LEAD PROCESSING APPARATUS, METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE, AND LEAD PROCESSING DIE SET

Abstract

A lead processing apparatus includes a first die unit, a second die unit that is movable relative to the first die unit, a load transmitting portion that transmits a load to the second die unit, and a stopper mechanism that stops the movement of the second die unit in a direction in which the second die unit approaches the first die unit. The stopper mechanism includes a plurality of stroke stopper pairs each having a first stroke stopper fixed to the first die unit and a second stroke stopper that is fixed to the second die unit and comes into contact with the stopper to stop the movement of the second die unit. The load transmitting portion distributes a load to a plurality of load transmission positions and transmits a press load to the second die unit. Each load transmission position is arranged coaxially with the stroke stopper pair.

Description

This application is based on Japanese patent application NO. 2010-160298, the content of which is incorporated hereinto by reference.

BACKGROUND

1. Technical Field

The present invention relates to a lead processing apparatus, a method for manufacturing semiconductor device, and a lead processing die set.

2. Related Art

A press including an upper die and a lower die is used to process (for example, bend or cut) a lead of a semiconductor device.

The press is disclosed in, for example, Japanese Laid-Open Patent Publication No. 07-321273.

The press disclosed in Japanese Laid-Open Patent Publication No. 07-321273 includes a bending die (lower die) on which the semiconductor device is mounted, a cam having a tapered side surface, a cam spring that moves down the cam, a putt stopper that is fixed to the lower surface of the cam, a stopper block that is provided around the bending die, and a bending punch (upper die) having a roller at the upper end thereof.

A clamp pin that presses and clamps the semiconductor device from the upper side is provided in the cam. The cam is moved down to a position where the movement of the putt stopper is regulated by the stopper block by the cam spring and is then stopped at the position. In this stage, the semiconductor device is pressed and clamped to the bending die by the clamp pin.

In this state, when the bending punch is moved down to a predetermined height, the roller is moved along the tapered surface of the cam. Then, the lower end of the bending punch is rotated inward to a predetermined position with the movement of the roller, and the lower end clamps the lead to the bending die. In this way, the lead is pressed.

A protruding portion that protrudes downward is provided at the edge of the putt stopper. The stopper block is arranged so as to face the protruding portion of the putt stopper. The protruding portion of the putt stopper comes into contact with the stopper block to regulate the movement of the putt stopper in the downward direction.

The cam is disposed on the upper surface of a portion (hereinafter, referred to as a central portion) which is inside the protruding portion in the putt stopper. Therefore, the pressing force generated by the cam spring is applied to the upper surface of the central portion of the putt stopper.

SUMMARY

The present inventor has recognized as follows. In the technique disclosed in Japanese Laid-Open Patent Publication No. 07-321273, the pressing force generated by the cam spring is applied to the upper surface of the central portion of the putt stopper. The putt stopper is deformed (warped) such that the central portion is convex downward. In this way, the height at which the cam is stopped shifts from a desired height to the lower side by a value corresponding to the deformation and the position where the lower end of the bending punch is stopped also shifts from a desired position. As a result, the dimensions of the lead by pressing deviate from desired dimensions.

In short, in the technique disclosed in Japanese Laid-Open Patent Publication No. 07-321273, the accuracy of processing the lead is reduced due to the warping of the putt stopper due to the pressure of the cam spring.

As such, it is difficult to improve the accuracy of processing the lead of the semiconductor device.

In one embodiment, there is provided a lead processing apparatus including: a first die unit including an arrangement portion on which a semiconductor device having a main portion and a lead protruding from the main portion is arranged; a second die unit that is provided so as to be movable in a direction in which the second die unit approaches the first die unit and a direction in which the second die unit is separated from the first die unit and presses the lead in cooperation with the first die unit; a load transmitting portion that transmits a press load to the second die unit; and a stopper mechanism that stops the movement of the second die unit in the direction in which the second die unit approaches the first die unit. The stopper mechanism includes a plurality of stroke stopper pairs each having a first stroke stopper which is fixed to the first die unit and a second stroke stopper which is arranged so as to face the first stroke stopper, is fixed to the second die unit, and comes into contact with the first stroke stopper to stop the movement of the second die unit. The load transmitting portion distributes a load to a plurality of load transmission positions separated from each other and transmits the press load to the second die unit. Each of the load transmission positions is arranged coaxially with the stroke stopper pair.

According to the lead processing apparatus, the press load is transmitted to the second die unit through the load transmitting portion. The load transmitting portion distributes the load to the plurality of load transmission positions separated from each other and transmits the press load to the second die unit. In addition, each of the load transmission positions is arranged coaxially with the stroke stopper pair. According to this structure, it is possible to prevent the deformation of the second die unit due to the press load. Therefore, it is possible to prevent the relative position of the second die unit to the first die unit deviating from a desired position during pressing and thus improve the accuracy of processing the lead of the semiconductor device.

In another embodiment, there is provided a method for manufacturing semiconductor device including processing a lead of a semiconductor device using a lead processing apparatus. The lead processing apparatus includes a first die unit including an arrangement portion on which the semiconductor device having a main portion and the lead protruding from the main portion is arranged, a second die unit that is provided so as to be movable in a direction in which the second die unit approaches the first die unit and a direction in which the second die unit is separated from the first die unit and presses the lead in cooperation with the first die unit, a load transmitting portion that transmits a press load to the second die unit, and a stopper mechanism that stops the movement of the second die unit in the direction in which the second die unit approaches the first die unit. The stopper mechanism includes a plurality of stroke stopper pairs each having a first stroke stopper which is fixed to the first die unit and a second stroke stopper which is arranged so as to face the first stroke stopper, is fixed to the second die unit, and comes into contact with the first stroke stopper to stop the movement of the second die unit. The load transmitting portion distributes a load to a plurality of load transmission positions separated from each other and transmits the press load to the second die unit. Each of the load transmission positions is arranged coaxially with the stroke stopper pair. In the processing of the lead, the load transmitting portion distributes the load to the plurality of load transmission positions and transmits the press load to the second die unit.

In still another embodiment, there is provided a lead processing die set including: a first die unit including an arrangement portion on which a semiconductor device having a main portion and a lead protruding from the main portion is arranged; a second die unit that is provided so as to be movable in a direction in which the second die unit approaches the first die unit and a direction in which the second die unit is separated from the first die unit and presses the lead in cooperation with the first die unit; a load transmitting portion that transmits a press load to the second die unit; and a stopper mechanism that stops the movement of the second die unit in the direction in which the second die unit approaches the first die unit. The stopper mechanism includes a plurality of stroke stopper pairs each having a first stroke stopper which is fixed to the first die unit and a second stroke stopper which is arranged so as to face the first stroke stopper, is fixed to the second die unit, and comes into contact with the first stroke stopper to stop the movement of the second die unit. The load transmitting portion distributes a load to a plurality of load transmission positions separated from each other and transmits the press load to the second die unit. Each of the load transmission positions is arranged coaxially with the stroke stopper pair.

According to the embodiments of the invention, it is possible to improve the accuracy of processing a lead of a semiconductor device.

