HEAT PIPE HAVING A CHANNELED HEAT TRANSFER ARRAY

Abstract

Described embodiments include a heat pipe system. The system includes an evaporator portion having a wall internally defining an evaporator chamber and configured to evaporate a liquid phase of a working fluid by absorbing heat. A condenser portion has a wall internally defining a condenser chamber and configured to condense a vapor phase of the working fluid by releasing heat. The system includes the working fluid. The system includes a channeled heat transfer array including at least two tubes. Each tube of the at least two tubes has a wall defining (i) a channel flowing an intermediate fluid and (ii) an exterior surface directly exposed to the working fluid. The evaporator chamber, the condenser chamber, and the exterior surfaces of the at least two tubes of the channeled heat transfer array form a hermetically sealed hollow vessel containing the working fluid.

Description

If an Application Data Sheet (ADS) has been filed on the filing date of this application, it is incorporated by reference herein. Any applications claimed on the ADS for priority under 35 U.S.C. §§119, 120, 121, or 365(c), and any and all parent, grandparent, great-grandparent, etc. applications of such applications, are also incorporated by reference, including any priority claims made in those applications and any material incorporated by reference, to the extent such subject matter is not inconsistent herewith.

CROSS-REFERENCE TO RELATED APPLICATIONS

The present application is related to and/or claims the benefit of the earliest available effective filing date(s) from the following listed application(s) (the “Priority Applications”), if any, listed below (e.g., claims earliest available priority dates for other than provisional patent applications or claims benefits under 35 USC §119(e) for provisional patent applications, for any and all parent, grandparent, great-grandparent, etc. applications of the Priority Application(s)). In addition, the present application is related to the “Related Applications,” if any, listed below.

PRIORITY APPLICATIONS

None

RELATED APPLICATIONS

None

The United States Patent Office (USPTO) has published a notice to the effect that the USPTO's computer programs require that patent applicants reference both a serial number and indicate whether an application is a continuation, continuation-in-part, or divisional of a parent application. Stephen G. Kunin, Benefit of Prior-Filed Application, USPTO Official Gazette Mar. 18, 2003. The USPTO further has provided forms for the Application Data Sheet which allow automatic loading of bibliographic data but which require identification of each application as a continuation, continuation-in-part, or divisional of a parent application. The present Applicant Entity (hereinafter “Applicant”) has provided above a specific reference to the application(s) from which priority is being claimed as recited by statute. Applicant understands that the statute is unambiguous in its specific reference language and does not require either a serial number or any characterization, such as “continuation” or “continuation-in-part,” for claiming priority to U.S. patent applications. Notwithstanding the foregoing, Applicant understands that the USPTO's computer programs have certain data entry requirements, and hence Applicant has provided designation(s) of a relationship between the present application and its parent application(s) as set forth above and in any ADS filed in this application, but expressly points out that such designation(s) are not to be construed in any way as any type of commentary and/or admission as to whether or not the present application contains any new matter in addition to the matter of its parent application(s).

If the listings of applications provided above are inconsistent with the listings provided via an ADS, it is the intent of the Applicant to claim priority to each application that appears in the Priority Applications section of the ADS and to each application that appears in the Priority Applications section of this application.

All subject matter of the Priority Applications and the Related Applications and of any and all parent, grandparent, great-grandparent, etc. applications of the Priority Applications and the Related Applications, including any priority claims, is incorporated herein by reference to the extent such subject matter is not inconsistent herewith.

SUMMARY

For example, and without limitation, an embodiment of the subject matter described herein includes a heat pipe system. In this embodiment, the heat pipe system includes an evaporator portion having a wall internally defining an evaporator chamber and configured to evaporate a liquid phase of a working fluid by absorbing heat. The system includes a condenser portion having a wall internally defining a condenser chamber and configured to condense a vapor phase of the working fluid by releasing heat. The system includes the working fluid. The system includes a channeled heat transfer array including at least two tubes. Each tube of the at least two tubes has a wall defining (i) a channel open to an intermediate fluid and (ii) an exterior surface directly exposed to the working fluid. The evaporator chamber, the condenser chamber, and the exterior surfaces of the at least two tubes of the channeled heat transfer array form a hermetically sealed hollow vessel containing the working fluid. In an embodiment, the heat pipe system includes a transport portion having an internal passageway configured to flow the working fluid between the evaporator chamber and the condenser chamber.

