Thermoformed cover for electronic device and method for forming
A thermoformed cover and related method for forming the thermoformed cover for an electronic device including at least one body element is made from a thermoplastic sheet having characteristics and properties to accommodate the mechanical requirements of the cover for the electronic device. The thermoplastic sheet has characteristics such that when the thermoplastic sheet is heated to a suitable temperature, the thermoplastic sheet becomes pliable and stretchable. At least a portion of the heated thermoplastic sheet is made to conform by vacuum, pressure or other suitable means to a mold arranged to substantially correspond to the desired cover for the electronic device. A thermoformed cover corresponding to the desired cover for the electronic device is formed in at least a portion of the thermoplastic sheet and the thermoformed cover is cut away or otherwise separated from the thermoplastic sheet. The thermoformed integrated cover may be arranged to replace or to envelop the cover of the electronic device or may be arranged as a protective insert cover between the body element and the cover of the electronic device.
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The present invention relates generally to thermoforming and deals more specifically with thermoformed articles such as covers for portable electronic devices and more particularly, though not necessarily, with integrated thermoformed covers for handheld portable electronic devices including mobile telephone devices.
BACKGROUND OF THE INVENTIONPortable electronic devices, particularly handheld portable electronic devices, are becoming increasingly popular and are rapidly expanding in use and function. Such portable electronic devices include for example, mobile telephone communication devices, gaming devices, music players, PDA's and the like. As technology continues to change, additional features and functions are provided by manufacturers and designers in an attempt to satisfy consumer demand and gain a competitive advantage. The seemingly endless competitive cycle of product launches and technology advertising hype has caused manufacturers and designers to search for ways to produce and introduce new products for maximum consumer impact while at the same time utilizing minimum effort for concepts and designs.
The covers or enclosures for these changing and new introduction products are constantly being designed to accommodate both mechanical and appearance requirements. As the time duration between new product introductions shortens and additional demands are made to accommodate multiple decorative and graphic cover appearances, it will be necessary to also shorten the time to production and to reduce the cost of producing the covers to maintain profitability because the cost will be amortized over a shorter product lifetime and presumably a lower number of total products produced.
It is known in the prior art to use injection molding techniques and processes to manufacture covers for portable electronic devices such as mobile telephones because it is possible to consistently obtain good mechanical parts with reasonable tolerances. In a typical injection molding system, raw material granulates, generally a polymer or other suitable plastic formulation, are melted and injected into a mold to obtain the desired shape and mechanical functions of the cover. Injection molding systems and methods for producing molded parts are well known and understood to those skilled in the art and are not discussed in detail herein. Injection molding is typically used and well suited for producing a high number of parts because the tooling costs and molds can be amortized over such a large number of parts produced. The reader is referred to the literature and numerous texts for further details and explanation to gain a further understanding of injection molding systems and methods and the economies obtainable when using injection molding for producing a high number of parts.
In one prior art typical mobile telephone enclosure, the mobile telephone has two covers, a front half and a rear half referred to respectively as A- and B-covers. The front enclosure portion generally has an opening or aperture to allow the screen display to be viewed. The screen opening in the front half enclosure is covered with a window and a bezel surrounding the opening to safeguard the screen display and to seal the window to the enclosure. Additional openings or apertures are provided in the front enclosure to receive and accommodate various keys or buttons arranged to carry out intended functions of the mobile telephone device for example, dialing a phone number, selecting a desired function and other well known operations of the device. The keys may be individual keys or keys carried on a keymat. The mold for such covers is complex and the cover is made up of a number of individual components. Colors, graphics and patterns are usually then applied to the front enclosure portion and user-interface text/graphics is applied to the key locations on the separate keymat. The front enclosure portion and the keymat are then assembled in conjunction with the various window components and the bezel components to create the finished front cover sub-assembly. The front and rear enclosure portions are joined together to form the enclosure for the electronic circuitry, battery supply, screen display and various components as necessary to carry out the intended functions of the mobile telephone. Although described as front and rear enclosure portions above, the portions comprising the enclosure may be any desired shape to define the enclosure.
