Ground heating flooring with internal heating conduction structure

A ground heating flooring with internal heat conduction structure includes a flooring body, a plurality of heat conduction mediums, a heating pipe, an upper locking member and a lower locking member. Each of the heat conduction mediums, provided within the flooring body, one end of which contacts with the heating pipe such that a heat within the heating pipe is conducted directly and distributed rapidly all around the flooring. The upper locking member, provided at a side of the flooring body, defines an upper protruding supporting cavity. The lower locking member, provided at an opposite side of the flooring body, defines a lower concaved supporting cavity. When an upper locking member of a flooring is engaged with a lower locking member of an adjacent flooring, the upper supporting cavity is fitted into the lower supporting cavity for forming an accommodating chamber to receive the heating pipe therein.

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Description
BACKGROUND OF THE PRESENT INVENTION

1. Field of Invention

The present invention relates to a flooring, and more particularly to a ground heating flooring with internal heat conduction structure.

2. Description of Related Arts

With the development of the heating technology, the traditional heating technology has been changed. The floor heating becomes a popular trend instead. Accordingly, the ground heating flooring emerges as the times require. Nowadays, the wood composite flooring and the laminate flooring on the market dissipate primarily heat by the wood itself. Low thermal conduction factor and slow speed of heat conduction of the wood result in high thermal energy consumption of the ground heating. Only the material itself of the traditional ground heating flooring is suitable for the floor heating. That is to say, the traditional ground heating flooring is not a special ground heating flooring in fact. Furthermore, the above mentioned flooring is mainly floored on the ground in such a manner that the cement layer of the ground is firstly heated, and then the heat is conducted to the flooring on the ground. As a result, the continuous heating has a longer time, and is run at low temperature. Most heat is absorbed by the ground and walls, so a lot of energy is consumed.

Therefore, a China patent with a publication number “CN 1693626” called as “Laminate Ground Heating Flooring”, which comprises an upper board, a lower board, a core board and a bottom board, wherein a transverse thermal conduction groove is provided within the core board, a longitudinal thermal conduction groove is provided within the bottom board. The transverse thermal conduction groove and the longitudinal thermal conduction groove are filled with a heat conduction agent. The number of the longitudinal thermal conduction groove is two, wherein a distance between the two longitudinal thermal conduction grooves is 20-35 mm. The laminate ground heating flooring has a plurality of transverse thermal conduction grooves, wherein a distance between the adjacent two transverse thermal conduction grooves is 25-40 mm. The heat conduction agent is made of aluminium or copper.

However, the above mentioned China patent has several drawbacks. Firstly, the heat conduction of the flooring depends on geothermal layer of the ground so that the heat loss is still high. Secondly, a thickness of the flooring is large without saving space.

Consequently, it is necessary to provide a flooring with low heat loss, and small pavement thickness.

SUMMARY OF THE PRESENT INVENTION

An object of the present invention is to provide a ground heating flooring with internal heat conduction structure, which conducts directly the heat within a heating pipe to the interior of a flooring body through a plurality of heat conduction mediums provided within the flooring body.

Another object of the present invention is to provide a ground heating flooring with internal heat conduction structure, comprising an upper F-shaped locking member at a side of the flooring body, and a lower F-shaped locking member at an opposite side of the flooring body, wherein the upper F-shaped locking member and the lower F-shaped locking member defines an upper protruding supporting cavity and a lower concaved supporting cavity respectively, in such a manner that when two adjacent floorings are engaged with each other, an upper protruding supporting cavity of a flooring and a lower concaved supporting cavity of an adjacent flooring form an accommodating chamber for receiving the heating pipe therein so that the heating pipe is inserted into the two adjacent floorings so as to avoid the heating pipe contacting directly with the ground to not only reduce heat loss but also reduce pavement thickness.

Another object of the present invention is to provide a ground heating flooring with internal heat conduction structure, wherein when two adjacent floorings are engaged with each other, the upper F-shaped locking member is engaged with the lower F-shaped locking member to lock up and position the two adjacent floorings.