For example, and without limitation, an embodiment of the subject matter described herein includes a heat transfer method. In this embodiment, the method includes flowing an intermediate fluid carrying heat absorbed from a heat generating device through an array of at least two tubes. Each tube of the array of at least two tubes having a wall defining (i) a channel flowing of the intermediate fluid and (ii) an exterior surface exposed to a liquid phase of a working fluid present in a first chamber of a hermetically sealed vessel. The method includes absorbing heat from the intermediate fluid by evaporating the liquid phase of the working fluid into a vapor phase. The method includes flowing the vapor-phase working fluid to a second chamber of the hermetically sealed vessel. The method includes releasing heat from the vapor-phase working fluid present in the second chamber to a heat sink by condensing the vapor-phase working fluid into the liquid phase working fluid. The method includes flowing the liquid phase working fluid back to the first chamber.

In an embodiment, the method includes flowing the liquid-phase working fluid proximate to the exterior surface of each wall of the at least two tubes using a capillary action. In an embodiment, the method includes assisting the condensing the vapor-phase working fluid by flowing another intermediate fluid thermally coupled with the heat sink through another array of at least two tubes. Each tube of the another array at of least two tubes has a wall defining (i) a channel flowing the another intermediate fluid and (ii) an exterior surface exposed to the vapor-phase working fluid present in the second chamber.

For example, and without limitation, an embodiment of the subject matter described herein includes a heat transfer method. In this embodiment, the method includes absorbing heat by evaporating a liquid phase of a working fluid present in a first chamber of a hermetically sealed vessel. The method includes flowing the vapor-phase working fluid to a second chamber of the hermetically sealed vessel. The method includes releasing heat from the vapor-phase working fluid present in the second chamber to a heat sink by condensing the vapor-phase working fluid into the liquid phase working fluid. The condensing the vapor-phase working fluid includes flowing an intermediate fluid thermally coupled with the heat sink through an array of at least two tubes. Each tube of the array of at least two tubes has a wall defining (i) a channel flowing the intermediate fluid and (ii) an exterior surface exposed to the vapor-phase working fluid present in the second chamber. The method includes flowing the liquid phase working fluid back to the first chamber. In an embodiment, the condensing the vapor-phase working fluid further includes flowing the vapor-phase working fluid proximate to the exterior surface of each wall of the at least two tubes using a capillary action.

The foregoing summary is illustrative only and is not intended to be in any way limiting. In addition to the illustrative aspects, embodiments, and features described above, further aspects, embodiments, and features will become apparent by reference to the drawings and the following detailed description.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 illustrates an example environment 100;

FIG. 2 illustrates additional features of the heat transfer array 160 of FIG. 1;

FIG. 3 illustrates an example operational flow 200; and

FIG. 4 illustrates an example operational flow 300.

DETAILED DESCRIPTION

In the following detailed description, reference is made to the accompanying drawings, which form a part hereof. In the drawings, similar symbols typically identify similar components, unless context dictates otherwise. The illustrative embodiments described in the detailed description, drawings, and claims are not meant to be limiting. Other embodiments may be utilized, and other changes may be made, without departing from the spirit or scope of the subject matter presented here.

FIG. 1 illustrates an example environment 100. The environment includes a heat pipe 110, a heat source 101, and a heat sink 102. The heat pipe includes an evaporator portion 120 having a wall 122 internally defining an evaporator chamber 124 and configured to evaporate a liquid phase 150LP of a working fluid 150 by absorbing heat originating from the heat source 101. The heat pipe includes a condenser portion 130 having a wall 132 internally defining a condenser chamber 134 and configured to condense a vapor phase 150VP of the working fluid by releasing heat 106. The heat pipe includes the working fluid, illustrated as the liquid phase 150LP and the vapor phase 150VP of the working fluid. The heat pipe includes a channeled heat transfer array 160. In an embodiment, the condenser portion (and its condenser chamber) and the evaporator portion (and its evaporator chamber) are portions of a single structure having a single chamber, wherein one portion of the single chamber functions as a condenser chamber and another portion of the single chamber functions as a condenser chamber.

The evaporator chamber 120, the condenser chamber 130, and the exterior surfaces of the at least two tubes of the channeled heat transfer array 160 form a hermetically sealed hollow vessel containing the working fluid 150.