One major disadvantage associated with injection molding the covers is that complicated molds are needed and which molds have long lead times to manufacture. Therefore, injection molding set-up time requirements are not satisfactory to achieve the desired shorten times between new product introductions to manufacture and produce the device covers.
A further disadvantage and shortcoming of injection molding techniques is that each part forming the enclosure, i.e., for example, the cover halves and window portion components, requires its own individual mold.
It is also known to use thermoforming to mold plastic parts. Thermoforming is a much more simpler process compared to injection molding because the raw material is a film rather than a melted plastic which has to flow during the melt stage for injection into the mold. Thermoforming is most commonly used to mass produce parts for the packaging industry. In thermoforming, a plastic film or sheet having a thickness in the range of about 0.1-2.0 mm is formed by pressure and heat. Next, the film is then heated to a point where it is softened but not melted and then the film is transferred to a mold where pressure and vacuum is used to transfer the film to the mold to shape the film in the form of the desired object or article as defined by the shape of the mold. It is possible with thermoforming to produce deep 3D parts however, due to the simple mold technology that is used, it is not possible to get rips or complicated mechanical functions into the part.
An advantage of thermoforming is the cost of a thermoformed mold is substantially less than a mold used in injection molding and therefore thermoforming is better suited and more economical for producing lower numbers of parts compared to injection molding.
A further advantage is the yield in thermoformed produced products is much better than in injection molded products because the raw material is film and there is no need for drying, transporting and melting plastic granules as required in injection molding.
It would be desirable therefore to provide a cover for an electronic device and a method to produce the cover that overcomes the disadvantages associated with injection molding techniques and processes for producing covers for electronic devices by utilizing thermoforming processes to produce the covers.
A yet further advantage is products or articles made by thermoforming require less machine set-up time compared to injection molding machine set-up time.
A still further benefit is molds used in thermoforming are lower cost compared to molds used in injection molding therefore making low numbers of parts production runs cost effective.
A further benefit is prototyping new products or modifying existing products is relatively inexpensive using thermoforming processes compared to injection molding processes.
It is an object of the present invention therefore to provide a thermoformed cover for an electronic device in which the cover parts are easily produced in a short turn around time.
SUMMARY OF THE INVENTIONIn accordance with a broad aspect of the invention, a thermoformed cover and related method for forming the thermoformed cover is presented. In one embodiment, an integrated cover for an electronic device including at least one body element for carrying suitable electronic circuitry to control and carry out the intended operational functions of the electronic device is made from a thermoplastic sheet having characteristics and properties to accommodate the mechanical requirements of the cover for the electronic device. The thermoplastic sheet has characteristics such that when the thermoplastic sheet is heated to a suitable temperature, the thermoplastic sheet becomes pliable and stretchable. At least a portion of the heated thermoplastic sheet is made to conform by vacuum, pressure or other suitable means to a mold arranged to substantially correspond to the desired cover for the electronic device. A thermoformed cover corresponding to the desired cover for the electronic device is formed in at least a portion of the thermoplastic sheet and the thermoformed cover is cut away or otherwise separated from the thermoplastic sheet. The thermoformed integrated cover may be arranged to replace or to envelop the cover of the electronic device or may be arranged as a protective insert cover between the body element and the cover of the electronic device.
In a further embodiment of the invention a method is provided for thermoforming a cover for an electronic device having at least one body element and includes providing a thermoplastic sheet and a suitable mold arranged to substantially correspond to the desired cover for the electronic device. The thermoplastic sheet is heated to a suitable temperature and at least a portion is conformed to the mold by vacuum, pressure or other means. The heated thermoplastic sheet is cooled and removed from the mold and the thermoformed cover formed therein is cut away or otherwise separated from the thermoplastic sheet. The surface of the thermoplastic sheet may be silk screen printed with desired text, graphics, patterns and the like prior to the heating of the thermoplastic sheet such that the text, graphics, patterns and the like appear on the outer facing surface of the thermoformed cover.
