AIR GUIDING STRUCTURE

Abstract

An air guiding structure includes a plurality of fins capable of swinging, an actuation member connected to each fin, and a memory deformable element connected to the outermost fin. When the memory deformable element is at a normal temperature, the fins remain at a normal angle; when deforming because of heat, the memory deformable element pulls the fins to swing. Further, the actuation member drives each fin to rotate to a working angle, and thus the air exhaustion direction is changed according to the temperature effect.

Description

CROSS-REFERENCE TO RELATED APPLICATIONS

This non-provisional application claims priority under 35 U.S.C. §119(a) on Patent Application No(s). 097123809 filed in Taiwan, R.O.C. on Jun. 25, 2008 the entire contents of which are hereby incorporated by reference.

BACKGROUND OF THE INVENTION

1. Field of Invention

The present invention relates to an air guiding structure, and more particularly to an air guiding structure capable of changing an air exhaustion direction according to the temperature.

2. Related Art

Electronic devices generate heat in operation. Therefore, to maintain the normal operation of an electronic device, the heat dissipation design is very important. Taking a notebook computer for example, its heat dissipation design is generally to dispose a heatsink fan inside the host device, open an air inlet at the top or bottom of the host device, and correspondingly open an air outlet on a side edge of the host device. When the host device starts operating, the heatsink fan draws in cool air from the outside via the air inlet, then the cool air exchanges heat with a heat source (for example, the CPU) of the notebook computer, and then the heatsink fan exhausts the hot air via the air outlet.

In order to prevent foreign substances from entering the notebook computer via the air inlet or outlet, a plurality of fins is fixed in the air inlet and outlet. As the fins are generally perpendicular to the surface of the main case, the air exhausted from the outlet is in a direction perpendicular to the surface of the main case. For example, the air outlet of the notebook computer is disposed on a side edge of the host device, and a hand of a user is on the same side of the air outlet (for example, to operate a mouse). As a result, the hot air exhausted from the outlet will be directly blown to the hand of the user, and cause discomfort to the user.

Of course, to solve the above problem, the air outlet of a notebook computer can be disposed on the rear end of the host device, and thus the hot air will not be blown to the hand of the user. However, restricted by the size, in the market, the air outlet is disposed on a side edge of the host device of the notebook computer in most cases. Or, an adjustable fin is proposed by notebook computer manufacturers. For instance, U.S. Pat. No. 6,229,701 discloses a portable computer with a heat dissipating device. In this patent, heat dissipating slats, mounted pivotally in a ventilation hole, are movable between a close position to overlap the ventilation hole and an open position at an angle. However, the adjustable heat dissipating slats in this patent are very complicated in structure.

SUMMARY OF THE INVENTION

Accordingly, as the fins fixed in the air outlet of a conventional notebook computer exhaust hot air in a fixed direction, and the heat dissipating slats mounted pivotally in the ventilation hole of a notebook computer have a quite complicated structure, neither of these two designs is desirable for the air outlet of a notebook computer. Therefore, the present invention is directed to a temperature-sensitive fin structure capable of changing the air exhaustion direction according to the temperature effect.

An air guiding structure applicable to an electronic device with an air outlet in a case of the electronic device is provided. The air guiding structure includes a plurality of fins, an actuation member, and a memory deformable element. The fins are mounted in the air outlet and capable of rotating. The actuation member is connected to each fin, so as to drive the fins to rotate in sync. The memory deformable element has one end fixed to the electronic device, and the other end connected to the actuation member or directly connected to one of the fins (the outermost fin), such that the memory deformable element under thermal deformation pulls the fins to swing together. When the memory deformable element is at a normal temperature, the fins remain at a normal angle, and when deforming due to heat generated in the electronic device, the memory deformable element pulls the fins to swing. Further, the actuation member drives each fin to swing together to a working angle, and thus the air exhaustion direction from the air outlet is changed.

According to the air guiding structure of the present invention, when the electronic device generates heat in operation, the memory deformable element is heated and expands to pull the fins to swing to a working angle. Therefore, the fins can change the air exhaustion direction according to the temperature effect of the electronic device. Thus, the provided air guiding structure is an optimal design for an electronic device.