FIG. 2 illustrates additional features of the heat transfer array 160. The heat transfer array may be deployed in the evaporator portion 120, or the condenser portion 130 (not illustrated). In an embodiment, the heat transfer array may be deployed in the evaporator portion, and another heat transfer array may be deployed in the condenser portion. The heat transfer array is illustrated in FIGS. 1 and 2 as deployed in conjunction with the condenser portion for illustrative purposes. The heat transfer array includes at least two tubes 162. The at least two tubes are illustrated as tube 162A, tube 162B, and tube 162C. Each tube of the at least two tubes has a wall. For example, the tube 162A includes a wall 163A. The wall of each tube defines a channel open to an intermediate fluid 180. For example, the wall 163A of the tube 162A defines a channel 164A open to the intermediate fluid. For example, the intermediate fluid may include an intermediate fluid communicating between the heat sink 102 and the channels of the at least two tubes, illustrated by flow 166B and manifolds 170L and 170R. In an embodiment, the intermediate fluid includes an environment relating to the immediate surroundings or conditions to the heat pipe 110. In an embodiment, the intermediate fluid includes the environment that surrounds the heat pipe. Further, the wall of each tube of the at least two tubes has an exterior surface directly exposed to the working fluid 150. For example, the wall 163A of the tube 162A has an exterior surface 165A directly exposed to the working fluid contained within the condenser chamber 134, illustrated as the vapor phase 150VP of the working fluid.

In an embodiment, the heat pipe 102 may comprise a loop heat pipe. In an embodiment, the heat pipe may comprise a flat heat pipe. In an embodiment, the relative elevations of the evaporator portion 120 and condenser portions 130 may be interchangeable depending on the deployed orientation of the heat pipe. For example, in the embodiment illustrated in FIG. 1, the condenser portion is above the evaporator portion. In another embodiment, the evaporator portion may be above the condenser portion. In another embodiment, the evaporator portion and the condenser portion may be at a substantially same elevation. In an embodiment, the condenser portion or the evaporation portion may be made from a copper, Monel, or titanium material.

Continuing with FIG. 1, in an embodiment, the evaporator portion 120 is configured to evaporate a liquid phase 150LP of the working fluid 150 by absorbing heat from the heat source 101. In an embodiment, the condenser portion 130 is configured to condense a vapor phase 150VP of the working fluid by releasing heat 106 to the heat sink 102.

In an embodiment, the heat pipe 102 includes a transport portion 140 having an internal passageway 144 configured to flow the working fluid 150 between the evaporator chamber 124 and the condenser chamber 134. In an embodiment, the evaporator chamber, the condenser chamber, the internal flow passageway, and the exterior surfaces of the at least two tubes 162 of the channeled heat transfer array 160 form a hermetically sealed hollow vessel containing the working fluid. In an embodiment, the transport portion includes a capillary structure 146 configured to facilitate transportation of the working fluid in a liquid phase from the condenser portion to the evaporator portion. For example, the capillary structure may include a sintered metal powder wick, grooved wick, or metal mesh wick. For example, the capillary structure may include axial grooves, mesh screen, sintered metal powders, sintered metal powder grooves (fine grooves), sintered slab or sintered metal powder grooves. In an embodiment, the transport portion includes (i) a first transport portion configured to flow a vapor phase 150VP of the working fluid from the evaporator chamber to the condenser chamber; and (ii) a second transport portion configured to flow a liquid phase 150LP of the working fluid from the condenser chamber to the evaporator chamber (not illustrated). In an embodiment, the first transport portion defines a first internal passageway. In an embodiment, the second transport portion defines a second internal passageway. In an embodiment, the second transport portion includes a capillary material. In an embodiment, the second transport portion includes a wicking material. In an embodiment, the second transport portion includes a grooved surface.

In an embodiment, a surface of the hermetically sealed hollow vessel comprises a capillary structure configured to facilitate transportation of the working fluid. In an embodiment, the capillary structure comprises a capillary material. In an embodiment, the capillary structure comprises a wicking material. In an embodiment, the capillary structure comprises a grooved surface.

In an embodiment, the working fluid 150 includes a working fluid tuned to a particular cooling situation. For example, a particular cooling situation may include cooling a CPU, a piece of high voltage transmission line equipment, or a communication or instrumentation device. For example, the tuned to a particular cooling situation may include tuned to function over an expected temperature range of the heat source 101 and the heat sink 102. In an embodiment, the working fluid includes a working fluid tuned to a cooling situation in which the heat pipe is designed to operate.

