIG. 11, when the grinding and polishing processes for the front surface 302 of the sample 300 are finished, the pressing member 218 pressing down the mount 230 may move upward out of holder opening 224 to thereby separate from the holder 220. Then the holder 220 may rotate 180° to a second presented position so that the front surface 302 of the sample 300 faces the pressing member 218. The rotation of the holder 220 may be realized by a driving source such as a motor.

As shown in FIG. 12, the pressing member 218 may move to push the mount 230 downward of the holder 220 so that the rear surface 304 of the sample 300 faces the lapping disk 106a of the end wall 232 of the mount 230. Then, the base 210 is moved downward so that the end wall 232 of the mount 230 contacts the rotating lapping disk 106a. At this point, the pressing member 218 may keep pressing down the mount 230. Therefore, the end wall 232 is ground to finally expose the rear surface 304 of the sample 300. Then, the exposed rear surface 304 is in turn ground, in the course of which the slurry and/or deionized water is supplied to the lapping disk 106a.

As shown in FIG. 13, when the above-described steps are performed, the grinding and mirror surface polishing processes for the front surface 302 of the sample 300 and the grinding process for the rear surface 304 of the sample 300 can be realized without replacing the mount 230. As a result, a sample 300′ can be easily manufactured.

According to the embodiments described above, since the mount holder can rotate by 180°, the grinding and mirror surface polishing processes for the front surface of the sample and the grinding process for the rear surface of the sample can be realized using only one mount. Therefore, to manufacture the sample for a TEM analysis, the grinding process is automated, thereby reducing time and effort, while improving working efficiency.

The above-disclosed subject matter is to be considered illustrative, and not restrictive, and the appended claims are intended to cover all such modifications, enhancements, and other embodiments, which fall within the true spirit and scope of the present invention. Thus, to the maximum extent allowed by law, the scope of the present invention is to be determined by the broadest permissible interpretation of the following claims and their equivalents, and shall not be restricted or limited by the foregoing detailed description.

Claims

1. A grinding mount holder assembly comprising:

a mount in which a sample is fitted;
a holder in which the mount is inserted; and
a base in which the holder is rotatably disposed, the base having a pressing member adapted to press down the mount inserted in the holder, wherein the holder is configured to rotate relative to the base.

2. The grinding mount holder assembly of claim 1, wherein the mount includes a first space to hold the sample, the first space configured to expose only one surface of the sample.

3. The grinding mount holder assembly of claim 1, wherein the holder includes a second space in which the mount is inserted, and wherein the holder further includes upper and lower opened ends, between which the second space is disposed.

4. The grinding mount holder assembly of claim 1, wherein the base includes a fixing part for rotatably fixing the holder in a rotation position relative to the base.

5. The grinding mount holder assembly of claim 4, wherein the holder includes a groove in which the fixing part is fitted, the fixing part extending through a sidewall of the base and into the groove.

6. A grinding mount holder assembly comprising:

a mount including an end wall adapted to fixedly receive one of front and rear surfaces of a sample, and having a side wall enclosing a side surface of the sample, the mount adapted to mount the sample so that the other of the front and rear surfaces of the sample is exposed;
a holder including a vertical wall defining an open space in which the mount is inserted at an end portion of the holder; and
a base including a vertical wall defining a space in which the holder is rotatably installed, and further including a pressing member for pushing out the mount inserted in the open space of the holder.

7. The grinding mount holder assembly of claim 6, wherein the holder has an inner diameter equal to or greater than a diameter of the mount and a height greater than that of the mount.

8. The grinding mount holder assembly of claim 6, wherein the pressing member, the mount, the open space, and the holder are each cylindrical.

9. The grinding mount holder assembly of claim 6, wherein the holder includes a groove to receive a fixing part from the vertical wall of the base, and the holder is adapted to rotate about an axis of the fixing part.