Another object of the present invention is to provide a ground heating flooring with internal heat conduction structure, comprising a heat insulation layer, provided at a bottom of the flooring body to further reduce heat loss.

Another object of the present invention is to provide a ground heating flooring with internal heat conduction structure with low cost and simple structure.

Accordingly, in order to accomplish the above objects, the present invention provides a ground heating flooring with internal heat conduction structure, comprising:

a flooring body;

a plurality of heat conduction mediums, each of which provided within the flooring body;

a heating pipe contacting with one end of each of the heat conduction mediums;

an upper locking member at one side of the flooring body, defining an upper protruding supporting cavity; and

a lower locking member at an opposite side of the flooring body, defining a lower concaved supporting cavity, wherein the heating pipe is provided transversely within the lower concaved supporting cavity, in such a manner that when the upper locking member of one flooring body is engaged with the lower locking member of an adjacent flooring body, the upper protruding supporting cavity is fitted into the lower concaved supporting cavity for forming an accommodating chamber to receive the heating pipe therein so that the heating pipe is inserted into two adjacent floorings, and a heat is conducted directly from the heating pipe to each of the heat conduction mediums so as to rapidly transmit and distribute the heat all around the ground heating flooring for effectively increasing a temperature thereof to reduce a heat loss and pavement thickness.

These and other objectives, features, and advantages of the present invention will become apparent from the following detailed description, the accompanying drawings, and the appended claims.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 is a perspective view of a ground heating flooring with internal heat conduction structure according to a preferred embodiment of the present invention.

FIG. 2 is a local section of the ground heating flooring with internal heat conduction structure according to the above preferred embodiment of the present invention.

FIG. 3 is a schematic diagram of installing at a side of the ground heating flooring with internal heat conduction structure according to the above preferred embodiment of the present invention.

FIG. 4 is an alternative mode of the upper and lower F-shaped locking members of the ground heating flooring with internal heat conduction structure according to the above preferred embodiment of the present invention.

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENT

Referring to FIGS. 1 to 3 of the drawings, a ground heating flooring with internal heat conduction structure according to a preferred embodiment of the present invention is illustrated. The ground heating flooring comprises a flooring body 10, a plurality of heat conduction mediums 20, a heating pipe 30, an upper locking member 40 and a lower locking member 50.

Each of the heat conduction mediums 20, provided within the flooring body 10, one end of which contacts with the heating pipe 30, in such a manner that a heat within the heating pipe 30 is conducted directly and distributed rapidly all around the flooring to prevent the heat out of the flooring.

The upper locking member 40, provided at a side of the flooring body 10, defines an upper protruding supporting cavity 41. The lower locking member 50, provided at an opposite side of the flooring body 10, defines a lower concaved supporting cavity 51, wherein the heating pipe 30 is provided transversely within the lower concaved supporting cavity 51. When an upper locking member 40 of a flooring is engaged with a lower locking member 50 of an adjacent flooring, the upper protruding supporting cavity 41 is fitted into the lower concaved supporting cavity 51 for forming an accommodating chamber to receive the heating pipe 30 therein so that the heating pipe 30 is inserted into two adjacent floorings. As a result, a heat is conducted directly from the heating pipe 30 to each of the heat conduction mediums 20, and distributed rapidly all round of the flooring so as to increase effectively a temperature of the flooring to avoid the heat loss out of the flooring. Furthermore, the heating pipe 30 is inserted into two adjacent floorings to reduce a pavement thickness of the flooring.

Furthermore, the upper locking member 40 is F-shaped, a vertical cross-section of which is downwards thwart F-shaped. Accordingly, the lower locking member 50 is F-shaped, a vertical cross-section of which is upwards thwart F-shaped, in such a manner that the upper locking member 40 of a flooring is engaged with the lower locking member 50 of an adjacent flooring during a flooring procedure to sufficiently position the heating pipe 30 within the accommodating chamber and lock up two adjacent ground heating floorings.

