Flat-plate loop heat conduction device and manufacturing method thereof

Abstract

A flat-plate loop heat conduction device and a manufacturing method thereof. The flat-plate loop heat conduction device includes an upper flat plate and a lower flat plate overlapping and mating with each other. Complementary partial evaporation sections, partial vapor transfer pipes, partial condensing sections and partial condensing transfer pipes are disposed on the upper and lower flat plates. After the upper and lower flat plates are mated with each other, a complete evaporation section, a complete condensing section, a complete vapor transfer pipe and a complete condensing transfer pipe are formed in communication with each other to achieve a heat conduction loop structure for a working fluid to circulate therein. The flat-plate loop heat conduction device is easier to manufacture. Moreover, the flat-plate loop heat conduction device has reinforced structure and is not subject to damage.

Description

BACKGROUND OF THE INVENTION

The present invention relates generally to a heat conduction device, and more particularly to a flat-plate loop heat conduction device and a manufacturing method thereof.

It is known that loop heat pipe is a heat dissipation device often applied to various electronic components, notebook computers, LED lighting systems, televisions, mechanical equipments, etc.

FIG. 1 shows a conventional loop heat pipe structure 10 including an evaporation section 12 with internal capillary structure, a compensation chamber 14 and a condensing section 16 arranged on a metal board. These components are connected with vapor transfer pipe 17 and condensing transfer pipe 18 to form a closed loop structure within which a working fluid flows. The evaporation section 12 serves to absorb heat transferred from a heat source. The working fluid in the evaporation section 12 will absorb the heat and phase-change into vapor. The vapor is transferred through the vapor transfer pipe 17 to the condensing section 16. In the condensing section 16, the working fluid is condensed and phase-changed back into liquid. Then the capillary structure of the evaporation section 12 applies capillary attraction to the liquid, whereby the liquid flows back into the evaporation section 12 to complete a circulation loop.

The conventional loop heat pipe 10 has very fine structure so that it is hard to mass-produce such loop heat pipe 10. Moreover, the evaporation section 12, the vapor transfer pipe 17 and the condensing transfer pipe 18 are generally positioned outside the metal board of the condensing section 16. That is, only the condensing section 16 is supported by the metal board 161, while other components are not supported by any support structure. As a result, the structure is not rigid enough as a whole. Therefore, when installing the loop heat pipe into an electronic device or uninstalling the loop heat pipe therefrom, an operator must be very careful so as not to damage the loop heat pipe.

SUMMARY OF THE INVENTION

It is therefore a primary object of the present invention to provide a flat-plate loop heat conduction device and a manufacturing method thereof. The flat-plate loop heat conduction device is composed of at least two flat plates overlapping and mating with each other. The flat-plate loop heat conduction device has simplified structure and is easier to manufacture.

To achieve the above and other objects, the flat-plate loop heat conduction device of the present invention includes an upper flat plate and a lower flat plate overlapping and mating with each other. Complementary partial evaporation sections, partial vapor transfer pipes, partial condensing sections and partial condensing transfer pipes are disposed on the mating faces of the upper and lower flat plates. The partial vapor transfer pipes are respectively connected to one end of the partial evaporation section and one end of the partial condensing section. The partial condensing transfer pipes are respectively connected to the other end of the partial evaporation section and the other end of the partial condensing section. Capillary structures are disposed on inner surfaces of the partial evaporation sections and the partial condensing transfer pipes of the upper and lower flat plates. After the upper and lower flat plates are mated with each other, a complete evaporation section, a complete condensing section, a complete vapor transfer pipe and a complete condensing transfer pipe are formed in communication with each other to achieve a loop structure within which a working fluid can circulate.

The manufacturing method of the flat-plate loop heat conduction device of the present invention includes steps of: preparing an upper flat plate and a lower flat plate; forming complementary partial evaporation sections, partial vapor transfer pipes, partial condensing sections and partial condensing transfer pipe on the upper and lower flat plates by means of etching, electroplating or laser processing, the partial vapor transfer pipes being respectively connected to one end of the partial evaporation sections and one end of the partial condensing sections, the partial condensing transfer pipes being respectively connected to the other end of the partial evaporation sections and the other end of the partial condensing sections, capillary structures being formed on inner surfaces of the partial evaporation sections and the partial condensing transfer pipes by means of die-casting, etching, electroplating or laser processing; and mating the upper and lower flat plates with each other to form a complete evaporation section, a complete condensing section, a complete vapor transfer pipe and a complete condensing transfer pipe between the mating faces of the upper and lower flat plates in communication with each other, whereby a loop structure is achieved for a working fluid to circulate therewithin.