BRIEF DESCRIPTION OF THE DRAWINGS

The present invention will become more fully understood from the detailed description given herein below for illustration only, and thus are not limitative of the present invention, and wherein:

FIG. 1 is a perspective view illustrating the structure of a first embodiment of the present invention when applied to a notebook computer;

FIG. 2A is a perspective view illustrating the structure of the first embodiment of the present invention;

FIG. 2B is a perspective view illustrating the operation of the first embodiment of the present invention;

FIGS. 3A and 3B are schematic views illustrating the usage of the first embodiment of the present invention;

FIG. 4 is a perspective view illustrating the structure of a second embodiment of the present invention;

FIGS. 5A and 5B are perspective views illustrating the structure of a third embodiment of the present invention;

FIG. 6 is a perspective view of a fourth embodiment of the present invention;

FIGS. 7A and 7B are perspective views illustrating the usage of a fifth embodiment of the present invention;

FIG. 8 is a perspective view illustrating the usage of the fifth embodiment of the present invention;

FIG. 9 is a perspective view illustrating the usage of a sixth embodiment of the present invention; and

FIGS. 10A and 10B are perspective views illustrating the usage of a seventh embodiment of the present invention.

DETAILED DESCRIPTION OF THE INVENTION

The air guiding structure of the present invention is applicable to an electronic device that generates heat in operation, such as a desktop computer, a server, or a notebook computer. The notebook computer is taken as the preferred embodiment of the present invention below for illustration.

Referring to FIG. 1, the air guiding structure of the present invention is applicable to a notebook computer. The notebook computer has a host device 10. The host device 10 has a heatsink fan 11 disposed therein, and has an air outlet 12 corresponding to the heatsink fan 11 on a side edge.

FIGS. 2A and 2B show a first embodiment of the present invention. Referring to FIGS. 2A and 2B, the air guiding structure of this embodiment includes a plurality of fins 13, an actuation member 14, and a memory deformable element 15. Each fin 13 is plate-like, and has a pair of rotating shafts 131 respectively disposed at its top and bottom. The air outlet 12 has a plurality of dowel holes 121 respectively disposed at the top and bottom of its inner wall. The rotating shafts 131 of the fins 13 are respectively fitted into the dowel holes 121 of the air outlet 12, and thus the fins 13 can rotate on the air outlet 12 to change the angle. In addition, a connection portion 132 is disposed on the long side of each fin 13. The actuation member 14 is a bar-shaped rod, and has a plurality of ferrules 141 respectively corresponding to the fins 13 disposed thereon. The connection portion 132 of each fin 13 swings in the corresponding ferrule 141, so that the fins 13 are serially-connected and capable of rotating together when driven by the actuation member 14 to change the angle.

The memory deformable element 15 is spiral or in other possible shapes, for example, being irregular linear, bar-shaped, or plate-like. In the first embodiment, a spiral memory deformable element is taken as an example. The memory deformable element 15 has one end fixed to a side edge on the inner wall of the air outlet 12 (on the electronic device, i.e., the host device 10 of the notebook computer), and the other end connected to one of the fins 13 (the outermost fin 13 in the figure). In the present invention, the memory deformable element 15, no matter directly connected to one of the fins 13 or connected to the actuation member 14, can smoothly pull all the fins 13 to swing together. Further, the connection between the memory deformable element 15 and the fin 13 enables the memory deformable element 15 to pull all the fins 13 to swing together when the memory deformable element 15 deforms because of heat. Thereby, the aforementioned two implementation aspects are both applicable to the present invention, and the memory deformable element 15 directly connected to one of the fins 13 is taken as an example below.