In an embodiment, the channeled heat transfer array is located at least partially within the evaporator chamber 120. In an embodiment, the channeled heat transfer array is located at least partially within the condenser chamber 130. In an embodiment, the channeled heat transfer array includes (i) a first channeled heat transfer array located at least partially within the evaporator chamber, (ii) and a second channeled heat transfer array located at least partially within the condenser chamber. In an embodiment, the channel of a tube of the at least two tubes is directly exposed to an intermediate fluid (not illustrated).

In an embodiment, the at least two tubes 162 of the array 160 include at least two microtubes. Each microtube has a microchannel configured to facilitate a laminar flow of the intermediate fluid 180 through the microchannel. The intermediate fluid may be a gas or a liquid, which may depend on the operating temperature of the heat pipe. Laminar flow through a microchannel is illustrated by the flow 166B through the tube 162B in FIG. 2. In an embodiment, the microchannel is sized or shaped to facilitate a laminar flow. For example, the fluid may include an intermediate fluid 180. In an embodiment, the microchannel has a cross-sectional dimension of less than about 1000 microns. In an embodiment, the microchannel has a cross-sectional dimension that is about equal to or less than the thermal boundary layer thickness of the intermediate fluid. In an embodiment, the microchannel is a channel in which the hydraulic diameter, expressed as four times the cross sectional area of the channel divided by the perimeter of the cross section, is less than approximately 1000 microns.

One of the advantages of using microchannel structures is that turbulent flow within the channels is not necessary to increase heat transfer efficiency. Microchannel structures neither require nor create turbulent flow. Conventional macrochannels require turbulence to increase cooling efficiency otherwise the fluid flowing in the middle of the channel stays relatively cool. Turbulent flow within the fluid channel mixes the hot fluid next to the wall of the channel with the cooler fluid in the middle of the channel. However, such turbulence and mixing decreases the efficiency of cooling. Microchannels, instead, have the advantage that the heat transfer coefficient “h” is inversely proportional to the width of the channel. As “h” decreases efficiency increases. A very narrow channel completely heats a very thin layer of fluid as it travels through the collector.

In an embodiment, the exterior surface of a wall of a tube of the at least two tubes lying within the hermetically sealed hollow vessel is directly exposed to the working fluid. FIG. 2 illustrates an embodiment where the exterior surface 165A of a wall 163A of a tube 162A of the at least two tubes 162 lies within the hermetically sealed hollow vessel and is directly exposed to the working fluid 150. In an embodiment, the exterior surface of a wall of a tube of the at least two tubes is directly exposed to the working fluid over at least 50% of its area. In an embodiment, the exterior surface of a wall of a tube of the at least two tubes is directly exposed to the working fluid over at least 75% of its area. In an embodiment, the exterior surface of a wall of a tube of the at least two tubes is directly exposed to the working fluid over at least 95% of its area. In an embodiment, a circumference of the exterior surface of a wall of a tube of the at least two tubes within the hermetically sealed hollow vessel is directly exposed to the working fluid. In an embodiment, a circumference of exterior surface of a wall of a tube of the at least two tubes within the hermetically sealed hollow vessel is directly exposed to the working fluid along at least 50% of the length of the exterior surface. In an embodiment, a circumference of exterior surface of a wall of a tube of the at least two tubes within the hermetically sealed hollow vessel is directly exposed to the working fluid along at least 75% of the length of the exterior surface.

In an embodiment, the exterior surface of a wall of a tube of the at least two tubes within the hermetically sealed hollow vessel is at least partially covered with a capillary structure that is directly exposed to the working fluid. FIG. 2 illustrates an embodiment where an exterior surface of a wall of the tube 162B of the at least two tubes 162 lying within the hermetically sealed hollow vessel is covered with a capillary structure 167B that is directly exposed to the working fluid 150. In an embodiment, the exterior surface of a wall of a tube of the at least two tubes within the hermetically sealed hollow vessel is covered over at least 50% of its area with a capillary structure that is directly exposed to the working fluid. In an embodiment, the exterior surface of a wall of a tube of the at least two tubes within the hermetically sealed hollow vessel is covered over at least 75% of its area with a capillary structure that is directly exposed to the working fluid.