The present invention can be best understood through the following description and accompanying drawings wherein:

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 is a perspective view of a conventional loop heat pipe;

FIG. 2 is a perspective assembled view of the flat-plate loop heat conduction device of the present invention;

FIG. 3 is a perspective exploded view of the flat-plate loop heat conduction device of the present invention;

FIG. 4 is a sectional view of the flat-plate loop heat conduction device of the present invention;

FIG. 5 is a sectional view taken along line A-A of FIG. 4, showing the capillary structures formed on the inner surface of the evaporation section;

FIG. 6 is a sectional view taken along line B-B of FIG. 4, showing the capillary structures formed on the inner surface of the winding passage; and

FIG. 7 is a flow chart of the manufacturing method of the flat-plate loop heat conduction device of the present invention.

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

Please refer to FIG. 2, which is a perspective view of the flat-plate loop heat conduction device of the present invention. The flat-plate loop heat conduction device 20 includes an upper flat plate 22 and a lower flat plate 24. The thickness of the upper and lower flat plates 22, 24 ranges from 0.05 cm to 20 cm. The upper and lower flat plates 22, 24 can be made of metal, alloy or ceramic material.

Please refer to FIG. 3, which shows the structures of the upper and lower flat plates 22, 24. The upper and lower flat plates 22, 24 respectively have complementary partial evaporation sections 261, 262, partial vapor transfer pipes 281, 282, partial condensing sections 301, 302 and partial condensing transfer pipes 321, 322. The inlet ends 2810, 2820 and outlet ends 2811, 2821 of the partial vapor transfer pipes 281, 282 are respectively connected to the outlet ends 2611, 2621 of the partial evaporation sections 261, 262 and the inlet ends 3010, 3020 of the partial condensing sections 301, 302. The inlet ends 3210, 3220 of the partial condensing transfer pipes 321, 322 are respectively connected to the outlet ends 3011, 3021 of the partial condensing sections 301, 302 and the inlet ends 2610, 2620 of the partial evaporation sections 261, 262. In addition, partial winding passages 341, 342 are arranged in the partial condensing sections 301, 302. Two ends of the partial winding passages 341, 342, that is, the inlet end 3010 and the outlet end 3011, are respectively connected to the partial vapor transfer pipes 281, 282 and the inlet ends 3210, 3220 of the partial condensing transfer pipes 321, 322. The other parts of the flat plates 22, 24 are flat sealingly connected sections 23, 25.

According to the above arrangement, when the upper and lower flat plates 22, 24 are mated with and attached to each other as shown in FIG. 2, a complete flat-plate loop heat conduction device 20 is achieved. In the flat-plate loop heat conduction device 20 are formed a complete evaporation section 26, a complete vapor transfer pipe 28, a complete condensing section 30, a complete condensing transfer pipe 32 and a complete winding passage 34. Accordingly, a working fluid can circulate within the flat-plate loop heat conduction device 20 for heat exchange as shown in FIG. 2.

Please further refer to FIGS. 4, 5 and 6. On the upper and lower flat plates 22, 24, capillary structures 38 are disposed on inner surfaces of the partial evaporation sections 261, 262, the partial condensing transfer pipes 321, 322 and the partial winding passages 341, 342 of the partial condensing sections 301, 302. FIGS. 5 and 6 are sectional views taken along line A-A and line B-B of FIG. 4, showing the capillary structures of the evaporation section 26 and the winding passage 34 of the condensing section 30. The capillary structures 38 are formed with multiple channels or filled with sintered metal powder or ceramic powder. Alternatively, the capillary structures 38 are meshed texture or any other suitable porous structure for achieving capillarity.