BRIEF DESCRIPTION OF THE DRAWINGS

The above and other objects, advantages and features of the present invention will be more apparent from the following description of certain preferred embodiments taken in conjunction with the accompanying drawings, in which:

FIG. 1 is a diagram illustrating a lead processing apparatus according to an embodiment;

FIG. 2 is a diagram illustrating the lead processing apparatus according to the embodiment;

FIG. 3 is a diagram illustrating the lead processing apparatus according to the embodiment;

FIGS. 4A and 4B are diagrams illustrating the lead processing apparatus according to the embodiment;

FIG. 5 is a plan view illustrating an upper holder;

FIG. 6 is a plan view illustrating a load transmitting portion;

FIGS. 7A to 7C are front cross-sectional views illustrating a bending die;

FIGS. 8A to 8C are diagrams illustrating the operation of a bending punch and a regulating member.

FIG. 9 is a bottom view illustrating the regulating member, a punch holder, and the bending punch;

FIGS. 10A and 10B are diagrams illustrating an example of a semiconductor device;

FIGS. 11A to 11C are diagrams illustrating an example of the procedure of a method for manufacturing semiconductor device using the lead processing apparatus according to the embodiment;

FIGS. 12A to 12C are diagrams illustrating another example of the procedure of the method for manufacturing semiconductor device according to the embodiment;

FIG. 13 is a plan view illustrating a load transmitting portion according to a modification; and

FIG. 14 is a diagram illustrating a lead processing apparatus according to a comparative example.

DETAILED DESCRIPTION

The invention will be now described herein with reference to illustrative embodiments. Those skilled in the art will recognize that many alternative embodiments can be accomplished using the teachings of the present invention and that the invention is no limited to the embodiments illustrated for explanatory purposes.

Hereinafter, exemplary embodiments of the invention will be described with reference to the accompanying drawings. In all of the drawings, the same components are denoted by the same reference numerals and a description thereof will not be repeated.

FIGS. 1 to 4B are diagrams illustrating a lead processing apparatus (lead processing die set) 100 according to an embodiment. FIG. 5 is a plan view illustrating an upper holder 21. FIG. 6 is a plan view illustrating a load transmitting portion 30. FIGS. 7A to 7C are front cross-sectional views illustrating a bending die 13. In the drawings, some components are not shown for ease of understanding of the drawings (which will be described in detail below).

The lead processing apparatus (lead processing die set) 100 according to this embodiment includes: a first die unit (lower unit 10) including an arrangement portion (for example, a lead receiving portion 15 and a concave portion 16) on which a semiconductor device 50 having a main portion 51 and leads 52 protruding from the main portion 51 is arranged; a second die unit (upper unit 20) that is provided so as to be movable in a direction in which the second die unit approaches the first die unit and a direction in which the second die unit is separated from the first die unit and presses the leads 52 in cooperation with the first die unit; a load transmitting portion 30 that transmits a press load to the second die unit; and a stopper mechanism 40 that stops the movement of the second die unit in the direction in which the second die unit approaches the first die unit. The stopper mechanism 40 includes a plurality of stroke stopper pairs 43 each having a first stroke stopper 41 that is fixed to the first die unit and a second stroke stopper 42 that is arranged so as to face the first stroke stopper 41, is fixed to the second die unit, and comes into contact with the first stroke stopper 41 to stop the movement of the second die unit. The load transmitting portion 30 distributes a load to a plurality of load transmission positions (for example, load transmission protrusions 32) which is separated from each other and transmits the press load to the second die unit. Each of the load transmission positions is arranged coaxially with the stroke stopper pair 43. This structure will be described in detail below.

The lead processing apparatus 100 according to this embodiment presses the lead 52 (FIGS. 10A and 10B) of the semiconductor device 50, which is a processing target.

FIGS. 10A and 10B are diagrams illustrating an example of the semiconductor device 50. FIG. 10A is a plan view and FIG. 10B is a cross-sectional view taken along the line A-A of FIG. 10A. As shown in FIGS. 10A and 10B, the semiconductor device 50 includes the main portion 51 that has a rectangular shape in a plan view and is encapsulated by an encapsulating resin 54 and the leads 52 that protrude from the side surface of the main portion 51 to the outside. The thickness of the lead 52 is in the range of, for example, 0.125 mm to 0.150 mm and the width thereof is about 0.2 mm. A plated film is formed on the upper surface, lower surface, and side surface (except for a lead cut surface) of the lead 52. The thickness of the lead 52 including the thickness of the plated film is in the range of, about 0.125 mm to 0.180 mm.

In FIGS. 1 to 3, a left half portion of a center line 1 indicating the center is a front view and a right half portion thereof is a front cross-sectional view. Among FIGS. 1 to 3, FIG. 2 shows a state in which the upper unit 20 is disposed at the top dead point, FIG. 3 shows a state in which the upper unit 20 is disposed at the bottom dead point, and FIG. 1 shows a state in which the upper unit 20 is disposed between the top dead point and the bottom dead point shown in FIGS. 2 and 3.

As shown in FIGS. 1 to 3, the lower unit 10 includes, for example, a lower holder 11, which is a base, and a die plate 12 and a bending die 13 forming a lower die.

The lower holder 11 has, for example, a plate shape and is horizontally provided. The die plate 12 has, for example, a plate shape and is horizontally fixed onto the lower holder 11. The bending die 13 is fixed to the upper surface of the die plate 12.

FIG. 7A shows a state in which the semiconductor device 50 is not arranged on the bending die 13 and FIG. 7B shows a state in which the semiconductor device 50 is mounted on the bending die 13. FIG. 7C is an enlarged view illustrating a portion B in FIG. 7A.

As shown in FIGS. 7A and 7B, the bending die 13 includes a main portion 14 that has a plate shape and is horizontally fixed onto the die plate 12 and a lead receiving portion 15 that protrudes from the upper surface of the main portion 14 to the upper side (that is, protrudes toward the upper unit 20).

The lead receiving portion 15 has a rectangular shape in a plan view and is a wall that extends along the outline of the rectangle. A portion surrounded by the lead receiving portion 15 and the upper surface of the main portion 14 is a concave portion 16. A part of the main portion 51 of the semiconductor device 50 that is below the lead 52 is put into the concave portion 16.

As shown in FIG. 7B, the semiconductor device 50 is arranged on the bending die 13 such that the part of the main portion 51 that is below the lead 52 is inserted into the concave portion 16. In this way, the leads 52 can be received (supported) by the lead receiving portion 15. In addition, the lead receiving portion 15 receives a portion of the lead 52 that is closer to the base end than to the leading end. Specifically, the lead receiving portion 15 receives a portion of the lead 52 that is adjacent to the main portion 51 and the leading end of the lead 52 protrudes from the lead receiving portion 15 to the outside in the horizontal direction. It is preferable that the height (the depth of the concave portion 16) of the lead receiving portion 15 be set such that there is a little clearance between the lower surface of the main portion 51 of the semiconductor device 50 and the upper surface of the main portion 14 of the bending die 13, with the semiconductor device 50 arranged on the bending die 13, as shown in FIG. 7B. Therefore, for example, the main portion 51 is arranged in the concave portion 16 so as to be lifted therefrom.