BRIEF DESCRIPTION OF THE DRAWINGSAdditional features, benefits and advantages of the present invention will become readily apparent from the following written description taken in conjunction with the drawings wherein:
Turning now to the drawings and considering the invention in further detail, the process of thermoforming a product or article, such as for example, a cover for an electronic device including a mobile telephone, involves heating a flat sheet of a suitable thermoplastic material until the sheet is pliable and stretchable, and then forcing the hot sheet against the contours of the surface of a mold having the desired article shape and size by using vacuum, pressure, mechanical means, blow molding or any combination thereof. The heated thermoplastic sheet is held to the shape of the mold by atmospheric pressure and after it is allowed to cool, the thus formed thermoplastic sheet retains the shape and detail of the mold.
The plastic materials used for thermoforming must have sufficient hot melt strength to support themselves during the thermoforming process. Typical thermoplastic materials include but are not limited to acrylic, ABS, polyesters, PVC, polystyrene, polycarbonate, polyethylene and polypropylene. Each thermoplastic material has its own unique set of properties which may be modified to achieve the desired mechanical properties and characteristics to accommodate the requirements of the particular article or product to be produced, for example, the cover of an electronic device such as a mobile telephone.
In general, thermoplastic sheets used for thermoforming are produced by a process of extrusion in which polymer resin pellets for example, are heated to the melting point. The melted polymer resin is then forced through a die to form a sheet. Multi-layered thermoplastic sheets may also be produced by a process of co-extrusion wherein multiple layers of similar polymers are co-extruded over one another to produce a laminated thermoplastic sheet.
Cut sheet thermoforming machines which are well known to those skilled in the art, may also be used to form the thermoplastic sheets. The details of such cut sheet thermoforming machines are not essential to gain an understanding of the present invention. The reader is referred to trade journals, textbooks and other applicable literature for a further explanation of the details of cut sheet thermoforming machines.
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In
The thermoplastic sheet 10 is moved into position over a mold body generally designated 20 in
It will be recognized and appreciated that a cover may be made up of a number of portions or segments that fit together to define the cover. Accordingly, the term “cover” as used herein contemplates all shapes, sizes, configurations and features to achieve the intended function.
Turning now to
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In a further embodiment of the present invention, a thermoformed cover has an integrated keypad with the cover by forming a laminate as schematically represented in exploded view in
Turning now to
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Although it is contemplated that the thermoformed cover embodying the present invention may be used in place of an existing cover of an electronic device, such as a mobile telephone, the thermoformed cover may also be fitted directly over the existing cover of the mobile telephone in a glove-like fashion as illustrated schematically in
In a further embodiment as schematically illustrated in
Although the invention has been described above showing a single article being thermoformed at a time, it is contemplated that multiple articles for example, the front and rear covers of a mobile telephone, or multiples of the front and rear covers may be thermoformed at the same time on the same mold body providing further additional cost savings and shortening the turnaround time for production of the covers.
Turning now to
It will be recognized by those skilled in the art that alternate and additional steps may be used for thermoforming a cover in accordance with the invention. Therefore, the invention is described by way of example rather than limitation.
Claims
1. An integrated cover for an electronic device including at least one body element for carrying suitable electronic circuitry to control and carry out the intended operational functions of the electronic device, said cover comprising:
- a thermoplastic sheet having characteristics and properties to accommodate the mechanical requirements of the cover for the electronic device;
- said thermoplastic sheet further having characteristics such that when said thermoplastic sheet is heated to a suitable temperature, said thermoplastic sheet becomes pliable and stretchable wherein at least a portion of said heated thermoplastic sheet conforms to a mold arranged to substantially correspond to the desired cover for the electronic device; and
- whereby a thermoformed cover corresponding to said desired cover for the electronic device is formed in said at least a portion of said thermoplastic sheet.