When the evaporation section 26 absorbs the heat transferred from the heat source, the working fluid in the evaporation section 26 will absorb the heat and phase-change into vapor phase. The vapor-phase working fluid flows through the vapor transfer pipe 28 into the condensing section 30. Thereafter, the vapor-phase working fluid is condensed and phase-changed back into liquid-phase working fluid. Then the internal capillary structures of the condensing section 30, the condensing transfer pipe 32 and the evaporation section 26 apply capillary attraction to the liquid-phase working fluid. Accordingly, the liquid-phase working fluid quickly flows back to the evaporation section 26 to complete a circulation loop and achieve heat dissipation effect.

The present invention includes at least one evaporation section 26 and at least one condensing section. The number of the evaporation section 26 can be increased according to the requirement of the heat source. In this case, one condensing section 30 is for multiple evaporation sections 26. Multiple radiating fins (not shown) can be disposed at the condensing section 30 to enhance condensing effect.

Please now refer to FIG. 7, which is a flow chart of the manufacturing method of the flat-plate loop heat conduction device of the present invention. The method includes steps S1, S2, and S3. In step S1, at least two flat plates are prepared, that is, an upper flat plate and a lower flat plate. By means of etching, electroplating or laser processing, the upper and lower flat plates are formed with complementary partial evaporation sections, partial vapor transfer pipes, partial condensing sections and partial condensing transfer pipes. Complementary partial winding passages are arranged in the partial condensing sections. The partial winding passages can be combined into a complete winding passage. The partial vapor transfer pipes are respectively connected to first ends of the partial evaporation sections and the partial condensing sections. The partial condensing transfer pipes are respectively connected to second ends of the partial evaporation sections and the partial condensing sections. Two ends of the partial winding passages are respectively connected to the partial vapor transfer pipes and the partial condensing transfer pipes. In step S2, by means of die-casting, etching, electroplating or laser processing, capillary structures are formed on inner surfaces of the partial evaporation sections, the partial condensing transfer pipes and the partial winding passages. The capillary structures are formed with multiple channels or filled with sintered metal powder or ceramic powder. Alternatively, the capillary structures are formed of any other suitable porous material. Finally, in step S3, by means of thermal ultrasonic welding, laser sealing or metal/nonmetal adhesion, the upper and lower flat plates are mated with each other to form a complete flat-plate loop heat conduction device. In the flat-plate loop heat conduction device are formed a complete evaporation section, a complete condensing section, a complete vapor transfer pipe, a complete condensing transfer pipe and a complete winding passage in communication with each other. A working fluid can circulate within the flat-plate loop heat conduction device. In order to enhance the condensing effect of the condensing section, multiple radiating fins can be disposed at the condensing section.

Alternatively, the flat-plate loop heat conduction device can include three or more flat plates, which are connected with each other to form the complete circulation loop.

According to the above arrangement, the heat conduction structure of the present invention is composed of at least two flat plates. This facilitates processing and reduces difficulty in manufacturing of the capillary structures. Accordingly, the present invention can be more easily manufactured.

The above embodiments are only used to illustrate the present invention, not intended to limit the scope thereof. Many modifications of the above embodiments can be made without departing from the spirit of the present invention.

Claims

1. A flat-plate loop heat conduction device at least comprising an upper flat plate and a lower flat plate overlapping and mating with each other, on a mating face of at least one of the upper and lower flat plates being disposed at least one partial evaporation section, one partial vapor transfer pipe, one partial condensing section and one partial condensing transfer pipe, two ends of the partial vapor transfer pipe being respectively connected to one end of the partial evaporation section and one end of the partial condensing section, two ends of the partial condensing transfer pipe being respectively connected to the other end of the partial evaporation section and the other end of the partial condensing section, whereby after the upper and lower flat plates are mated with each other, a complete evaporation section, a complete condensing section, a complete vapor transfer pipe and a complete condensing transfer pipe are formed between the mating faces of the upper and lower flat plates in communication with each other to achieve a loop structure within which a working fluid can circulate.

2. The flat-plate loop heat conduction device as claimed in claim 1, wherein complementary partial winding passages are arranged in the partial condensing sections of the upper and lower flat plates, two ends of the partial winding passages being respectively connected to the partial vapor transfer pipes and the partial condensing transfer pipes, capillary structures being disposed on inner surfaces of the partial winding passages.