As shown in FIG. 7C, a rounding process (R process) 18 is performed on the edge of the upper end of the lead receiving portion 15. In this way, it is possible to prevent the damage of the lead 52 when the lead 52 is bent.

The lower unit 10 has the above-mentioned structure and is fixed at an exact position.

As shown in FIGS. 1 to 3, the upper unit 20 includes, for example, an upper holder 21 and an upper die that is fixed to the upper holder 21. The upper die includes, for example, a punch plate 22, a punch holder 23, and a plurality of (for example, four) bending punches 24.

The upper holder 21 has, for example, a plate shape and is arranged horizontally. The upper holder 21 has, for example, a rectangular shape (specifically, for example, a square shape) in a plan view.

The punch plate 22 has, for example, a plate shape and is fixed to the lower surface of the upper holder 21.

The punch holder 23 is fixed to the lower surface of the punch plate 22 such that it is moved down below, for example, the punch plate 22. The punch holder 23 holds a plurality of bending punches 24 and a regulating member 70, which will be described below.

The bending punch 24 is a substantially plate-shaped member that is fixed to the punch holder 23 such that it is moved down below, for example, the punch holder 23.

FIGS. 8A to 8C are front cross-sectional views illustrating a series of operations of the bending punch 24 and the regulating member 70.

As shown in FIGS. 8A to 8C, the bending punch 24 presses (specifically, bends) the leads 52 using a processing portion 25 that is formed at the lower end thereof. The processing portion 25 presses a portion of the lead 52 that is closer to the leading end than to the lead receiving portion 15 in the semiconductor device 50 which is mounted on the bending die 13. The processing portion 25 has a leading end which is formed at an acute angle and is rounded.

A surface that is formed by the outer circumferential surface of the lead receiving portion 15 and the upper surface of the main portion 14 of the bending die 13 and has an L-shape in a cross-sectional view is referred to as a pressing surface 17. When the bending punch 24 is moved down to the bottom dead point, the lead 52 is pressed against the pressing surface 17 by the processing portion 25. As such, when the processing portion 25 presses the lead 52, the regulating member 70, which will be described below, regulates the lift of the semiconductor device 50. That is, in this case, as shown in FIGS. 8A to 8C, the regulating member 70 is positioned such that the lower end surface of the regulating member 70 approaches or contacts the upper surface of the main portion 51 of the semiconductor device 50 (FIG. 8A). The regulating member 70 regulates the lift of the semiconductor device 50 (lift by the principle of leverage using the lead 52 as the effort and the upper end of the lead receiving portion 15 as the fulcrum) (FIG. 8B). Therefore, the lead 52 is bent in a shape along the pressing surface 17 and the upper end surface of the lead receiving portion 15 (FIG. 8C). FIG. 8C shows a state in which the upper unit 20 (including the bending punch 24) is disposed at the bottom dead point.

As such, the bending punch 24 presses (bends) the leads 52 of the semiconductor device 50 in cooperation with the bending die 13 and the regulating member 70 while being moved from the position of the top dead point (the position shown in FIG. 2) to the position of the bottom dead point (the position shown in FIG. 3 and FIG. 8C).

FIG. 9 is a bottom view illustrating the regulating member 70, the punch holder 23, and the bending punch 24.

As can be seen from FIG. 9, FIGS. 8A to 8C, and FIGS. 1 to 3, four bending punches 24 are arranged so as to correspond to four side surfaces of the main portion 51 of the semiconductor device 50 which is arranged on the bending die 13. The bending punches 24 collectively process a plurality of leads 52 which protrudes from the corresponding side surfaces of the semiconductor device 50.

As shown in FIG. 1, the lead processing apparatus 100 includes, for example, a press 60 as a driving source that relatively moves the upper unit 20 and the lower unit 10 in the direction in which the upper unit 20 approaches and is separated from the lower unit 10. Specifically, the press 60 moves, for example, the upper unit 20 in the vertical direction.

As the press 60, for example, a motor press that is driven by a motor, a hydraulic (oil pressure) press that is driven by fluid pressure (oil pressure), or a pneumatic press that is driven by air pressure may be used.

The press 60 includes, for example, a main portion 61 and a press shaft 62 that is moved relative to the main portion 61 such that the press 60 is expanded and contracted. The main portion 61 is fixed at the position where the press shaft 62 is disposed below the main portion 61. Therefore, the press shaft 62 is moved in the vertical direction below the main portion 61.

The press 60 transmits power to the upper holder 21 through the load transmitting portion 30 (including the transmission of the press load).

A connecting portion 35 that connects the load transmitting portion 30 and the leading end of the press shaft 62 is fixed to the upper surface of the load transmitting portion 30. The connecting portion 35 connects the load transmitting portion 30 and the press shaft 62.

As shown in FIGS. 1 to 3, the load transmitting portion 30 is fixed to the upper surface of the upper holder 21.

The load transmitting portion 30 includes, for example, a plate-shaped main portion 31 and a plurality of load transmission protrusions 32 that protrudes downward from the lower surface of the main portion 31. The lower ends of the load transmission protrusions 32 are fixed to the upper surface of the upper holder 21. The load transmitting portion 30 transmits power (including the press load) from the press shaft 62 to the upper holder 21 through the load transmission protrusions 32. For example, the load transmitting portion 30 has a rectangular shape in a plan view, similarly to the upper holder 21.

According to the above-mentioned structure, the load transmitting portion 30 and the upper unit 20 are moved in the vertical direction with the movement of the press shaft 62 in the vertical direction.

The falling of the upper unit 20 is stopped at the position of a predetermined bottom dead point by the stopper mechanism 40, which will be described in detail below.

The stopper mechanism 40 includes a plurality of (for example, four) stroke stopper pairs 43 each having the first stroke stopper 41 that is fixed to the lower unit 10 and the second stroke stopper 42 that is fixed to the upper unit 20 so as to face the first stroke stopper 41.

The first stroke stopper 41 is provided on the lower holder 11 so as to rise upward from the upper surface of the lower holder 11. The second stroke stopper 42 is provided on the upper holder 21 so as to protrude downward from the lower surface of the upper holder 21. That is, the first and second stroke stoppers 41 and 42 are coaxially arranged.

Each of the first and second stroke stoppers 41 and 42 has, for example, a columnar shape (specifically, for example, a cylindrical shape). The upper end surface of the first stroke stopper 41 and the lower end surface of the second stroke stopper 42 are flat.

As shown in FIG. 2, the lower end surface of the second stroke stopper 42 is vertically separated from the upper end surface of the first stroke stopper 41, with the upper unit 20 positioned at the top dead point.

When the upper unit 20 is moved down, the lower end surface of the second stroke stopper 42 comes into contact with the upper end surface of the first stroke stopper 41. In this way, the upper unit 20 is stopped at the position of the bottom dead point (FIG. 3).

The upper holder 21 and the load transmitting portion 30 are guided so as to be movable in a straight line in the vertical direction and are maintained horizontally when they are moved in the vertical direction, which will be described with reference to FIGS. 4A and 4B.