10. The grinding mount holder assembly of claim 6, wherein the fixing part is a screw.

11. A sample manufacturing apparatus comprising:

a main body having a plurality of rotational disks;
an arm installed on the main body to be capable of moving leftward and rightward; and
a grinding mount holder assembly installed on the arm to be capable of moving frontward and rearward, the grinding mount holder assembly capable of mounting a sample so that one of a front and rear surface of the sample is ground by the rotational disks, and further capable of reversing the front and rear surfaces of the sample so that the other one of the front and rear surface of the sample is ground by the rotational disks.

12. The sample manufacturing apparatus of claim 11, wherein the grinding mount holder assembly comprises:

a mount in which a sample is fitted so that one of front and rear surfaces of the sample is exposed;
a holder having an inner space having upper and lower opened ends, the mount disposed in the inner space of the holder;
a base to which the holder is rotatably coupled; and
a pressing member for pressing down the mount disposed in the holder, the pressing member being provided in the base,
wherein the grinding mount holder assembly allows one of the front and rear surfaces of the sample to be ground, is capable of rotating the holder 180°, and allows the other surface of the front and rear surfaces of the sample to be ground without the mount being replaced.

13. The sample manufacturing apparatus of claim 12, wherein the base includes a screw rotatably fixing the holder, and the holder is provided with a groove to which the screw is coupled.

14. The sample manufacturing apparatus of claim 12, wherein the holder is cylindrical so that the mount is inserted therein to be capable of moving.

15. The sample manufacturing apparatus of claim 12, wherein the holder is cylindrical and has a height greater than that of the mount.

16. The sample manufacturing apparatus of claim 12, wherein the mount is formed of brass or silicon.

17. A method for manufacturing a sample, comprising:

placing the sample in a mount that is inserted in a holder so that a front surface of the sample faces a lapping disk;
pushing the mount by a pressing member so that the sample is contacting the lapping disk pressing member;
grinding the front surface of the sample by rotating the lapping disk;
mirror-polishing the front surface of the sample;
rotating the holder including the mount by 180° after the pressing member is retracted;
disposing the sample so that a rear surface of the sample faces the lapping disk;
pushing the 180°-rotated mount by the pressing member so that the sample is contacting the lapping disk; and
grinding the rear surface of the sample by rotating the lapping disk.

18. The method of claim 17, wherein one of the grinding of the front surface and the grinding of the rear surface uses a plurality of lapping disks classified by grinding thicknesses.

19. The method of claim 17, wherein the grinding of the rear surface includes exposing the rear surface of the sample by grinding the mount.

20. A method for manufacturing a sample using a grinding mount holder comprising a mount in which the sample is fitted so that a front surface of the sample is exposed, a holder in which the mount is inserted, a base to which the holder is rotatably coupled, and a pressing member provided on the base to press down the mount inserted in the holder, the method comprising:

grinding the front surface of the sample;
mirror-polishing the front surface of the sample;
rotating the mount in the holder; and;
grinding a rear surface of the sample without replacing the mount.

21. The method of claim 20, wherein the holder includes upper and lower opened ends.

22. The method of claim 20, further comprising rotating the holder by 180° before grinding the rear surface of the sample.

23. A grinding mount holder assembly for positioning a sample, the assembly comprising:

a base configured to position the sample over a plurality of grinding wheels;
a sample holder pivotally connected along an axis to the base; and
a pressing member disposed in the base adapted to press a side of the sample against one of the plurality of grinding wheels.

24. The grinding mount holder assembly of claim 21, wherein the sample holder is configured to rotate so that the pressing member can press another side of the sample against one of the plurality of grinding wheels.

25. The grinding mount holder assembly of claim 21, further comprising a sample mount to hold the sample, the sample mount slideably disposed in the sample holder,

Patent History
Publication number: 20070184755
Type: Application
Filed: Dec 4, 2006
Publication Date: Aug 9, 2007
Applicant: SAMSUNG ELECTRONICS CO., LTD. (Gyeonggi-do)
Inventor: Bok-Kyoung PARK (Gyeonggi-do,)
Application Number: 11/566,646
Classifications
Current U.S. Class: With Feeding Of Tool Or Work Holder (451/11); Glass Or Stone Abrading (451/41)
International Classification: B24B 51/00 (20060101); B24B 7/30 (20060101); B24B 1/00 (20060101);