In an embodiment, at least one channel of a tube of the at least two tubes 160 has a non-circular cross section. In an embodiment, the at least one channel of a tube of the at least two tubes has an elliptical cross section. In an embodiment, the at least one channel of a tube of the at least two tubes has a rectangular cross section.

FIG. 3 illustrates an example operational flow 200. After a start operation, the operational flow includes a heat transfer operation 210. The heat transfer operation includes flowing an intermediate fluid carrying heat absorbed from a heat generating device through an array of at least two tubes. Each tube of the array of at least two tubes has a wall defining (i) a channel flowing the intermediate fluid and (ii) an exterior surface exposed to a liquid phase of a working fluid present in a first chamber of a hermetically sealed vessel. In an embodiment, the intermediate fluid may include an air, liquid, or gas. In an embodiment, the heat transfer operation may be implemented using the channeled heat transfer array 160 described in conjunction with FIGS. 1 and 2. An absorption operation 220 includes absorbing heat from the intermediate fluid by evaporating the liquid phase of the working fluid into a vapor phase. In an embodiment, the absorption operation may be implemented using the channeled heat transfer array 160 and the evaporator chamber 120 described in conjunction with FIGS. 1 and 2. A fluid transfer operation 230 includes flowing the vapor-phase working fluid to a second chamber of the hermetically sealed vessel. In an embodiment, the fluid transfer operation may be implemented using the transport portion 140 described in conjunction with FIG. 1. A release operation 240 includes releasing heat from the vapor-phase working fluid present in the second chamber to a heat sink by condensing the vapor-phase working fluid into the liquid phase working fluid. In an embodiment, the release operation may be implemented using the condenser portion 130 described in conjunction with FIG. 1. A return operation 260 includes flowing the liquid phase working fluid back to the first chamber. In an embodiment, the return operation may be implemented using the transport portion 140 described in conjunction with FIG. 1. The operational flow includes an end operation.

In an embodiment, the absorption operation 220 further includes flowing the liquid-phase working fluid proximate to the exterior surface of each wall of the at least two tubes using a capillary action. In an embodiment, the exterior surface includes an exterior surface having at least a portion covered with a capillary structure facilitating evaporation of the liquid-phase working fluid. In an embodiment, the absorption operation may be implemented using the capillary structure 167B described in conjunction with FIG. 2. In an embodiment, the array of at least two tubes includes an array of at least two microtubes, each microtube having a microchannel configured to facilitate a laminar flow of the intermediate fluid through the microchannel. In an embodiment, the fluid transfer operation 230 further includes flowing the liquid phase working fluid back to the first chamber using a capillary action. The method of claim 35, wherein the return operation 260 further includes flowing the liquid phase working fluid back to the first chamber using a capillary action.

In an embodiment, the operational flow 200 includes assisting 250 the condensing the vapor-phase working fluid by flowing another intermediate fluid thermally coupled with the heat sink through another array of at least two tubes. Each tube of the another array at least two tubes having a wall defining (i) a channel flowing the another intermediate fluid and (ii) an exterior surface exposed to the vapor-phase working fluid present in the second chamber. The operation 250 may be implemented using another instance of the channeled heat transfer array 160 and the evaporator chamber 120 described in conjunction with FIGS. 1 and 2. In an embodiment, the assisting the condensing further includes flowing the condensed liquid-phase of the vapor-phase working fluid proximate to the exterior surface of each wall of the at least two tubes of the another array using a capillary action.

FIG. 4 illustrates an example operational flow 300. After a start operation, the operational flow includes an absorption operation 310. The absorption operation includes absorbing heat by evaporating a liquid phase of a working fluid present in a first chamber of a hermetically sealed vessel to a vapor phase. In an embodiment, the absorption operation may be implemented using the evaporator chamber 120 described in conjunction with FIG. 1. A fluid transfer operation 320 includes flowing the vapor-phase working fluid to a second chamber of the hermetically sealed vessel. In an embodiment, the fluid transfer operation may be implemented using the transport portion 140 described in conjunction with FIG. 1. A release operation 330 includes releasing heat from the vapor-phase working fluid present in the second chamber to a heat sink by condensing the vapor-phase working fluid into the liquid-phase working fluid. The condensing the vapor-phase working fluid includes flowing an intermediate fluid thermally coupled with the heat sink through an array of at least two tubes. Each tube of the array at least two tubes having a wall defining (i) a channel flowing the intermediate fluid and (ii) an exterior surface exposed to the vapor-phase working fluid present in the second chamber. In an embodiment the release operation may be implemented using the condenser portion described in conjunction with FIG. 1 and the channeled heat transfer array 160 described in conjunction with FIGS. 1 and 2. A return operation 340 includes flowing the liquid-phase working fluid back to the first chamber. In an embodiment, the return operation may be implemented using the transport portion 140 described in conjunction with FIG. 1. The operational flow includes an end operation.