In FIGS. 4A and 4B, a left half portion of a center line 1 indicating the center is a front view and a right half portion thereof is a front cross-sectional view. FIG. 4A shows a state in which the upper holder 21 is disposed at the top dead point and FIG. 4B shows a state in which the upper holder 21 is disposed at the bottom dead point.

As shown in FIGS. 4A and 4B, the lead processing apparatus 100 includes a plurality of guide posts 81 which is vertically provided with respect to the lower holder 11. The guide post 81 has, for example, a cylindrical shape. The lead processing apparatus 100 includes, for example, four guideposts 81. That is, FIGS. 4A and 4B show two front guide posts 81 among the four guide posts 81, and two guide posts 81 are also disposed on the rear sides of the two front guide posts 81.

As shown in FIGS. 4A and 4B and FIG. 5, a plurality of (for example, four) guide bushes 21b into which the guide posts 81 are inserted is provided in the upper holder 21. A guide hole 21a is formed in each of the guide bushes 21b. Each of the guide posts 81 is inserted into the corresponding guide hole 21a so as to pass through the upper holder 21 in the vertical direction. The upper holder 21 is guided by the guide posts 81 in the longitudinal direction (that is, the vertical direction) of the guideposts 81 while the inner circumferential surface of the guide hole 21a slides along the outer circumferential surface of the guide post 81.

Similarly, as shown in FIGS. 4A and 4B and FIG. 6, a plurality of (for example, four) guide holes 30a into which the guide posts 81 are inserted is formed in the load transmitting portion 30. The planar arrangement of the guide holes 30a is the same as that of the guide holes 21a. That is, the guide holes 30a are disposed above the corresponding guide holes 21a. Each of the guide posts 81 is inserted into the corresponding guide hole 30a so as to pass through the load transmitting portion 30 in the vertical direction. The load transmitting portion 30 is guided by the guide posts 81 in the longitudinal direction (that is, the vertical direction) of the guideposts 81 while the inner circumferential surface of the guide hole 30a slides along the outer circumferential surface of the guide post 81.

As shown in FIGS. 4A and 4B and FIG. 6, the guide posts 81, the guide holes 21a, and the guide holes 30a are arranged at four corners of, for example, the upper holder 21 and the load transmitting portion 30 in a plan view. Therefore, all of the load transmitting portion 30, the upper holder 21, and the upper unit 20 are guided in the vertical direction by the guide post 81 while being stably maintained in the horizontal direction.

As shown in FIG. 5, for example, the stroke stopper pairs 43 are arranged such that each stroke stopper pair is disposed between adjacent guide posts 81.

As shown in FIGS. 5 and 6, the load transmission protrusions 32 of the load transmitting portion 30 are arranged above the stroke stopper pairs 43 so as to overlap the stroke stopper pairs 43. That is, each of the load transmission protrusions 32 is arranged coaxially with the corresponding stroke stopper pair 43.

Therefore, the deformation of the upper holder 21 due to the load applied from the load transmitting portion 30 to the upper holder 21 through the load transmission protrusion 32 is suppressed.

For the definition of the term “load transmission protrusion 32 being arranged coaxially with the stroke stopper pair 43,” at least a portion of the load transmission protrusion 32 may overlap the stroke stopper pair 43 (particularly, the second stroke stopper 42) in a plan view.

As shown in FIG. 3, an initial clearance CO (FIGS. 1 and 2) is set between the load transmitting portion 30 and the upper holder 21 such that a clearance Cis formed between the load transmitting portion 30 and the upper holder 21 in portions other than a load transmission position (a position where the load transmission protrusion 32 is formed), even when the load transmitting portion 30 is warped by the press load. The appropriate value of the initial clearance CO varies depending on, for example, the shape and material of the main portion 31 and the shape and material of the load transmission protrusion 32 of the load transmitting portion 30. For example, the value of the initial clearance CO may be about several millimeters (specifically, for example, 1 mm or more).

The center of the effort of the press load transmitted from the load transmitting portion 30 to the upper holder 21 is in a region including the clearances CO and C in the plane (that is, the horizontal plane) orthogonal to the moving direction of the upper unit 20. Specifically, the center of the effort is disposed in a region (corresponding to a region R shown in FIG. 6) that is closer to the center of the load transmitting portion 30 than to a plurality of load transmission protrusions 32 and a plurality of guide holes 30a. Preferably, the center of the effort is disposed at the center of the region R (that is, for example, the center of the four load transmission protrusions 32).

The lead processing apparatus 100 further includes the regulating member 70 that is provided so as to face the arrangement portion (the lead receiving portion 15 and the concave portion 16), is held by the upper unit 20, and regulates the lift of the main portion 51 of the semiconductor device 50 from the arrangement portion.

The regulating member 70 includes, for example, a columnar portion 71 that extends in the vertical direction and a flange portion 72 that is provided at the upper end of the columnar portion 71.

The lower surface of the columnar portion 71 is flat, and the upper surface of the main portion 51 of the semiconductor device 50 comes into contact with the lower surface of the columnar portion 71. In this way, the lift of the main portion 51 is regulated. It is preferable that the dimensions of the columnar portion 71 be set such that the lower surface of the columnar portion 71 comes into contact with the entire upper surface of the main portion 51.

The dimensions of the flange portion 72 are more than those of the columnar portion 71 in a plan view and the flange portion 72 protrudes from the columnar portion 71 to the outside in the horizontal direction.

The flange portion 72 is held in a hollow portion 26 that is continuously formed from the punch plate 22 to the upper part of the punch holder 23.

The columnar portion 71 is inserted into an insertion hole 27 that is formed in the punch holder 23 such that the hollow portion 26 communicates with the lower space of the punch holder 23.

The inner cross-sectional area (plane area) of the hollow portion 26 is set to a value that is slightly more than the plane area of the flange portion 72, and the inner cross-sectional area (plane area) of the insertion hole 27 is set to a value that is less than the plane area of the flange portion 72.

Therefore, the regulating member 70 is held so as not to fall down from the punch holder 23 and is movable in the vertical direction relative to the punch holder 23 and the punch plate 22.

A step portion 28 is formed at the boundary between the hollow portion 26 and the insertion hole 27.

The lead processing apparatus 100 further includes a spring (urging portion) 73 that urges the regulating member 70 to the lower unit 10 (that is, the lower side) relative to the upper unit 20 and a regulating member stopper member 74 including a stopper portion 76 that stops the movement of the regulating member 70 to the lower unit 10 (that is, the lower side).

The regulating member stopper member 74 includes, for example, a beam-shaped support 75 and the columnar stopper portion 76. The support 75 has one end fixed to the side surface of a lower part of the regulating member 70 and extends horizontally so as to protrude from the regulating member 70 to the outside.

The upper end of the stopper portion 76 is fixed to the other end of the support 75. The stopper portion 76 protrudes downward from the support 75 and the regulating member 70. That is, the stopper portion 76 is provided integrally with the regulating member 70 so as to protrude from the regulating member 70 to the lower unit 10. The lower end of the stopper portion 76 comes into contact with the upper surface of the die plate 12 of the lower unit 10 outside the arrangement portion (the lead receiving portion 15 and the concave portion 16) in the horizontal direction. When the lower end of the stopper portion 76 comes into contact with the upper surface of the die plate 12 of the lower unit 10, the falling of the regulating member 70 is stopped.