The memory deformable element 15 is made of a Ni—Ti shape memory alloy, Cu—Zn—Al shape memory alloy, or Cu—Ni—Al shape memory alloy, and is deformable according to the temperature. The memory deformable element 15 has an expanded and deformed state at a normal temperature, and has a contracted original state when heated. In response to the deformation of the memory deformable element 15, the fins 13 remain at a normal angle at the normal temperature (for example, the heatsink fan 11 is not in operation), and are pulled to swing by the memory deformable element 15 when contracting due to thermal deformation (for example, the heatsink fan 11 is in operation). Further, the actuation member 14 drives the fins 13 to swing together to a working angle. Referring to FIGS. 3A and 3B together, in the air guiding structure of the present invention, the fins 13 are mounted in the air outlet 12 and capable of rotating. The actuation member 14 is connected to each fin 13. The memory deformable element 15 has one end connected to a side edge of the air outlet 12, and the other end connected to the outermost fin 13. The memory deformable element 15 is in the expanded and deformed state at a normal temperature (i.e., the notebook computer is not in operation), and the fins 13 remain at a normal angle. At this time, the fins 13 are perpendicular to the air outlet 12, as shown in FIG. 3A. When the notebook computer starts operating, the heatsink fan 11 draws in cool air from the environment, then the cool air exchanges heat with a heat source (not shown) of the notebook computer, and then the heatsink fan 11 exhausts the hot air generated in the heat exchange via the air outlet 12. The memory deformable element 15 in continuous contact with the hot air will be heated. When the temperature of the memory deformable element 15 reaches a transition temperature, the memory deformable element 15 contracts to the contracted original state, and thus the fins 13 are pulled to swing. Further, the actuation member 14 drives the fins 13 to swing together to a working angle, as shown in FIG. 3B.

In a specific application, when the notebook computer is just started, its temperature has not reached the transition temperature, and the hot air is still exhausted by the fins 13 of the air outlet 12 from a side edge of the notebook computer. When the temperature of the hot air rises after continuous operation of the notebook computer and finally reaches the transition temperature, each fin 13 swings to the working angle. The working angle is an oblique angle toward the rear end of the notebook computer, such that the hot air is exhausted by the fins of the air outlet 12 in an oblique angle toward the rear end of the notebook computer. Therefore, if a hand of a user is on the same side of the air outlet to operate a mouse, the hot air will not be directly blown to the hand of the user, and thus no discomfort will be caused by the exhausted hot air.

Referring to FIGS. 2A, 2B and 3A, 3B, the rotating angle of each fin 13 varies according to different positions of the rotating shaft 131 in the fin 13. The outermost fin 13 has a mean line L approximately at the center of the fin 13, and thus the long side of the fin 13 is equally divided into two parts. In the present invention, under the same deformation volume, the angle of the fins 13 after being pulled by the memory deformable element 15 to swing is in inverse proportion to the distance from the dowel hole 121 and the rotating shaft 131 to the memory deformable element 15. That is, if the rotating shaft 131 is closer to the place where the memory deformable element 15 is connected to the fin 13, the memory deformable element 15 under the same deformation volume can pull the fin 13 to rotate by a larger angle. In the first embodiment, a distance from the place where the memory deformable element 15 is connected to the fin 13 to the rotating shaft 131 is approximately equal to a distance from the place where the memory deformable element 15 is connected to the fin 13 to the mean line L, i.e., the rotating shaft 131 is disposed on the mean line L.

FIG. 4 shows a second embodiment of the present invention. Referring to FIG. 4, in the air guiding structure of this embodiment, a heat conductive member 16 is disposed between a heat dissipation element or heatsink (not shown, which for example is a heat pipe, a heat dissipation pad, or a heat dissipation fin set) of the notebook computer and the memory deformable element 15. In the first embodiment of the present invention, the heatsink fan 11 blows the hot air to the memory deformable element 15, while in the second embodiment of the present invention, the heat generated by the heat dissipation element or heatsink is directly conducted to the memory deformable element 15, such that the memory deformable element 15 can reflect the actual operating status of the notebook computer and pull the fins 13 to rotate to a working angle in real time.

FIGS. 5A and 5B show a third embodiment of the present invention. Referring to FIGS. 5A and 5B, in the air guiding structure of this embodiment, a restoring element 17 is disposed on the inner wall of the other side of the air outlet 12 opposite to the memory deformable element 15. The restoring element 17 has one end fixed to a side edge of the inner wall of the air outlet 12, and the other end connected to the corresponding outermost fin 13, i.e., the outermost fin 13 on the side opposite to the memory deformable element 15. The restoring element 17 is, but not limited to, a tension spring, and normally remains in a compressed state corresponding to the expanded and deformed state of the memory deformable element 15. When the memory deformable element 15 is in the contracted original state, the restoring element 17 is stretched, such that the restoring element 17 can assist the memory deformable element 15 to restore the contracted original state when the notebook computer stops operating, and thus each fin 13 can restore its normal angle. Thereby, when the notebook computer stops operating, the temperature of the memory deformable element 15 gradually drops to below the transition temperature. In this circumstance, the restoring element 17 pulls the fins 13 at the normal temperature to make the memory deformable element 15 restore the expanded and deformed state, and the actuation member 14 further pulls each fin 13 back to the normal angle.