Furthermore, each of the heat conduction mediums 20 is aligned with each other to conduct the heat directly from the heating pipe 30 to each of the heat conduction mediums 20, and distributed rapidly all round of the flooring so as to increase effectively a temperature of the flooring to avoid the heat loss out of the flooring.

It is worth to mention that the upper protruding supporting cavity 41 and the lower concaved supporting cavity 51 can be arched, square, trapezoidal or the like, as shown in FIG. 4.

Furthermore, the ground heating flooring further comprises a heat insulation layer 60 provided at a bottom of the flooring body 10 and the lower locking member 50 to reduce a heat loss.

In the above preferred embodiment of the present invention, each of the heat conduction mediums 20 consists of Nanometer Aluminum Nitride powder, Nanometer Carbon Fiber powder and resin, or consists of a wire, net or slice made of metal or alloy, and resin. Also, each of the heat conduction mediums can be other materials with good thermal conductivity.

In the above preferred embodiment of the present invention, the heat insulation layer 60, made of porous silicon dioxide insulation composite, consists of SiO2, TiO2, Al2O3, Fe2O3, FeO, MnO3, CaO, MgO, K2O, and Na2O. Also, the heat insulation layer is made of other composite materials with good thermal insulation property.

In the above preferred embodiment of the present invention, the ground heating flooring with internal heat conduction structure without thermal insulation materials having harmful chemical components, such as a polystyrene board, reduces the volatilization of harmful substance to provide a fine environment.

Furthermore, the ground heating flooring has a small pavement thickness to comfort the interior space. A pavement thickness of the traditional ground heating flooring is 7-8 cm, but that of the present invention is 1.5-2 cm.

One skilled in the art will understand that the embodiment of the present invention as shown in the drawings and described above is exemplary only and not intended to be limiting.

It will thus be seen that the objects of the present invention have been fully and effectively accomplished. It embodiments have been shown and described for the purposes of illustrating the functional and structural principles of the present invention and is subject to change without departure from such principles. Therefore, this invention includes all modifications encompassed within the spirit and scope of the following claims.

Claims

1. A ground heating flooring with internal heat conduction structure, comprising:

a flooring body;
a plurality of heat conduction mediums, each of which provided within said flooring body;
a heating pipe contacting with one end of each of said heat conduction mediums;
an upper locking member at a side of said flooring body, defining an upper protruding supporting cavity; and
a lower locking member at an opposite side of said flooring body, defining a lower concaved supporting cavity, wherein said heating pipe is provided transversely within said lower concaved supporting cavity, in such a manner that when said upper locking member of one flooring body is engaged with said lower locking member of an adjacent flooring body, said upper protruding supporting cavity is fitted into said lower concaved supporting cavity for forming an accommodating chamber to receive said heating pipe therein so that said heating pipe is inserted into two adjacent floorings, and a heat is conducted directly from said heating pipe to each of said heat conduction mediums so as to rapidly transmit and distribute said heat all around said ground heating flooring for effectively increasing a temperature thereof to reduce a heat loss and pavement thickness.

2. The ground heating flooring with internal heat conduction structure, as recited in claim 1, wherein said upper locking member is F-shaped, a vertical cross-section of which is downwards thwart F-shaped, wherein said lower locking member is F-shaped, a vertical cross-section of which is upwards thwart F-shaped, in such a manner that said upper locking member of a flooring is engaged with said lower locking member of an adjacent flooring during a flooring procedure to sufficiently position said heating pipe within said accommodating chamber and lock up two adjacent ground heating floorings.

3. The ground heating flooring with internal heat conduction structure, as recited in claim 1, wherein each of said heat conduction mediums is aligned with each other to conduct sufficiently said heat from said end of each of said heat conduction mediums to an interior of said ground heating flooring.

4. The ground heating flooring with internal heat conduction structure, as recited in claim 2, wherein each of said heat conduction mediums is aligned with each other to conduct sufficiently said heat from said end of each of said heat conduction mediums to an interior of said ground heating flooring.