2. The integrated cover for an electronic device as defined in claim 1 further comprising said thermoformed cover being cut away from said at least one portion of said thermoplastic sheet.
3. The integrated cover as defined in claim 2 further being arranged for replacing the cover of the electronic device.
4. The integrated cover as defined in claim 2 further being arranged to envelop the cover of the electronic device.
5. The integrated cover as defined in claim 2 further being arranged as a protective insert cover between the body element and the cover of the electronic device.
6. The integrated cover as defined in claim 1 wherein said thermoformed cover is a vacuum thermoformed cover.
7. The integrated cover as defined in claim 1 wherein the thermoformed cover is a pressure thermoformed cover.
8. The integrated cover as defined in claim 1 wherein the thermoformed cover has a size and shape generally conforming to the size and shape of the body element.
9. The integrated cover as defined in claim 8 wherein said thermoformed cover has an exterior face surface and a suitable window area defined in at least a portion of said exterior face surface for viewing the visible display of information shown on a screen constructed in at least a portion of the body element.
10. The integrated cover as defined in claim 9 further comprising a border outline silk screen printed on said exterior face surface around said window area.
11. The integrated cover as defined in claim 9 further comprising at least one pattern silk screen printed on said exterior face surface.
12. The integrated cover as defined in claim 1 further comprising indicia silk screen printed on said exterior face surface at one or more locations corresponding to a desired predetermined functionality associated with the electronic device.
13. The integrated cover as defined in claim 1 wherein said thermoplastic sheet further includes keymat functionality.
14. The integrated cover as defined in claim 13 wherein said thermoplastic sheet further includes an adapter plug for electrically connecting said integrated keymat to the electronic circuitry carried by the body element.
15. The integrated cover as defined in claim 1 wherein said electronic device further comprises a portable electronic device.
16. The integrated cover as defined in claim 1 wherein said electronic device further comprises a mobile telephone.
17. Method, comprising:
- providing an integrated cover for an electronic device having at least one body element further comprising:
- providing a thermoplastic sheet;
- providing a suitable mold arranged to substantially correspond to the desired cover for the electronic device;
- heating the thermoplastic sheet to a suitable temperature;
- conforming at least a portion of the heated thermoplastic sheet to the mold; and
- cooling and removing the thermoplastic sheet from the mold, whereby a thermoformed cover corresponding to said desired cover for the electronic device is formed in said at least one portion of the thermoplastic sheet.
18. The method as defined in claim 17 further providing a thermoplastic sheet having characteristics and properties to accommodate the mechanical requirements of the cover for the electronic device.
19. The method as defined in claim 17 further including separating the thermoformed cover away from the thermoplastic sheet.
20. The method as defined in claim 17 further including conforming by vacuum to draw the heated thermoplastic sheet against the mold to form the thermoformed cover.
21. The method as defined in claim 17 further including conforming by pressure to press the heated thermoplastic sheet against the mold to form the thermoformed cover.
22. The method as defined in claim 17 further providing a thermoplastic sheet with keymat functionality.
23. The method as defined in claim 22 further providing a thermoplastic sheet having an adapter plug for electrically connecting the integrated keymat to the electrical circuitry of the electronic device.
24. The method as defined in claim 17 further including silk screen printing on the exterior facing surface of the thermoplastic sheet corresponding to the outward facing surface of the thermoformed cover at least one of desired text, graphics, patterns, and window outline borders, whereby the silk screen printed text, graphics, patterns and window outline border appears on the exterior outward facing surface of the thermoformed cover.
Type: Application
Filed: Apr 12, 2006
Publication Date: Oct 18, 2007
Applicant:
Inventors: Kari Hiltunen (Espoo), Heikki Laaksonen (Salo), Heikki Kasurinen (Salo), Sami Erpo (Espoo)
Application Number: 11/403,236
International Classification: B65D 85/00 (20060101);