FIG. 6 shows a fourth embodiment of the present invention. Referring to FIG. 6, in the first, second, and third embodiments, the memory deformable element 15 is disposed on a side edge of the air outlet 12, and deforms in a direction perpendicular to the air outlet 12. However, in the fourth embodiment, the memory deformable element 15 is disposed in the notebook computer due to the inner space configuration of the notebook computer, and can deform in a direction parallel to the air outlet 12. Therefore, the memory deformable element 15 has one end directly fixed to a heat dissipation element or heatsink (not shown), and the other end fixed to a pull-rod 133 of the outermost fin 13, so as to pull the fins 13 to rotate.

FIGS. 7A, 7B, and 8 show a fifth embodiment of the present invention. Referring to FIGS. 7A, 7B, and 8, the structure of the air guiding structure in the fifth embodiment is similar to that of the first embodiment, and only the difference between the two embodiments will be described below. In the fifth embodiment, the rotating shaft 131 and the dowel hole 121 of each fin 13 are disposed closer to the memory deformable element 15 (compared with the first embodiment), i.e., a distance from the place where the memory deformable element 15 is connected to the fin 13 to the rotating shaft 131 is smaller than a distance from the place where the memory deformable element 15 is connected to the fin 13 to the mean line L. Thereby, the memory deformable element 15 under the same deformation volume can pull the fins 13 to rotate by a larger angle (compared with the first embodiment). Of course, the position rotating shaft 131 can remain unchanged, and the memory deformable element 15 is moved to the inner side of the air outlet 12 instead. In this circumstance, the memory deformable element 15 under the same deformation volume can also pull the fins 13 to rotate by a larger angle. Moreover, as shown in FIG. 8, the rotating shaft 131 and the dowel hole 121 of each fin 13 are disposed further away from the memory deformable element 15, i.e., a distance from the place where the memory deformable element 15 is connected to the fin 13 to the rotating shaft 131 is greater than a distance from the place where the memory deformable element 15 is connected to the fin 13 to the mean line L, which also falls in the scope of the present invention.

FIG. 9 shows a sixth embodiment of the present invention. Referring to FIG. 9, the structure of the air guiding structure in the sixth embodiment is similar to that of the first embodiment, and only the difference between the two embodiments will be described below. In the sixth embodiment, the memory deformable element 15 has one end fixed to a side edge of the inner wall of the air outlet 12, and the other end directly connected to the actuation member 14. Thus, compared with the first embodiment, the memory deformable element 15 of this embodiment directly pulls the actuation member 14, and accordingly the actuation member 14 drives all the fins 13 to swing together.

FIGS. 10A and 10B show a seventh embodiment of the present invention. Referring to FIGS. 10A and 10B, the structure of the air guiding structure in the seventh embodiment is similar to that of the first embodiment, and only the difference between the two embodiments will be described below. In the seventh embodiment, the memory deformable element 15 is formed by two bar-shaped metal materials of different thermal expansion coefficients. The memory deformable element 15 has one end fixed to a side edge of the inner wall of the air outlet 12, and the other end movably connected to the fin 13. For example, the memory deformable element 15 is inserted in a guide rod 134 of the fin 13 with a pillar 151. Thereby, when the memory deformable element 15 is heated, the two metal materials expand in different degrees due to their different thermal expansion coefficients, such that the memory deformable element 15 bend toward the end of the metal material with a lower thermal expansion coefficient when heated, so as to pull the fins 13 to swing. Further, the actuation member 14 drives the fins 13 to swing together to a working angle. Meanwhile, this embodiment can also change the air exhaustion direction according to the temperature, and after the normal temperature is restored, the memory deformable element 15 can automatically return to its original state to pull the fins 13 back to the normal angle.