The spring 73 is a compressive coil spring. The upper end of the spring 73 is fixed to, for example, the lower surface of the punch holder 23, and the lower end of the spring is fixed to, for example, the upper surface of the regulating member stopper member 74 (the upper surface of the stopper portion 76 or the upper surface of the support 75). The spring 73 extends in the vertical direction. Therefore, the spring 73 urges the punch holder 23 and the regulating member stopper member 74, for example, in the direction in which they are separated from each other. As a result, the spring 73 urges the regulating member 70 downward relative to the upper unit 20.

However, it is preferable that the spring 73 be provided coaxially with the stopper portion 76. For the definition of the term “spring 73 being provided coaxially with the stopper portion 76,” the lower end (the end connected to the regulating member stopper member 74) of the spring 73 may overlap with a portion of the stopper portion 76 in a plan view.

For example, four regulating member stopper members 74 are provided in the regulating member 70. That is, for example, as shown in FIG. 9, the four regulating member stopper members 74 are arranged around the regulating member 70 at regular intervals. Each of the regulating member stopper members 74 is arranged between adjacent bending punches 24 such that the regulating member stopper member 74 does not interfere with the bending punch 24. In addition, the spring 73 is provided for each regulating member stopper member 74 between the regulating member stopper member 74 and the punch holder 23.

As described below, the regulating member 70 is moved up and down with the movement of the upper unit 20 in the vertical direction. However, the movement of the regulating member 70 in the downward direction is stopped in the stage in which the stopper portion 76 comes into contact with the lower unit 10.

As shown in FIG. 2, in the stage in which the upper unit 20 is disposed at the top dead point, the lower end of the flange portion 72 of the regulating member 70 comes into contact with the step portion 28 by the weight of the regulating member 70 and the regulating member stopper member 74 and the urging force of the spring 73. In this stage, the lower end of the regulating member stopper member 74 is separated from the upper surface of the die plate 12 of the lower unit 10.

During the falling of the upper unit 20 from the position of the top dead point, until the lower end of the stopper portion 76 of the regulating member stopper member 74 comes into contact with the upper surface of the die plate 12, the regulating member 70 and the regulating member stopper member 74 are moved down with the falling of the upper unit 20.

During the falling of the upper unit 20 from the position of the top dead point, after the lower end of the stopper portion 76 comes into contact with the upper surface of the die plate 12, the regulating member stopper member 74 and the regulating member 70 are not moved down and the state in which the lower end of the stopper portion 76 is pressed against the upper surface of the die plate 12 by the urging force of the spring 73 is maintained (see FIG. 1).

FIG. 8A shows the positional relationship between the regulating member 70 and the semiconductor device 50 on the arrangement portion in this state. In this stage, the arrangement and dimensions of each component are set such that the clearance between the lower end surface of the columnar portion 71 of the regulating member 70 and the upper surface of the main portion 51 of the semiconductor device 50 is equal to or less than 100 μm or zero.

The upper unit 20 is moved down even after the lower end of the stopper portion 76 comes into contact with the upper surface of the die plate 12, and the regulating member 70 is moved up relative to the upper unit 20. That is, the lower end of the flange portion 72 is separated from the step portion 28 and the regulating member 70 is moved up relative to the punch plate 22 and the punch holder 23 (FIG. 1).

Then, until the processing portion 25 of the bending punch 24 comes into contact with the leads 52, the upper unit 20 is moved down, which is shown in FIG. 8A.

FIG. 8B shows a state in which the upper unit 20 is moved down below the state shown in FIG. 8A and the bending punch 24 starts to press the leads 52. In this stage, the main portion 51 of the semiconductor device 50 is moved up by the principle of leverage using the lead 52 as the effort and the upper end of the lead receiving portion 15 as the fulcrum. Therefore, as shown in FIG. 8B, the upper surface of the main portion 51 comes into contact with the lower surface of the regulating member 70 and the regulating member 70 regulates the lift of the main portion 51.

Then, the bending punch 24 is moved down to the bottom dead point and the processing portion 25 bends the leads 52 in a predetermined shape (FIG. 8C).

As described above, the lifting force of the main portion 51 by the principle of leverage continuously acts from the stage shown in FIG. 8B to the stage shown in FIG. 8C. During the period for which the force is applied, the urging force of the spring 73 to press the regulating member 70 downward is set such that the regulating member 70 can continuously regulate the lift of the main portion 51. That is, the urging force of the spring 73 is set such that the resultant of force to press the regulating member 70 which is caused by the urging force of the spring 73 and gravity acting on the regulating member 70 and the four regulating member stopper members 74 is more than the lifting force of the main portion 51.

As such, the regulating member 70 regulates the lift of the main portion 51 of the semiconductor device 50 at the position (height) where the stopper portion 76 comes into contact with the lower unit 10. At the position (height) where the stopper portion 76 comes into contact with the lower unit 10, a surface of the regulating member 70 (the lower end surface of the columnar portion 71) that faces the arrangement portion and regulates the lift does not press the main portion 51 of the semiconductor device 50 by the urging force of the spring 73 in the stage before pressing starts.

In FIGS. 1 to 4B, for ease of understanding of the drawings, some components will not be illustrated.

First, in FIGS. 2 to 4B, the press 60 and the connecting portion 35 (shown in FIG. 1) are not shown.

In FIGS. 1 to 4B, the guide posts 81 (FIGS. 4A and 4B) are not shown.

The lead processing apparatus 100 is symmetric with respect to the vertical direction, as viewed from the direction shown in FIGS. 1 to 4B. However, in the left half portion of FIGS. 1 to 3, the bending punch 24 is not shown. In the right half portion of FIGS. 1 to 3, the stroke stopper pair 43 (first and second stroke stoppers 41 and 42), the spring 73, and the regulating member stopper member 74 are not shown.

In FIGS. 4A and 4B, only the guide posts 81, the load transmitting portion 30, the upper holder 21, and the lower holder 11 are shown, but the other components are not shown.

In the above description, the lead processing apparatus 100 is for a bending process. However, a cutting punch and a cutting die may be used as the bending punch 24 and the bending die 13 to correspond to a cutting process.

Next, a method for manufacturing the semiconductor device according to this embodiment will be described. FIGS. 11A to 11C are diagrams illustrating an example of the procedure of the manufacturing method. FIGS. 12A to 12c are diagrams illustrating another example of the procedure of the manufacturing method.

