Dissipation Heat Pipe Structure and Manufacturing Method Thereof
This invention discloses a manufacturing method and the structure for a dissipation heat pipe. The dissipation heat pipe includes a hollow closed pipe, a column, a type of fluid and a wick structure. The dissipation heat pipe is often used in conducting the heat from the chip. The dissipation heat pipe can be made of a special thermal conduction material, including the metal and a bracket structure of carbon element which have high thermal conductivity so as to improve the heat conduction efficiency. The corresponding manufacturing method for this thermal conduction material can be made with chemical vapor deposition, physical vapor deposition, electroplating or the other materials preparation method. The bracket structure of carbon element can coat on the metal surface and also can be mixed into the metal.
The present invention relates to a dissipation heat pipe structure and corresponding manufacturing method and, more particularly, to the manufacturing method for manufacturing a heat conduction material combining a metal with a bracket structure of carbon element.
BACKGROUND OF THE INVENTIONIn recent years, the pace of high technology industry development is extremely fast, the development of electronic components is toward small volumes and high densities. The efficiency requirements for the aforesaid components also increase that generates much waste heat. The efficiency of the electronic components will be decreased and destroyed if the waste heat is unable to eliminate appropriately. Therefore, various heat conduction materials are provided to improve the efficiency of heat dissipation.
In the prior art, the material applying in the heat dissipation structure usually includes copper or aluminum to be the tendency of current heat dissipation technology. Traditionally, aluminum applying in the heat dissipation material is restricted to cause a bottleneck because of high temperature conduction is produced by the efficiency upgrade of central processors. Copper applying in the heat dissipation technology is then provided. However, copper has a higher specific gravity that has disadvantage to shape and the application is restricted. Although both copper and aluminum are used for air cooling to implement heat dissipation, the air cooling incorporating the aforesaid copper and aluminum will be unable to satisfy the demand for heat dissipating when the heat release of chips achieves 50 W/cm2. Therefore, the high efficiency of heat dissipation materials needs to improve.
In addition, to satisfy the demand for the heat dissipation and the space restriction, a dissipation heat pipe is in widespread use for conducting heat. The dissipation heat pipe can be used in a small and narrow space by using a fluid within the dissipation heat pipe to absorb and release heat to generate a phase change for conducting heat. A greater heat transfer can be generated by the dissipation heat pipe at a slight temperature difference and there is a reputation of “heat superconductor” for the dissipation heat pipe. Therefore, a conventional heat dissipation module is developed and comprises at least one dissipation heat pipe, at least one heat dissipation slip, and a plurality of heat sink fins.
Referring to
Besides, diamonds are well known and have characteristics with the highest hardness, the fastest heat conduction, and the widest refraction range in current materials. Diamonds, therefore, are always one of more important materials in engineering due to the excellent characteristics. The thermal conductivity of diamonds at the normal atmospheric temperature is five times more than copper. Moreover, the thermal expansion factor of diamonds at high temperature is very small that shows the excellent efficiency for heat dissipating. The feature may help people to differentiate the adulteration of diamonds. In the prior art, many technologies and manufacture procedures have been developed to make diamonds. The direct decomposition for hydrocarbons is the most familiar method like Microwave Plasma Enhance Chemical Vapor Deposition (MPCVD) and Hot Filament CVD (HFCVD). By the aforesaid methods, polycrystalline diamond films can be deposited. The characteristic of the polycrystalline diamond films is same as the single crystal diamonds.
SUMMARY OF THE INVENTIONBriefly, to eliminate the waste heat generated by electronic components efficiently and to face the development tendency of electronic components with small volumes and high densities, the object of the present invention is to provide a heat conduction material which is applied for a dissipation heat pipe to improve the efficiency of heat dissipation for a chip. The waste heat caused by the high temperature, which is generated from the operation of the chip, can be reduced. In addition, the heat conduction material provided by the present invention is not only restricted for the heat dissipation of the chip, but is also applied for other heat conduction apparatuses.
The heat conduction material provided by the present invention is applied for a dissipation heat pipe and the heat conduction material comprises combining a metal with a bracket structure of carbon element. The metal can be copper or aluminum or other metals with high thermal conductivity. The bracket structure of carbon element is diamonds and can also be used for coating on the metal surface or for encapsulating in materials. The bracket structure of carbon element can be further used in combining the metal with the materials. The heat conduction material can be made by chemical vapor deposition, physical vapor deposition, melting, electroplating or other manufacturing methods.
Other features and advantages of the present invention and variations thereof will become apparent from the following description, drawings, and claims.
