Heat Sink
The heat sink includes a fin set and a heat pipe. The fin set is composed of a plurality of fins and has an exposed area formed on one side thereof. The heat pipe penetrates through the fin set and the exposed area. A portion of the heat pipe is exposed and flattened in the exposed area. The exposed and flattened portion is used for connecting a heat generating device as a thermal junction surface.
This application is a continuation-in-part of U.S. patent application Ser. No. 11/492,660, filed Jul. 26, 2006.
BACKGROUND OF THE INVENTION1. Technical Field
The invention relates to heat sinks, particularly to heat sinks for electronic components.
2. Related Art
An object of the invention is to provide an improved heat sink, which makes a heat pipe be in direct contact with a heat generating device. Thus the heat from the device may be directly conducted to the heat pipe and the heat transfer efficiency can be increased.
To accomplish the above object, the heat sink of the invention includes a fin set and a heat pipe. The fin set is composed of a plurality of fins and has an exposed area formed on one side thereof. The heat pipe penetrates through the fin set and the exposed area. A portion of the heat pipe is exposed and flattened in the exposed area. The exposed and flattened portion is used for connecting a heat generating device as a thermal junction surface.
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The fin set 3 is composed of a plurality of fins. These fins are of two types: the first type fins 31 and the second type fins 32. All of the fins 31, 32 are spaced combined by spacers 33, 34. The second type fins 32 are smaller than the first type fins 31 in size and a group of the second type fins 32 are sandwiched by two groups of the first type fins 31. Therefore, an exposed area 30 may be formed on one side of the fin set 3.
The first type fins 31 are provided with at least one circular hole 311 for being penetrated by the heat pipe 4. The second type fins 32 are provided with at least one semicircular hole 321 for being penetrated by the heat pipe 4. The semicircular hole 321 is formed by the shortened fin size. Thus the exposed area 30 is formed. Preferably, the circular hole 311 or semicircular hole 321 may be provided with a surrounding wall 312, 322 for increasing thermo-conductivity between the heat pipe 4 and the fin set 3.
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Such alterations, modifications, and improvements are intended to be part of this disclosure, and are intended to be within the spirit and the scope of the present invention. Accordingly, the foregoing description is by way of example only and is not intended to be limiting. The present invention is limited only as defined in the following claims and the equivalents thereto.
Claims
1. A heat sink comprising:
- a fin set composed of a plurality of fins, having an exposed area formed on one side thereof; and
- at least one heat pipe, penetrating through the fin set and the exposed area, wherein a portion of the at least one heat pipe is exposed and flattened in the exposed area for directly attaching an electronic component to be mounted.
2. The heat sink of claim 1, wherein the at least one heat pipe is two or more in number, and the flattened portions of the heat pipes are coplanar.
3. The heat sink of claim 1, wherein the fins are of two types, the first type fins are separately provided with circular holes for being passed through by the at least one heat pipe, the second type fins are separately provided with semicircular holes for accommodating the at least one heat pipe, and the exposed portion of the at least one heat pipe is formed by the second type fins.
4. The heat sink of claim 3, wherein the second type fins are sandwiched between two groups of the first type fins.
5. The heat pipe of claim 3, wherein each of the circular holes and the semicircular holes is provided with a circular surrounding wall and a semicircular wall, respectively.
6. The heat sink of claim 1, wherein the exposed area is dented to form a recess in the fin set.
7. The heat sink of claim 1, wherein the exposed area is protrudent from the fin set.
8. The heat sink of claim 1, wherein the exposed area occupies a whole side of the fin set.
Type: Application
Filed: Mar 3, 2011
Publication Date: Sep 1, 2011
Inventor: Shyh-Ming Chen (New Taipei City)
Application Number: 13/040,244
International Classification: F28D 15/04 (20060101);