The method for manufacturing semiconductor device according to this embodiment includes a step of processing the leads 52 of the semiconductor device 50 using the lead processing apparatus 100. The lead processing apparatus 100 includes: the first die unit (lower unit 10) including the arrangement portion (for example, the lead receiving portion 15 and the concave portion 16) on which the semiconductor device 50 having the main portion 51 and the leads 52 protruding from the main portion 51 is arranged; the second die unit (upper unit 20) that is provided so as to be movable in the direction in which the second die unit approaches the first die unit and the direction in which the second die unit is separated from the first die unit and presses the leads 52 in cooperation with the first die unit; the load transmitting portion 30 that transmits a press load to the second die unit; and the stopper mechanism 40 that stops the movement of the second die unit in the direction in which the second die unit approaches the first die unit. The stopper mechanism 40 includes a plurality of stroke stopper pairs 43 each having the first stroke stopper 41 that is fixed to the first die unit and the second stroke stopper 42 that is arranged so as to face the first stroke stopper 41, is fixed to the second die unit, and comes into contact with the first stroke stopper 41 to stop the movement of the second die unit. The load transmitting portion 30 distributes a load to a plurality of load transmission positions (for example, the load transmission protrusions 32) which are separated from each other and transmits the press load to the second die unit. Each of the load transmission positions is arranged coaxially with each of the stroke stopper pairs 43. In the step of processing the leads 52 using the lead processing apparatus 100, the load transmitting portion 30 distributes the load to a plurality of load transmission positions and transmits the press load to the second die unit, which will be described in detail below.

First, a semiconductor chip (not shown) is mounted and bonded onto a die pad (not shown) of a lead frame (not shown), and the semiconductor chip and the leads 52 are bonded to each other by bonding wires (not shown). Then, the semiconductor chip and the lead frame are encapsulated by an encapsulating resin 54 such that a portion of the lead 52 protrudes from the encapsulating resin 54 (FIGS. 10A and 10B). Then, burr removal is performed on the encapsulating resin 54. When the lead frame that has not been subjected to a packaging process is used, an exterior plating process is also performed on the lead frame.

Then, the semiconductor device 50 is cut off from the lead frame 53 (see FIG. 11A; they are partially shown) and a process of forming the lead 52 is performed.

Specifically, for example, first, as shown in FIG. 11A, the lead frame 53 is cut at a cutting position 5 such that the length of the lead 52 is more than predetermined final dimensions, thereby cutting off the semiconductor device 50 from the lead frame 53. Then, as shown in FIG. 11B, the lead 52 is bent downward in a predetermined gull wing shape. Then, as shown in FIG. 11C, the lead 52 is cut at a cutting position 6 to have predetermined dimensions.

Alternatively, first, as shown in FIG. 12A, the lead frame 53 is cut at a cutting position 7 such that the lead has predetermined dimensions. In this way, the semiconductor device 50 is cut off from the lead frame 53 (FIG. 12B). Then, as shown in FIG. 12C, the lead 52 is bent downward in a predetermined gull wing shape.

The lead 52 is processed by the lead processing apparatus 100 according to this embodiment. The lead processing apparatus 100 may be used in any of a step of cutting off the semiconductor device 50 from the lead frame (FIGS. 10A and 11B), a step of bending the lead 52 in a gull wing shape (FIG. 10B and FIG. 11C), and a step of cutting the gull-wing-shaped lead 52 (FIG. 10B).

As such, the lead processing apparatus 100 cuts or bends the lead 52. As the processing conditions, the cutting position or the bending position of the lead 52 is in the error range of, for example, several microns. Therefore, it is important to accurately position the bending punch 24 and the bending die 13. That is, it is important to accurately position the upper unit 20 relative to the lower unit 10 at the position of the bottom dead point.

FIG. 14 is a diagram illustrating a lead processing apparatus 1000 according to a comparative example. In FIG. 14, a left half portion is a front view and a right half portion is a front cross-sectional view. Similarly to FIGS. 1 to 3, in the left half portion and the right half portion, some components will not be illustrated for simplicity.

The structure of the lead processing apparatus 1000 shown in FIG. 14 is the same as that of the lead processing apparatus 100 except for only the following points.

First, the lead processing apparatus 1000 does not include the load transmitting portion 30, and power is directly applied from the press shaft 62 of the press 60 (which is not shown in FIG. 14, but is the same as that shown in FIG. 1) to the center of the upper surface of the upper holder 21.

The spring 73 is provided between the upper end surface of the columnar portion 71 of the regulating member 70 and the lower surface of the upper holder 21, not between the regulating member stopper member 74 and the punch holder 23.

FIG. 14 shows the deformation (warping) of the upper holder 21 when the upper unit 20 is disposed at the bottom dead point.

In the structure of the lead processing apparatus 1000 shown in FIG. 14, the upper holder 21 is more likely to be deformed due to the press load than that in the structure of the lead processing apparatus 100. That is, as shown in FIG. 14, the upper holder 21 is likely to be curved so as to be convex downward. This is because the press load is applied from the press 60 to the center of the upper surface of the upper holder 21. When the upper holder 21 is curved so as to be convex downward, the height of the upper die at the bottom dead point (in particular, the height of the processing portion 25 of the bending punch 24) is lower than that in the lead processing apparatus 100. As a result, the accuracy of processing the lead 52 is likely to be reduced, as compared to when the lead processing apparatus 100 is used. In particular, it is assumed that, when the press 60 is a hydraulic press, a large press load more than 10000 N (Newton) is applied to the stroke stoppers 41 and 42 after the upper unit 20 reaches the bottom dead point, which results in a significant reduction in the accuracy of processing.

In contrast, in this embodiment, the load transmitting portion 30 including a plurality of load transmission protrusions 32 which is separated from each other distributes the press load and transmits the press load to the upper holder 21. In addition, each load transmission protrusion 32 is arranged coaxially with the stroke stopper pair 43. In this way, it is possible to prevent the deformation of the upper holder 21 due to the press load and reliably transmit the press load to the upper holder 21. Furthermore, the deformation of the upper holder 21 due to the press load can be absorbed by the deformation of the load transmitting portion 30 (see FIG. 3).

Therefore, it is possible to prevent the upper unit 20 from deviating from a desired position (height) with respect to the lower unit 10 at the position of the bottom dead point and thus improve the accuracy of processing the lead 52 of the semiconductor device 50.

In the structure of the lead processing apparatus 1000 shown in FIG. 14, the height of the regulating member 70 at the bottom dead point (in particular, the height of the lower end surface of the columnar portion 71) is lower than that in the lead processing apparatus 100. This is because the height of the lower end surface of the columnar portion 71 is reduced due to the curvature of the upper holder 21 and the height of the lower end surface of the columnar portion 71 is further reduced due to the force of the spring 73 to urge the columnar portion 71 to the lower side. That is, when the columnar portion 71 is urged to the lower side by the spring 73, for example, the beam-shaped support 75 of the regulating member stopper member 74 is warped and the height of the lower end surface of the columnar portion 71 is reduced. As a result, the accuracy of processing the lead 52 is likely to be reduced, as compared to when the lead processing apparatus 100 is used. In addition, the lower end surface of the columnar portion 71 presses the main portion 51 of the semiconductor device 50 to the lower side, which may have an adverse effect on the quality of the semiconductor device 50.

In contrast, in this embodiment, the spring 73 is arranged coaxially with the stopper portion 76. In this way, it is possible to suppress, for example, the warping of the support 75 due to the spring 73. Therefore, it is possible to suppress a reduction in the height of the lower end surface of the columnar portion 71 at the bottom dead point, as compared to the structure shown in FIG. 14. In this way, it is possible to improve the accuracy of processing the lead 52 of the semiconductor device 50.