Claims

1. An air guiding structure, disposed on an air outlet of an electronic device, the air guiding structure comprising:

a plurality of fins, mounted in the air outlet and capable of rotating; and

a memory deformable element, having one end fixed to the electronic device, and the other end connected to one of the fins, such that the memory deformable element pulls the fins to swing together when deforming because of heat.

2. The air guiding structure according to claim 1, further comprising an actuation member connected to the fins, so as to drive the fins to swing together.

3. The air guiding structure according to claim 2, wherein a connection portion is disposed on each fin, a plurality of ferrules respectively corresponding to the connection portions is disposed on the actuation member, the connection portions of the fins are respectively pivoted to the ferrules, such that the fins are capable of rotating together.

4. The air guiding structure according to claim 1, further comprising a restoring element with one end disposed on a side edge of an inner wall of the air outlet, and the other end connected to the outermost fin on a side opposite to the memory deformable element, wherein the memory deformable element has an expanded and deformed state at a normal temperature and a contracted original state when heated, such that the fins remain at a normal angle and swing to a working angle respectively, and the restoring element restores the memory deformable element to the expanded and deformed state at the normal temperature.

5. The air guiding structure according to claim 1, wherein a plurality of dowel holes is respectively disposed at top and bottom of an inner wall of the air outlet, a pair of rotating shafts is respectively disposed at top and bottom of each fin, and the fins swing by fitting the rotating shafts into the dowel holes.

6. The air guiding structure according to claim 5, wherein each fin has a mean line, and a distance from a place where the memory deformable element is connected to the fin to the rotating shaft is smaller than a distance from the place where the memory deformable element is connected to the fin to the mean line.

7. The air guiding structure according to claim 5, wherein each fin has a mean line, and a distance from a place where the memory deformable element is connected to the fin to the rotating shaft is equal to a distance from the place where the memory deformable element is connected to the fin to the mean line.

8. The air guiding structure according to claim 5, wherein each fin has a mean line, and a distance from a place where the memory deformable element is connected to the fin to the rotating shaft is greater than a distance from the place where the memory deformable element is connected to the fin to the mean line.

9. The air guiding structure according to claim 1, further comprising a heat conductive member with one end connected to the memory deformable element and the other end connected to a heatsink of the electronic device.

10. The air guiding structure according to claim 1, wherein one of the fins has a pull-rod, and the memory deformable element has one end connected to the pull-rod and the other end fixed to a heat dissipation element of the electronic device.

11. An air guiding structure, disposed on an air outlet of an electronic device, the air guiding structure comprising:

a plurality of fins, mounted in the air outlet and capable of rotating;

an actuation member, connected to the fins; and

a memory deformable element, having one end fixed to the electronic device, and the other end connected to the actuation member, such that the memory deformable element pulls the fins to swing together when deforming because of heat.

12. The air guiding structure according to claim 11, wherein a connection portion is disposed on each fin, a plurality of ferrules respectively corresponding to the connection portions is disposed on the actuation member, the connection portions of the fins are respectively pivoted to the ferrules, such that the fins are capable of rotating together.

13. The air guiding structure according to claim 11, further comprising a restoring element with one end disposed on a side edge of an inner wall of the air outlet, and the other end connected to the outermost fin on a side opposite to the memory deformable element, wherein the memory deformable element has an expanded and deformed state at a normal temperature and a contracted original state when heated, so that the fins remain at a normal angle and swing to a working angle respectively, and the restoring element restores the memory deformable element to the expanded and deformed state at the normal temperature.

14. The air guiding structure according to claim 11, wherein a plurality of dowel holes is respectively disposed at top and bottom of an inner wall of the air outlet, a pair of rotating shafts is respectively disposed at top and bottom of each fin, and the fins swing by fitting the rotating shafts into the dowel holes.

15. The air guiding structure according to claim 11, further comprising a heat conductive member with one end connected to the memory deformable element and the other end connected to a heatsink of the electronic device.

16. The air guiding structure according to claim 11, wherein one of the fins has a pull-rod, and the memory deformable element has one end connected to the pull-rod and the other end fixed to a heat dissipation element of the electronic device.