3. The flat-plate loop heat conduction device as claimed in claim 1, wherein capillary structures are disposed on inner surfaces of at least one of the evaporation section, the condensing section, the vapor transfer pipe and the condensing transfer pipe.

4. The flat-plate loop heat conduction device as claimed in claim 2, wherein capillary structures are disposed on inner surfaces of at least one of the evaporation section, the condensing section, the vapor transfer pipe and the condensing transfer pipe.

5. The flat-plate loop heat conduction device as claimed in claim 3, wherein the capillary structures are formed with multiple channels.

6. The flat-plate loop heat conduction device as claimed in claim 3, wherein the capillary structures are filled with sintered metal powder or ceramic powder to form porous structures.

7. The flat-plate loop heat conduction device as claimed in claim 1, wherein there are multiple evaporation sections and one condensing section.

8. The flat-plate loop heat conduction device as claimed in claim 2, wherein there are multiple evaporation sections and one condensing section.

9. The flat-plate loop heat conduction device as claimed in claim 3, wherein there are multiple evaporation sections and one condensing section.

10. The flat-plate loop heat conduction device as claimed in claim 1, wherein the upper and lower flat plates have a thickness ranging from 0.05 cm to 20 cm.

11. The flat-plate loop heat conduction device as claimed in claim 2, wherein the upper and lower flat plates have a thickness ranging from 0.05 cm to 20 cm.

12. The flat-plate loop heat conduction device as claimed in claim 3, wherein the upper and lower flat plates have a thickness ranging from 0.05 cm to 20 cm.

13. The flat-plate loop heat conduction device as claimed in claim 7, wherein the upper and lower flat plates have a thickness ranging from 0.05 cm to 20 cm.

14. The flat-plate loop heat conduction device as claimed in claim 1, wherein the upper and lower flat plates are made of at least one of the following materials: metal, alloy, ceramic material and silicon.

15. The flat-plate loop heat conduction device as claimed in claim 2, wherein the upper and lower flat plates are made of at least one of the following materials: metal, alloy, ceramic material and silicon.

16. The flat-plate loop heat conduction device as claimed in claim 3, wherein the upper and lower flat plates are made of at least one of the following materials: metal, alloy, ceramic material and silicon.

17. The flat-plate loop heat conduction device as claimed in claim 1, wherein radiating fins are disposed at the condensing section.

18. The flat-plate loop heat conduction device as claimed in claim 2, wherein radiating fins are disposed at the condensing section.

19. The flat-plate loop heat conduction device as claimed in claim 3, wherein radiating fins are disposed at the condensing section.

20. The flat-plate loop heat conduction device as claimed in claim 10, wherein radiating fins are disposed at the condensing section.

21. A manufacturing method of a flat-plate loop heat conduction device, comprising steps of:

preparing an upper flat plate and a lower flat plate;

forming complementary partial evaporation sections, partial vapor transfer pipes, partial condensing sections and partial condensing transfer pipe on mating faces of the upper and lower flat plates respectively, two ends of the partial vapor transfer pipes being respectively connected to one end of the partial evaporation sections and one end of the partial condensing sections, two ends of the partial condensing transfer pipes being respectively connected to the other end of the partial evaporation sections and the other end of the partial condensing sections; and

mating the upper and lower flat plates with each other to form a complete evaporation section, a complete condensing section, a complete vapor transfer pipe and a complete condensing transfer pipe between the mating faces of the upper and lower flat plates in communication with each other, whereby a loop structure is achieved for a working fluid to circulate therewithin.

22. The manufacturing method of the flat-plate loop heat conduction device as claimed in claim 19, wherein complementary partial winding passages are arranged in the partial condensing sections of the upper and lower flat plates, two ends of the partial winding passages being respectively connected to the partial vapor transfer pipes and the partial condensing transfer pipes.

23. The manufacturing method of the flat-plate loop heat conduction device as claimed in claim 21, wherein capillary structures are disposed on inner surfaces of at least one of the evaporation section, the condensing section, the vapor transfer pipe and the condensing transfer pipe.

24. The manufacturing method of the flat-plate loop heat conduction device as claimed in claim 23, wherein the capillary structures are formed with multiple channels.

25. The manufacturing method of the flat-plate loop heat conduction device as claimed in claim 23, wherein before mating the upper and lower flat plates with each other, the capillary structures are filled with sintered metal powder or ceramic powder to form porous structures.