BRIEF DESCRIPTION OF THE DRAWINGS
Referring to
A dissipation heat pipe 31 comprises the hollow closed pipe which has the end without sealing and the column within the hollow closed pipe according to
Lastly, referring to
In addition, the heat conduction material having the bracket structure of carbon element can be formed on a metal surface by using CVD or PVD. Referring to
Referring to
Moreover, the heat conduction material having a metal and a bracket structure of carbon element can be further made by electroplating, melting except CVD and PVD of the above embodiments.
Although the features and advantages of the embodiments according to the preferred invention are disclosed, it is not limited to the embodiments described above, but encompasses any and all modifications and changes within the spirit and scope of the following claims.
Claims
1. A dissipation heat pipe structure, applied in conducting and dissipating a heat source generated by a chip, comprising:
- a hollow closed pipe having a heat source end for contacting said heat source and a heat dissipation end which being corresponded to said heat source end for contacting a heat dissipation device, a temperature of said heat dissipation device being lower than said heat source;
- a column having a first end for contacting said heat source end of said hollow closed pipe and a second end for contacting said heat dissipation end of said hollow closed end;
- a type of fluid, set at said heat source end within said hollow closed pipe, after said heat source being contacted to said heat source end to vaporize said type of fluid to be a vapor, said vapor being then contacted to said heat dissipation end to form said type of fluid; and
- a wick structure, set at an interior wall of said hollow closed pipe and a surface of said column for conducting said type of fluid to said heat source end from said heat dissipation end.
2. The dissipation heat pipe structure of claim 1, wherein said heat source generated by said chip is conducted by a heat dissipation slip to said heat source end.
3. The dissipation heat pipe structure of claim 1, wherein said hollow closed pipe is any long column.
4. The dissipation heat pipe structure of claim 1, wherein said hollow closed pipe is any flat column.
5. The dissipation heat pipe structure of claim 1, wherein said column is any long column.
6. The dissipation heat pipe structure of claim 1, wherein said column is any flat column.
7. The dissipation heat pipe structure of claim 1, wherein said heat dissipation device is composed of a plurality of heat sink fins.
8. The dissipation heat pipe structure of claim 1, wherein said column is combined a metal with a bracket structure of carbon element to form a heat conduction material.
9. The dissipation heat pipe structure of claim 8, wherein said metal is copper.
10. The dissipation heat pipe structure of claim 8, wherein said metal is aluminum.
11. The dissipation heat pipe structure of claim 8, wherein said metal is silver.
12. The dissipation heat pipe structure of claim 8, wherein said metal is a metal material with high thermal conductivity.
13. The dissipation heat pipe structure of claim 8, wherein said bracket structure of carbon element is a diamond.
14. The dissipation heat pipe structure of claim 8, wherein said heat conduction material can be formed by chemical vapor deposition (CVD).
15. The dissipation heat pipe structure of claim 8, wherein said heat conduction material can be formed by physical vapor deposition (PVD).
16. The dissipation heat pipe structure of claim 8, wherein said heat conduction material can be formed by melting.
17. The dissipation heat pipe structure of claim 8, wherein said heat conduction material can be formed by electroplating.
18. A method for manufacturing a dissipation heat pipe structure, applied in conducting and dissipating a heat source generated by a chip, comprising:
- employing a manufacturing to form a heat conduction material having a metal and a bracket structure of carbon element;
- employing a die to form a hollow closed pipe and a column;
- forming a wick structure in an interior wall of said hollow closed pipe and onto a surface of said column;
- forming a type of fluid, set at an end within said hollow closed pipe; and
- sealing said hollow closed pipe.
19. The method for manufacturing a dissipation heat pipe structure of claim 18, further comprising providing copper to be said metal.
20. The method for manufacturing a dissipation heat pipe structure of claim 18, further comprising providing aluminum to be said metal.
21. The method for manufacturing a dissipation heat pipe structure of claim 18, further comprising providing silver to be said metal.
22. The method for manufacturing a dissipation heat pipe structure of claim 18, further comprising providing a metal material having high thermal conductivity to be said metal.
23. The method for manufacturing a dissipation heat pipe structure of claim 18, further comprising providing diamonds to be said bracket structure of carbon element.
24. The method for manufacturing a dissipation heat pipe structure of claim 18, further comprising providing CVD to form said heat conduction material.
Type: Application
Filed: Feb 24, 2006
Publication Date: Aug 30, 2007
Inventors: Ming-Hang Hwang (Taipei City), Yu-Chiang Cheng (Taipei City), Chao-Yi Chen (Taipei City), Hsin-Lung Kuo (Taipei City), Bin-Wei Lee (Taipei City), Wei-Chung Hsiao (Taipei City)
Application Number: 11/307,845
International Classification: F28D 15/00 (20060101);