Next, other problems of the technique disclosed in Japanese Laid-Open Patent Publication No. 07-321273 will be described below.

As described above, in the press disclosed in Japanese Laid-Open Patent Publication No. 07-321273, the clamp pin provided in the cam presses and clamps the semiconductor device from the upper side. Therefore, in the technique disclosed in Japanese Laid-Open Patent Publication No. 07-321273, stress is locally applied to the semiconductor device, which may have an adverse effect on the quality of the semiconductor device 50.

Since the semiconductor device is clamped by the clamp pin provided in the cam, the position of the lower end of the clamp pin is changed (to the lower side) due to the deformation of the putt stopper. Therefore, a large stress is applied to the semiconductor device, which may have an adverse effect on the accuracy of processing the lead 52.

In the press disclosed in Japanese Laid-Open Patent Publication No. 07-321273, many springs (a cam spring, a clamp pin spring, and a bending punch spring) are provided in the press. Stress deformation occurring in the press due to these springs is likely to reduce the accuracy of processing the lead.

In the experiments of the inventors, in some cases, a processing error of several tens of micrometers from the design value occurred when the lead was processed by the press having the structure disclosed in Japanese Laid-Open Patent Publication No. 07-321273.

In contrast, in this embodiment, the arrangement portion on which the semiconductor device 50 is arranged includes the lead receiving portion 15 that protrudes toward the upper unit 20 and receives a portion of the lead 52 closer to the base end than to the leading end. The upper unit 20 includes the processing portion 25 that presses a portion of the lead 52 that is closer to the leading end than to the lead receiving portion 15. The lead processing apparatus 100 further includes the regulating member 70 that is arranged so as to face the arrangement portion, is held by the upper unit 20, and regulates the lift of the main portion 51 of the semiconductor device 50 from the arrangement portion. The lead processing apparatus 100 further includes the spring 73 that urges the regulating member 70 to the lower unit 10 and the stopper portion 76 that is provided integrally with the regulating member 70 so as to protrude from the regulating member 70 to the lower unit 10 and comes into contact with the lower unit 10 outside the arrangement portion. The regulating member 70 regulates the lift of the main portion 51 at the position where the stopper portion 76 comes into contact with the lower unit 10. At the position where the stopper portion 76 comes into contact with the lower unit 10, a surface of the regulating member 70 (the lower end surface of the columnar portion 71) that faces the arrangement portion and regulates the lift does not press the main portion 51 of the semiconductor device 50 by the urging force of the spring 73 in the stage before pressing starts.

That is, in this embodiment, the lower surface of the regulating member 70 suppresses the lift of the semiconductor device 50. The lower surface of the regulating member 70 (the lower end surface of the columnar portion 71) does not press the semiconductor device 50 by the urging force of the spring 73 in the stage before pressing starts. Therefore, it is possible to reduce stress applied to the main portion 51 of the semiconductor device 50, as compared to the method of clamping the semiconductor device (for example, Japanese Laid-Open Patent Publication No. 07-321273). Therefore, it is possible to reduce the possibility of an adverse effect on the quality of the semiconductor device 50. In particular, since the lower end surface of the columnar portion 71 of the regulating member 70 comes into contact with the entire upper surface of the main portion 51 of the semiconductor device 50, it is possible to further reduce stress applied to the main portion 51.

In this embodiment, since the spring 73 that urges the regulating member 70 is arranged coaxially with the stopper portion 76, it is possible to suppress, for example, the warping of the support 75 due to the urging force of the spring 73. Therefore, it is possible to suppress a variation (reduction) in the height of the lower end surface of the columnar portion 71 at the bottom dead point and thus improve the accuracy of processing the lead 52 of the semiconductor device 50.

In addition, since it is not necessary to use spring components other than the spring 73, it is possible to suppress the stress deformation of the internal structure of the lead processing apparatus 100 due to the spring and thus improve the accuracy of processing the lead 52 of the semiconductor device 50. In particular, since the spring 73 is arranged coaxially with the stopper portion 76, it is possible to synergistically suppress the stress deformation of the internal structure of the lead processing apparatus 100 and thus further improve the accuracy of processing the lead 52.

According to the above-described embodiment, the press load is transmitted to the upper unit 20 through the load transmitting portion 30. The load transmitting portion 30 distributes the load to a plurality of load transmission protrusions 32 which is separated from each other, and transmits the press load to the upper holder 21 of the upper unit 20. In addition, each of the load transmission protrusions 32 is arranged coaxially with the corresponding stroke stopper pair 43. This structure makes it possible to selectively apply the press load to a portion of the upper holder 21 which corresponds to the arrangement position of the stroke stopper pair 43 and thus suppress the deformation of the upper holder 21 due to the press load. Therefore, during pressing, it is possible to suppress the position of the upper unit 20 relative to the lower unit 10 from deviating from a desired position and thus improve the accuracy of processing the lead 52 of the semiconductor device 50.

For example, in a semiconductor device to be mounted on the vehicle, the lead 52, which is a mounting portion, needs to have final external dimensions of several micrometers (microns) and a high-stability quality. According to this embodiment, it is possible to easily perform processing with such high accuracy.

In addition, the initial clearance CO (see FIGS. 1 and 2) is set between the load transmitting portion 30 and the upper holder 21 of the upper unit 20 such that the clearance C (see FIG. 3) is formed between the load transmitting portion 30 and the upper holder 21 of the upper unit 20 in portions other than the position where the load transmission protrusion 32 is formed, even when the load transmitting portion 30 is warped by the press load. Therefore, it is possible to prevent the press load from being directly transmitted from the load transmitting portion 30 to the portions other than the position where the load transmission protrusion 32 is formed. As a result, it is possible to reliably suppress the deformation of the upper holder 21 of the upper unit 20.

The center of the effort of the press load transmitted from the load transmitting portion 30 to the upper holder 21 of the upper unit 20 is disposed in the region in which the clearance C (FIG. 3) is present in the plane (that is, for example, in the horizontal plane) orthogonal to the moving direction of the upper unit 20.

In the above-described embodiment, as shown in FIG. 6, the load transmission protrusion 32 (and the stroke stopper pair 43) is disposed between adjacent guide posts 81 in a plan view, but the invention is not limited thereto. For example, as shown in FIG. 13, the load transmission protrusion 32 (and the stroke stopper pair 43) may be disposed outside the guide post 81 in a plan view.

The invention has the following structure.

According to a first aspect, a lead processing apparatus includes: a first die unit including an arrangement portion on which a semiconductor device having a main portion and a lead protruding from the main portion is arranged; a second die unit that is provided so as to be movable in a direction in which the second die unit approaches the first die unit and a direction in which the second die unit is separated from the first die unit and presses the lead in cooperation with the first die unit; a regulating member that is provided so as to face the arrangement portion, is held by the second die unit, and regulates the lift of the main portion of the semiconductor device from the arrangement portion; an urging portion that urges the regulating member to the first die unit; and a stopper portion that is provided integrally with the regulating member so as to protrude from the regulating member to the first die unit and comes into contact with the first die unit outside the arrangement portion. The arrangement portion includes a lead receiving portion that protrudes toward the second die unit and receives a portion of the lead which is closer to a base end than to a leading end. The second die unit includes a processing portion that presses a portion of the lead which is closer to the leading end than to the lead receiving portion. The regulating member regulates the lift at a position where the stopper portion comes into contact with the first die unit. At the position where the stopper portion comes into contact with the first die unit, a surface of the regulating member which faces the arrangement portion and regulates the lift does not press the semiconductor device by the urging force of the urging portion in a stage before the pressing starts.