In an embodiment, the condensing the vapor-phase working fluid further includes flowing the condensed liquid-phase of the vapor-phase working fluid proximate to the exterior surface of each wall of the at least two tubes using a capillary action. In an embodiment, the exterior surface includes an exterior surface having at least a portion covered with a capillary structure further facilitating the condensing the vapor-phase working fluid.

All references cited herein are hereby incorporated by reference in their entirety or to the extent their subject matter is not otherwise inconsistent herewith.

In some embodiments, “configured” includes at least one of designed, set up, shaped, implemented, constructed, or adapted for at least one of a particular purpose, application, or function.

It will be understood that, in general, terms used herein, and especially in the appended claims, are generally intended as “open” terms. For example, the term “including” should be interpreted as “including but not limited to.” For example, the term “having” should be interpreted as “having at least.” For example, the term “has” should be interpreted as “having at least.” For example, the term “includes” should be interpreted as “includes but is not limited to,” etc. It will be further understood that if a specific number of an introduced claim recitation is intended, such an intent will be explicitly recited in the claim, and in the absence of such recitation no such intent is present. For example, as an aid to understanding, the following appended claims may contain usage of introductory phrases such as “at least one” or “one or more” to introduce claim recitations. However, the use of such phrases should not be construed to imply that the introduction of a claim recitation by the indefinite articles “a” or “an” limits any particular claim containing such introduced claim recitation to inventions containing only one such recitation, even when the same claim includes the introductory phrases “one or more” or “at least one” and indefinite articles such as “a” or “an” (e.g., “a receiver” should typically be interpreted to mean “at least one receiver”); the same holds true for the use of definite articles used to introduce claim recitations. In addition, even if a specific number of an introduced claim recitation is explicitly recited, it will be recognized that such recitation should typically be interpreted to mean at least the recited number (e.g., the bare recitation of “at least two chambers,” or “a plurality of chambers,” without other modifiers, typically means at least two chambers).

In those instances where a phrase such as “at least one of A, B, and C,” “at least one of A, B, or C,” or “an [item] selected from the group consisting of A, B, and C,” is used, in general such a construction is intended to be disjunctive (e.g., any of these phrases would include but not be limited to systems that have A alone, B alone, C alone, A and B together, A and C together, B and C together, or A, B, and C together, and may further include more than one of A, B, or C, such as A₁, A₂, and C together, A, B₁, B₂, C₁, and C₂ together, or B₁ and B₂ together). It will be further understood that virtually any disjunctive word or phrase presenting two or more alternative terms, whether in the description, claims, or drawings, should be understood to contemplate the possibilities of including one of the terms, either of the terms, or both terms. For example, the phrase “A or B” will be understood to include the possibilities of “A” or “B” or “A and B.”

The herein described aspects depict different components contained within, or connected with, different other components. It is to be understood that such depicted architectures are merely examples, and that in fact many other architectures can be implemented which achieve the same functionality. In a conceptual sense, any arrangement of components to achieve the same functionality is effectively “associated” such that the desired functionality is achieved. Hence, any two components herein combined to achieve a particular functionality can be seen as “associated with” each other such that the desired functionality is achieved, irrespective of architectures or intermedial components. Likewise, any two components so associated can also be viewed as being “operably connected,” or “operably coupled,” to each other to achieve the desired functionality. Any two components capable of being so associated can also be viewed as being “operably couplable” to each other to achieve the desired functionality. Specific examples of operably couplable include but are not limited to physically mateable or physically interacting components or wirelessly interactable or wirelessly interacting components.