26. The manufacturing method of the flat-plate loop heat conduction device as claimed in claim 24, wherein the capillary structures are filled with sintered metal powder or ceramic powder to form porous structures.

27. The manufacturing method of the flat-plate loop heat conduction device as claimed in claim 23, wherein the capillary structures are formed by means of die-casting, etching, electroplating or laser processing.

28. The manufacturing method of the flat-plate loop heat conduction device as claimed in claim 25, wherein the capillary structures are formed by means of die-casting, etching, electroplating or laser processing.

29. The manufacturing method of the flat-plate loop heat conduction device as claimed in claim 21, wherein the upper and lower flat plates are mated with each other by means of thermal ultrasonic welding, laser sealing or metal/nonmetal adhesion.

30. The manufacturing method of the flat-plate loop heat conduction device as claimed in claim 22, wherein the upper and lower flat plates are mated with each other by means of thermal ultrasonic welding, laser sealing or metal/nonmetal adhesion

31. The manufacturing method of the flat-plate loop heat conduction device as claimed in claim 23, wherein the upper and lower flat plates are mated with each other by means of thermal ultrasonic welding, laser sealing or metal/nonmetal adhesion.

32. The manufacturing method of the flat-plate loop heat conduction device as claimed in claim 25, wherein the upper and lower flat plates are mated with each other by means of thermal ultrasonic welding, laser sealing or metal/nonmetal adhesion.

33. The manufacturing method of the flat-plate loop heat conduction device as claimed in claim 27, wherein the upper and lower flat plates are mated with each other by means of thermal ultrasonic welding, laser sealing or metal/nonmetal adhesion.

34. The manufacturing method of the flat-plate loop heat conduction device as claimed in claim 21, wherein the upper and lower flat plates have a thickness ranging from 0.05 cm to 20 cm.

35. The manufacturing method of the flat-plate loop heat conduction device as claimed in claim 22, wherein the upper and lower flat plates have a thickness ranging from 0.05 cm to 20 cm.

36. The manufacturing method of the flat-plate loop heat conduction device as claimed in claim 23, wherein the upper and lower flat plates have a thickness ranging from 0.05 cm to 20 cm.

37. The manufacturing method of the flat-plate loop heat conduction device as claimed in claim 21, wherein the upper and lower flat plates are made of at least one of the following materials: metal, alloy, ceramic material and silicon.

38. The manufacturing method of the flat-plate loop heat conduction device as claimed in claim 22, wherein the upper and lower flat plates are made of at least one of the following materials: metal, alloy, ceramic material and silicon.

39. The manufacturing method of the flat-plate loop heat conduction device as claimed in claim 23, wherein the upper and lower flat plates are made of at least one of the following materials: metal, alloy, ceramic material and silicon.

40. The manufacturing method of the flat-plate loop heat conduction device as claimed in claim 25, wherein the upper and lower flat plates are made of at least one of the following materials: metal, alloy, ceramic material and silicon.

41. The manufacturing method of the flat-plate loop heat conduction device as claimed in claim 27, wherein the upper and lower flat plates are made of at least one of the following materials: metal, alloy, ceramic material and silicon.

42. The manufacturing method of the flat-plate loop heat conduction device as claimed in claim 28, wherein the upper and lower flat plates are made of at least one of the following materials: metal, alloy, ceramic material and silicon.

43. The manufacturing method of the flat-plate loop heat conduction device as claimed in claim 21, wherein radiating fins are disposed at the condensing section.

44. The manufacturing method of the flat-plate loop heat conduction device as claimed in claim 22, wherein radiating fins are disposed at the condensing section.

45. The manufacturing method of the flat-plate loop heat conduction device as claimed in claim 23, wherein radiating fins are disposed at the condensing section.

46. The manufacturing method of the flat-plate loop heat conduction device as claimed in claim 25, wherein radiating fins are disposed at the condensing section.

47. The manufacturing method of the flat-plate loop heat conduction device as claimed in claim 27, wherein radiating fins are disposed at the condensing section.

48. The manufacturing method of the flat-plate loop heat conduction device as claimed in claim 28, wherein radiating fins are disposed at the condensing section.