5. The ground heating flooring with internal heat conduction structure, as recited in claim 1, further comprising a heat insulation layer provided at a bottom of said flooring body and lower locking member to reduce a heat loss.

6. The ground heating flooring with internal heat conduction structure, as recited in claim 2, further comprising a heat insulation layer provided at a bottom of said flooring body and lower locking member to reduce a heat loss.

7. The ground heating flooring with internal heat conduction structure, as recited in claim 3, further comprising a heat insulation layer provided at a bottom of said flooring body and lower locking member to reduce a heat loss.

8. The ground heating flooring with internal heat conduction structure, as recited in claim 4, further comprising a heat insulation layer provided at a bottom of said flooring body and lower locking member to reduce a heat loss.

9. The ground heating flooring with internal heat conduction structure, as recited in claim 5, wherein each of said heat conduction mediums consists of Nanometer Aluminum Nitride powder, Nanometer Carbon Fiber powder and resin.

10. The ground heating flooring with internal heat conduction structure, as recited in claim 6, wherein each of said heat conduction mediums consists of Nanometer Aluminum Nitride powder, Nanometer Carbon Fiber powder and resin.

11. The ground heating flooring with internal heat conduction structure, as recited in claim 7, wherein each of said heat conduction mediums consists of Nanometer Aluminum Nitride powder, Nanometer Carbon Fiber powder and resin.

12. The ground heating flooring with internal heat conduction structure, as recited in claim 8, wherein each of said heat conduction mediums consists of Nanometer Aluminum Nitride powder, Nanometer Carbon Fiber powder and resin.

13. The ground heating flooring with internal heat conduction structure, as recited in claim 5, wherein each of said heat conduction mediums consists of a wire, net or slice, and resin, wherein said wire, net or slice are made of metal or alloy.

14. The ground heating flooring with internal heat conduction structure, as recited in claim 6, wherein each of said heat conduction mediums consists of a wire, net or slice, and resin, wherein said wire, net or slice are made of metal or alloy.

15. The ground heating flooring with internal heat conduction structure, as recited in claim 7, wherein each of said heat conduction mediums consists of a wire, net or slice, and resin, wherein said wire, net or slice are made of metal or alloy.

16. The ground heating flooring with internal heat conduction structure, as recited in claim 8, wherein each of said heat conduction mediums consists of a wire, net or slice, and resin, wherein said wire, net or slice are made of metal or alloy.

17. The ground heating flooring with internal heat conduction structure, as recited in claim 6, wherein said heat insulation layer, made of porous silicon dioxide insulation composite, consists of SiO2, TiO2, Al2O3, Fe2O3, FeO, MnO3, CaO, MgO, K2O, and Na2O.

18. The ground heating flooring with internal heat conduction structure, as recited in claim 8, wherein said heat insulation layer, made of porous silicon dioxide insulation composite, consists of SiO2, TiO2, Al2O3, Fe2O3, FeO, MnO3, CaO, MgO, K2O, and Na2O.

19. The ground heating flooring with internal heat conduction structure, as recited in claim 12, wherein said heat insulation layer, made of porous silicon dioxide insulation composite, consists of SiO2, TiO2, Al2O3, Fe2O3, FeO, MnO3, CaO, MgO, K2O, and Na2O.

20. The ground heating flooring with internal heat conduction structure, as recited in claim 16, wherein said heat insulation layer, made of porous silicon dioxide insulation composite, consists of SiO2, TiO2, Al2O3, Fe2O3, FeO, MnO3, CaO, MgO, K2O, and Na2O.

Patent History
Publication number: 20100237157
Type: Application
Filed: Mar 21, 2009
Publication Date: Sep 23, 2010
Inventor: Zhaojun Guo (Shanghai)
Application Number: 12/408,693
Classifications
Current U.S. Class: Heated Floor (237/69)
International Classification: F24D 15/00 (20060101);