With respect to the appended claims, the recited operations therein may generally be performed in any order. Also, although various operational flows are presented in a sequence(s), it should be understood that the various operations may be performed in other orders than those which are illustrated, or may be performed concurrently. Examples of such alternate orderings may include overlapping, interleaved, interrupted, reordered, incremental, preparatory, supplemental, simultaneous, reverse, or other variant orderings, unless context dictates otherwise. Use of “Start,” “End,” “Stop,” or the like blocks in the block diagrams is not intended to indicate a limitation on the beginning or end of any operations or functions in the diagram. Such flowcharts or diagrams may be incorporated into other flowcharts or diagrams where additional functions are performed before or after the functions shown in the diagrams of this application. Furthermore, terms like “responsive to,” “related to,” or other past-tense adjectives are generally not intended to exclude such variants, unless context dictates otherwise.

While various aspects and embodiments have been disclosed herein, other aspects and embodiments will be apparent to those skilled in the art. The various aspects and embodiments disclosed herein are for purposes of illustration and are not intended to be limiting, with the true scope and spirit being indicated by the following claims.

Claims

1. A heat pipe comprising:

an evaporator portion having a wall internally defining an evaporator chamber and configured to evaporate a liquid phase of a working fluid by absorbing heat;

a condenser portion having a wall internally defining a condenser chamber and configured to condense a vapor phase of the working fluid by releasing heat;

a channeled heat transfer array including at least two tubes, each tube of the at least two tubes having a wall defining (i) a channel open to an external environment and (ii) an exterior surface directly exposed to the working fluid; and

the evaporator chamber, the condenser chamber, and the exterior surfaces of the at least two tubes of the channeled heat transfer array forming a hermetically sealed hollow vessel containing the working fluid.

2. The heat pipe of claim 1, wherein the evaporator portion is configured to evaporate a liquid phase of the working fluid by absorbing heat from a heat source.

3. The heat pipe of claim 1, wherein the condenser portion is configured to condense a vapor phase of the working fluid by releasing heat to a heat sink.

4. The heat pipe of claim 1, further comprising:

a transport portion having an internal passageway configured to flow the working fluid between the evaporator chamber and the condenser chamber.

5. The heat pipe of claim 4, wherein the evaporator chamber, the condenser chamber, the internal flow passageway, and the exterior surfaces of the at least two tubes of the channeled heat transfer array form a hermetically sealed hollow vessel containing the working fluid.

6. The heat pipe of claim 4, wherein the transport portion includes a capillary structure configured to facilitate transportation of the working fluid in a liquid phase from the condenser portion to the evaporator portion.

7. The heat pipe of claim 4, wherein the transport portion includes (i) a first transport portion configured to flow a vapor phase of the working fluid from the evaporator chamber to the condenser chamber; and (ii) a second transport portion configured to flow a liquid phase of the working fluid from the condenser chamber to the evaporator chamber.

8. The heat pipe of claim 7, wherein the first transport portion defines a first internal passageway.

9. The heat pipe of claim 7, wherein the second transport portion defines a second internal passageway.

10. The heat pipe of claim 7, wherein the second transport portion includes a capillary material.

11. The heat pipe of claim 7, wherein the second transport portion includes a wicking material.

12. The heat pipe of claim 7, wherein the second transport portion includes a grooved surface.

13. The heat pipe of claim 1, wherein a surface of the hermetically sealed hollow vessel comprises a capillary structure configured to facilitate transportation of the working fluid.

14. The heat pipe of claim 13, wherein the capillary structure comprises a capillary material.

15. The heat pipe of claim 13, wherein the capillary structure comprises a wicking material.

16. The heat pipe of claim 13, wherein the capillary structure comprises a grooved surface.

17. The heat pipe of claim 1, wherein the working fluid includes a working fluid tuned to a particular cooling situation.

18. The heat pipe of claim 1, wherein the working fluid includes a working fluid tuned to a cooling situation in which the heat pipe is designed to operate.

19. The heat pipe of claim 1, wherein the channeled heat transfer array is located at least partially within the evaporator chamber.

20. The heat pipe of claim 1, wherein the channeled heat transfer array is located at least partially within the condenser chamber.

21. The heat pipe of claim 1, wherein the channeled heat transfer array includes (i) a first channeled heat transfer array located at least partially within the evaporator chamber, (ii) and a second channeled heat transfer array located at least partially within the condenser chamber.

22. The heat pipe of claim 1, wherein the channel of a tube of the at least two tubes is directly exposed to an intermediate fluid.