According to a second aspect, in the lead processing apparatus according to the first aspect, the urging portion is arranged coaxially with the stopper portion.

It is apparent that the present invention is not limited to the above embodiment, and may be modified and changed without departing from the scope and spirit of the invention.

Claims

1. A lead processing apparatus comprising:

a first die unit including an arrangement portion on which a semiconductor device having a main portion and a lead protruding from the main portion is arranged;

a second die unit that is provided so as to be movable in a direction in which the second die unit approaches the first die unit and a direction in which the second die unit is separated from the first die unit and presses the lead in cooperation with the first die unit;

a load transmitting portion that transmits a press load to the second die unit; and

a stopper mechanism that stops the movement of the second die unit in the direction in which the second die unit approaches the first die unit,

wherein the stopper mechanism includes a plurality of stroke stopper pairs each having a first stroke stopper which is fixed to the first die unit and a second stroke stopper which is arranged so as to face the first stroke stopper, is fixed to the second die unit, and comes into contact with the first stroke stopper to stop the movement of the second die unit,

the load transmitting portion distributes a load to a plurality of load transmission positions separated from each other and transmits the press load to the second die unit, and

each of the load transmission positions is arranged coaxially with the stroke stopper pair.

2. The lead processing apparatus according to claim 1,

wherein an initial clearance between the load transmitting portion and the second die unit is set such that a clearance is formed between the load transmitting portion and the second die unit in portions other than the load transmission positions even when the load transmitting portion is warped by the press load.

3. The lead processing apparatus according to claim 2,

wherein the center of the effort of the press load transmitted from the load transmitting portion to the second die unit is disposed in a region in which the clearance is present in the plane orthogonal to the moving direction of the second die unit.

4. The lead processing apparatus according to claim 1, further comprising:

a regulating member that is provided so as to face the arrangement portion, is held by the second die unit, and regulates the lift of the main portion of the semiconductor device from the arrangement portion,

an urging portion that urges the regulating member to the first die unit; and

a stopper portion that is provided integrally with the regulating member so as to protrude from the regulating member to the first die unit and comes into contact with the first die unit outside the arrangement portion,

wherein the arrangement portion includes a lead receiving portion that protrudes toward the second die unit and receives a portion of the lead which is closer to a base end than to a leading end,

the second die unit includes a processing portion that presses a portion of the lead which is closer to the leading end than to the lead receiving portion,

the regulating member regulates the lift at a position where the stopper portion comes into contact with the first die unit, and

at the position where the stopper portion comes into contact with the first die unit, a surface of the regulating member which faces the arrangement portion and regulates the lift does not press the semiconductor device by the urging force of the urging portion in a stage before the pressing starts.

5. The lead processing apparatus according to claim 4,

wherein the urging portion is arranged coaxially with the stopper portion.

6. A method for manufacturing semiconductor device comprising:

processing a lead of a semiconductor device using a lead processing apparatus,

wherein the lead processing apparatus includes:

a first die unit including an arrangement portion on which the semiconductor device having a main portion and the lead protruding from the main portion is arranged;

a second die unit that is provided so as to be movable in a direction in which the second die unit approaches the first die unit and a direction in which the second die unit is separated from the first die unit and presses the lead in cooperation with the first die unit;

a load transmitting portion that transmits a press load to the second die unit; and

a stopper mechanism that stops the movement of the second die unit in the direction in which the second die unit approaches the first die unit,

the stopper mechanism includes a plurality of stroke stopper pairs each having a first stroke stopper which is fixed to the first die unit and a second stroke stopper which is arranged so as to face the first stroke stopper, is fixed to the second die unit, and comes into contact with the first stroke stopper to stop the movement of the second die unit,

the load transmitting portion distributes a load to a plurality of load transmission positions separated from each other and transmits the press load to the second die unit,

each of the load transmission positions is arranged coaxially with the stroke stopper pair, and

in the processing of the lead, the load transmitting portion distributes the load to the plurality of load transmission positions and transmits the press load to the second die unit.

7. The method for manufacturing semiconductor device according to claim 6,

wherein an initial clearance between the load transmitting portion and the second die unit is set such that a clearance is formed between the load transmitting portion and the second die unit in portions other than the load transmission positions even when the load transmitting portion is warped by the press load.

8. The method for manufacturing semiconductor device according to claim 7,

wherein the center of the effort of the press load transmitted from the load transmitting portion to the second die unit is disposed in a region in which the clearance is present in the plane orthogonal to the moving direction of the second die unit.

9. The method for manufacturing semiconductor device according to claim 6,

wherein the lead processing apparatus further comprising:

a regulating member that is provided so as to face the arrangement portion, is held by the second die unit, and regulates the lift of the main portion of the semiconductor device from the arrangement portion,

an urging portion that urges the regulating member to the first die unit; and

a stopper portion that is provided integrally with the regulating member so as to protrude from the regulating member to the first die unit and comes into contact with the first die unit outside the arrangement portion,

wherein the arrangement portion includes a lead receiving portion that protrudes toward the second die unit and receives a portion of the lead which is closer to a base end than to a leading end,

the second die unit includes a processing portion that presses a portion of the lead which is closer to the leading end than to the lead receiving portion,

the regulating member regulates the lift at a position where the stopper portion comes into contact with the first die unit, and

at the position where the stopper portion comes into contact with the first die unit, a surface of the regulating member which faces the arrangement portion and regulates the lift does not press the semiconductor device by the urging force of the urging portion in a stage before the pressing starts.

10. The method for manufacturing semiconductor device according to claim 9,

wherein the urging portion is arranged coaxially with the stopper portion.

11. A lead processing die set comprising:

a first die unit including an arrangement portion on which a semiconductor device having a main portion and a lead protruding from the main portion is arranged;

a second die unit that is provided so as to be movable in a direction in which the second die unit approaches the first die unit and a direction in which the second die unit is separated from the first die unit and presses the lead in cooperation with the first die unit;

a load transmitting portion that transmits a press load to the second die unit; and

a stopper mechanism that stops the movement of the second die unit in the direction in which the second die unit approaches the first die unit,

wherein the stopper mechanism includes a plurality of stroke stopper pairs each having a first stroke stopper which is fixed to the first die unit and a second stroke stopper which is arranged so as to face the first stroke stopper, is fixed to the second die unit, and comes into contact with the first stroke stopper to stop the movement of the second die unit,

the load transmitting portion distributes a load to a plurality of load transmission positions separated from each other and transmits the press load to the second die unit, and

each of the load transmission positions is arranged coaxially with the stroke stopper pair.