FIELD EFFECT TRANSISTOR AND MANUFACTURING METHOD THEREOF
A field effect transistor (FET) and a manufacturing method thereof are provided. The FET includes a substrate, a fin bump, an insulating layer, a charge trapping structure and a gate structure. The fin bump is disposed on the substrate. The insulating layer is disposed on the substrate and located at two sides of the fin bump. The charge trapping structure is disposed on the insulating layer and located at at least one side of the fin bump. A cross-section of the charge trapping structure is L-shaped. The gate structure covers the fin bump and the charge trapping structure.
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1. Technical Field
The disclosure relates in general to a transistor and a manufacturing method thereof, and more particularly to a field effect transistor and a manufacturing method thereof.
2. Description of the Related Art
With the development of semiconductor technology, varied semiconductor elements are invented. Those semiconductor elements are widely used in electric devices.
Field effect transistor (FET) is an important semiconductor element. In a FET, the shaped of a conductive channel is changed by controlling an electric field, so that the electric conductivity of the conductive channel can be adjusted.
SUMMARYThe disclosure is directed to a field effect transistor (FET) and a manufacturing method thereof. A gate structure, a charge trapping structure and a fin bump form a three-dimensional fin FET for reducing the volume thereof.
According to a first aspect of the present disclosure, a field effect transistor (FET) is provided. The FET includes a substrate, a fin bump, an insulating layer, a charge trapping structure and a gate structure. The fin bump is disposed on the substrate. The insulating layer is disposed on the substrate and located at two sides of the fin bump. The charge trapping structure is disposed on the insulating layer and located at at least one side of the fin bump. A cross-section of the charge trapping structure is a L-shaped. The gate structure covers the fin bump and the charge trapping structure.
According to a second aspect of the present disclosure, a manufacturing method of a field effect transistor is provided. The manufacturing method comprises the following steps. A substrate is provided. A fin bump is formed on the substrate. An insulating layer is formed on the substrate. The insulating layer is located at two sides of the fin bump. A charge trapping material is disposed on the fin bump and the substrate. Part of the charge trapping material covering the fin bump is etched to expose part of the fin bump. A gate structure is formed on the fin bump and part of the charge trapping material. The charge trapping material is etched by using the gate structure as a mask to form a L-shaped charge trapping structure.
The above and other aspects of the disclosure will become better understood with regard to the following detailed description of the non-limiting embodiments. The following description is made with reference to the accompanying drawings.
Several embodiments are disclosed below for elaborating the invention. The following embodiments are for the purpose of elaboration only, not for limiting the scope of protection of the invention. Besides, secondary elements are omitted in the following embodiments to highlight the technical features of the invention.
First EmbodimentReferring to
The charge trapping structure 140 is disposed on the insulating layer 130 and located at at least one side of the fin bump 120. The charge trapping structure 140 is silicon oxide/silicon nitride/silicon oxide or silicon oxide/high K dielectric material/silicon oxide tri-layer structure, for example. The material of each layer of the charge trapping structure 140 can be high dielectric constant material, such as HfO2, HfSiO2 or HfSiON, for example. Referring to
The gate structure 150 covers the fin bump 120 and the charge trapping structure 140. The material of the gate structure 150 can be poly-silicon, for example. The gate structure 150 is stacked on the charge trapping structure 140 and the fin bump 120 to form a 3-dimensional fin DET 100.
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Regarding the relationship between the charge trapping structure 140 and the fin bump 120, the charge trapping structure 140 is disposed at two sides of the fin bump 120. The charge trapping structure 140 covers part of the lateral wall of the fin bump 120 only, and does not cover whole of the lateral wall of the fin bump 120. The height H120 of the fin bump 120 is larger than the height H140 of the charge trapping structure 120.
Regarding the relationship between the charge trapping structure 140, the gate structure 150 and the insulating layer 130, the gate structure 150 and the insulating layer 130 are separated by the charge trapping structure 140, such that the gate structure 150 and the insulating layer 130 are not contacted with each other.
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In the present embodiment, the gate structure 190 is formed on the high K dielectric material 160′ (shown in
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In the present embodiment, the high K dielectric layer 360 and the gate structure 350 are formed in the opening 370a of the patterned layer 370, therefore, the high K dielectric layer 360 can be not only disposed under the gate structure 350, but also disposed at the lateral walls of the gate structure 350.
While the disclosure has been described by way of example and in terms of the exemplary embodiments, it is to be understood that the disclosure is not limited thereto. On the contrary, it is intended to cover various modifications and similar arrangements and procedures, and the scope of the appended claims therefore should be accorded the broadest interpretation so as to encompass all such modifications and similar arrangements and procedures.
Claims
1. A field effect transistor, comprising:
- a substrate;
- a fin bump; disposed on the substrate;
- an insulating layer, disposed on the substrate and located at two sides of the fin bump;
- a charge trapping structure, disposed on the insulating layer and located at at least one side of the fin bump, wherein the cross-section of the charge trapping structure is L-shaped; and
- a gate structure, covering the fin bump and the charge trapping structure.
2. The field effect transistor according to claim 1, wherein the charge trapping structure covers part of the lateral wall of the fin bump.
3. The field effect transistor according to claim 1, wherein the charge trapping structure is located at two sides of the fin bump.
4. The field effect transistor according to claim 1, wherein the gate structure and the insulating layer are separated by the charge trapping structure.
5. The field effect transistor according to claim 1, wherein the thickness of the charge trapping structure is substantially uniform.
6. The field effect transistor according to claim 1, further comprising:
- a high K dielectric layer, covering the fin bump and the charge trapping structure.
7. The field effect transistor according to claim 6, wherein the high K dielectric layer further covers a lateral wall of the gate structure.
8. The field effect transistor according to claim 1, wherein the charge trapping structure includes:
- a first oxide layer;
- a second oxide layer; and
- a nitride layer, disposed between the first oxide layer and the second oxide layer.
9. A manufacturing method of a field effect transistor, comprising:
- providing a substrate;
- forming a fin bump on the substrate;
- forming an insulating layer on the substrate, the insulating layer being located at two sides of the fin bump;
- disposing a charge trapping material on the fin bump and the substrate;
- etching part of the charge trapping material covering the fin bump to expose part of the fin bump;
- forming a gate structure on the fin bump and part of the charge trapping material; and
- etching the charge trapping material by using the gate structure as a mask to form a L-shaped charge trapping structure.
10. The manufacturing method of the field effect transistor according to claim 9, wherein after the part of the fin bump is exposed, the manufacturing method further comprising:
- forming a high K dielectric material covering the fin bump and the charge trapping material.
Type: Application
Filed: Jun 14, 2012
Publication Date: Dec 19, 2013
Patent Grant number: 9012975
Applicant: UNITED MICROELECTRONICS CORP. (Hsinchu)
Inventors: Tong-Yu Chen (Hsinchu City), Chih-Jung Wang (Hsinchu City)
Application Number: 13/517,759
International Classification: H01L 29/78 (20060101); H01L 21/283 (20060101);