23. The heat pipe of claim 1, wherein the channel of a tube of the at least two microtubes includes a microchannel configured to facilitate a laminar flow of a fluid through the microchannel.

24. (canceled)

25. (canceled)

26. (canceled)

27. The heat pipe of claim 1, wherein the intermediate fluid includes air, a liquid, or a gas.

28. The heat pipe of claim 1, wherein the exterior surface of a wall of a tube of the at least two tubes lying within the hermetically sealed hollow vessel is directly exposed to the working fluid.

29. (canceled)

30. (canceled)

31. (canceled)

32. The heat pipe of claim 1, wherein a circumference of the exterior surface of a wall of a tube of the at least two tubes within the hermetically sealed hollow vessel is directly exposed to the working fluid.

33. (canceled)

34. (canceled)

35. The heat pipe of claim 1, wherein the exterior surface of a wall of a tube of the at least two tubes within the hermetically sealed hollow vessel is at least partially covered with a capillary structure that is directly exposed to the working fluid.

36. (canceled)

37. (canceled)

38. The heat pipe of claim 1, wherein at least one channel of a tube of the at least two tubes has a non-circular cross section.

39. The heat pipe of claim 1, wherein at least one channel of a tube of the at least two tubes has an elliptical cross section.

40. The heat pipe of claim 1, wherein at least one channel of a tube of the at least two tubes has a rectangular cross section.

41. A heat transfer method comprising:

flowing an intermediate fluid carrying heat absorbed from a heat generating device through an array of at least two tubes, each tube of the array of at least two tubes having a wall defining (i) a channel flowing the intermediate fluid and (ii) an exterior surface exposed to a liquid phase of a working fluid present in a first chamber of a hermetically sealed vessel;

absorbing heat from the intermediate fluid by evaporating the liquid phase of the working fluid into a vapor phase;

flowing the vapor-phase working fluid to a second chamber of the hermetically sealed vessel;

releasing heat from the vapor-phase working fluid present in the second chamber to a heat sink by condensing the vapor-phase working fluid into the liquid phase working fluid; and

flowing the liquid phase working fluid back to the first chamber.

42. The method of claim 41, wherein the absorbing heat further includes flowing the liquid-phase working fluid proximate to the exterior surface of each wall of the at least two tubes using a capillary action.

43. The method of claim 41, wherein the array of at least two tubes includes an array of at least two microtubes, each microtube having a microchannel configured to facilitate a laminar flow of the intermediate fluid through the microchannel.

44. The method of claim 41, wherein the flowing further includes flowing the liquid phase working fluid back to the first chamber using a capillary action.

45. The method of claim 41, further comprising:

assisting the condensing the vapor-phase working fluid by flowing another intermediate fluid thermally coupled with the heat sink through another array of at least two tubes, each tube of the another array at least two tubes having a wall defining (i) a channel flowing the another intermediate fluid and (ii) an exterior surface exposed to the vapor-phase working fluid present in the second chamber.

46. The method of claim 45, wherein the assisting the condensing further includes flowing the condensed liquid-phase of the vapor-phase working fluid proximate to the exterior surface of each wall of the at least two tubes of the another array using a capillary action.

47. A heat transfer method comprising:

absorbing heat by evaporating a liquid phase of a working fluid present in a first chamber of a hermetically sealed vessel to a vapor-phase;

flowing the vapor-phase working fluid to a second chamber of the hermetically sealed vessel;

releasing heat from the vapor-phase working fluid present in the second chamber to a heat sink by condensing the vapor-phase working fluid into the liquid-phase working fluid, the condensing vapor-phase working fluid including flowing an intermediate fluid thermally coupled with the heat sink through an array of at least two tubes, each tube of the array at least two tubes having a wall defining (i) a channel flowing the intermediate fluid and (ii) an exterior surface exposed to the vapor-phase working fluid present in the second chamber; and

flowing the liquid phase working fluid back to the first chamber.

48. The method of claim 47, wherein the condensing the vapor-phase working fluid further includes flowing the condensed liquid-phase of the vapor-phase working fluid proximate to the exterior surface of each wall of the at least two tubes using a capillary action.

49. The method of claim 47, wherein the exterior surface includes an exterior surface having at least a portion covered with a capillary structure further facilitating condensation of the vapor-phase working fluid.

50. The method of claim 47, wherein the flowing further includes flowing the liquid-phase working fluid back to the first chamber using a capillary action.