HEAT DISSIPATION MODULE
The present invention relates a heat dissipation module applied to a microprocessor or light-emitting diodes. The heat dissipation module is provided with at least one heat-conducting column, on at least one end of which an outwardly extending expanded element is provided and on the periphery of which a heat-dissipating element is provided. In such manner, when the heat dissipation module is used for heat dissipation of a microprocessor, the area in contact with a heat source is enlarged by the expanded element, with rapid heat dissipation through the heat-conducting column and the heat-dissipating element. Moreover, when the heat dissipation module is used for light-emitting diodes, the expanded element can increase the heat dissipation area and the number of light-emitting diodes positioned to accelerate heat dissipation.
(a) Field of the Invention
The present invention relates a heat dissipation module, which is applied to a microprocessor or light-emitting diodes to enlarge the area in contact with a heat source or to increase the area or number of light-emitting diodes positioned thereby improving heat dissipation effect and increasing light-emitting luminance.
(b) Description of the Prior Art
Computers have become ubiquitous tools in modern life. However, with the fast development of computer technology, computer manufacturers continue looking for hardware with a faster computing speed and with better performance. At the same time, computer manufacturers are also confronted with the problem of heat dissipation in microprocessors due to more and more heat generated by faster and faster microprocessors.
Likewise, different from common lamp light sources in daily life, such as conventional light bulbs, quartz bulbs, daylight bulbs, mercury lamps and the like, light-emitting diodes belong to cold light emission devices, and have the advantages of low power consumption, long lifetime, and fast response speed, etc. In addition, they have small dimensions, can endure shocks, and are suitable for mass production. Thus, light-emitting diodes have become indispensable and important components in daily life. Besides, more and more attention will be given to high-luminance LEDs. Nevertheless, due to the problem of current-to-light conversion efficiency, high heat is generated when in use and sustained high heat causes damage to electronic components. It is necessary to assemble multiple LEDs to serve as a high-luminance or lighting fixture so that the amount of generated heat will increase.
Accordingly, to solve the above heat dissipation problems of microprocessors in computers or light-emitting diodes for lighting has also become the most important subject to those manufacturers.
SUMMARY OF THE INVENTIONTo solve the various drawbacks of the prior art, the inventors made efforts on research and experiments for a long time and has finally developed and designed a heat dissipation module.
It is an object of the present invention to provide a heat dissipation module used for a microprocessor or light-emitting diodes. The heat dissipation module is provided thereon with a heat-conducting column. An outwardly extending expanded element is provided on at least one end of the heat-conducting column. On the periphery of the heat-conducting column is provided a heat-dissipating element. In such manner, the heat-conducting column and the heat-dissipating element allow rapid heat dissipation, and the expanded element can enlarge the contact area with a heat-generating source to accelerate heat dissipation.
Another object of the present invention is to provide a heat dissipation module whose loading area is enlarged by the expanded element to increase the number of light-emitting diodes positioned.
Yet another object of the present invention is to provide a heat dissipation module in which expanded elements are provided at the two ends of the heat-conducting column respectively and the heat-dissipating element is disposed between the expanded elements and in contact with each of the expanded elements, resulting thermal reflux effect, so as to speed up heat dissipation.
Still another object of the present invention is to provide a heat dissipation module in which the end surface of the expanded element is beveled from the outside to the inside or from the inside to the outside, thereby improving the effect of collecting or diffusing light.
Another object of the present invention is to provide a heat dissipation module in which at least two heat-conducting columns are provided and correspond to each other. An outwardly extending heat-dissipating element is provided on the outer side of each of the heat-conducting columns, and a connection element is provided between the heat-conducting columns. The connection element is made of a thermal conductive material. In such manner, the heat-conducting columns are integrated into one piece via the connection element so as to accelerate heat dissipation.
The objects, shapes, structures, configurations, features and effects of present invention will be further understood and appreciated from the following detailed description when taken in conjunction with the drawings according to exemplary embodiments:
The present invention relates a heat dissipation module 10 that can be used for heat dissipation of a microprocessor. Referring to the first embodiment, shown in
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Claims
1. A heat dissipation module comprising:
- at least one substantially columnar heat-conducting column;
- at least one hollow expanded element provided at any end of the heat-conducting column; and
- at least one heat-dissipating element fixed on the periphery of the heat-conducting column.
2. The heat dissipation module as claimed in claim 1, wherein the heat-conducting column is a heat pipe.
3. The heat dissipation module as claimed in claim 1, wherein the heat-conducting column is a heat column.
4. The heat dissipation module as claimed in claim 1, wherein the end surface of the expanded element is a planar surface.
5. The heat dissipation module as claimed in claim 1, wherein the end surface of the expanded element is beveled from the outside to the inside.
6. The heat dissipation module as claimed in claim 1, wherein the end surface of the expanded element is beveled from the inside to the outside.
7. The heat dissipation module as claimed in claim 1, wherein the heat-dissipating element is coupled to a collar mounted around the heat-conducting column.
8. The heat dissipation module as claimed in claim 1, wherein the heat-dissipating element is a heat-dissipating block or a heat-dissipating fin.
9. The heat dissipation module as claimed in claim 1, wherein two expanded elements are further provided at the two ends of the heat-conducting column respectively and the heat-dissipating element is disposed between the expanded elements.
10. The heat dissipation module as claimed in claim 9, wherein the heat-dissipating element is in contact with each of the expanded elements.
11. The heat dissipation module as claimed in claim 1, wherein the heat-dissipating element is provided at its end side with a heat-conducting pipe.
12. The heat dissipation module as claimed in claim 1, wherein two heat-conducting columns are provided and correspond to each other, an outwardly extending heat-dissipating element is provided on the outer side of each of the heat-conducting columns, and a connection element is provided between the heat-conducting columns.
13. The image display method as claimed in claim 12, wherein the connection element is made of a thermal conductive material.
Type: Application
Filed: Jun 9, 2009
Publication Date: Dec 17, 2009
Inventor: Pei-Chih YAO (Jhonghe City)
Application Number: 12/481,100
International Classification: F28F 13/00 (20060101);