INTEGRATED CIRCUIT PACKAGE
An integrated circuit package comprising a semiconductor die, a lead frame lying in a first plane, at least one conductive pillar structure extending outwardly from the first plane, wherein the lead frame and the at least one conductive pillar structure are formed of sintered conductive material, encapsulation material which encapsulates the semiconductor die, the lead frame and the at least one conductive pillar structure, a conductive layer on an upper face of the package, the conductive layer conductively connecting to the at least one conductive pillar. Methods of manufacturing are also disclosed.
There is an increasing drive to reduce the size of electronic circuitry. A range of integrated circuit packages have been developed with a reduced form factor.
Integrated circuits are susceptible to Electromagnetic Interference (EMI). EMI interference can be caused by a source which is external to a circuit board, or from other devices on the same circuit board. The problem of EMI between devices is further compounded by reduced spacing of devices on a circuit board. It is known, that to provide EMI shielding to integrated circuit packages can either increase the size of the package to an undesirable extent or can require additional process steps during manufacture which can increase the complexity and cost of manufacturing the package.
The embodiments described below are not limited to implementations which solve any or all of the disadvantages of known arrangements for shielding a package.
SUMMARYThis Summary is provided to introduce a selection of concepts in a simplified form that are further described below in the Detailed Description. This Summary is not intended to identify key features or essential features of the claimed subject matter, nor is it intended to be used as an aid in determining the scope of the claimed subject matter.
An aspect of the disclosure provides an integrated circuit package comprising: a semiconductor die; a lead frame lying in a first plane; at least one conductive pillar structure extending outwardly from the first plane, wherein the lead frame and the at least one conductive pillar structure are formed of sintered conductive material; encapsulation material which encapsulates the semiconductor die, the lead frame and the at least one conductive pillar structure; a conductive layer on an upper face of the package, the conductive layer conductively connecting to the at least one conductive pillar.
The at least one conductive pillar structure may have a height which is greater than a height of the lead frame.
The at least one conductive pillar structure may extend perpendicularly to the first plane.
The package may comprise a plurality of the conductive pillars.
The plurality of the conductive pillars may be spaced around a perimeter of the lead frame.
The at least one conductive pillar may be located on a perimeter of the package. Alternatively, the at least one conductive pillar may be offset inwardly from a perimeter of the package.
The at least one conductive pillar may comprise a continuous wall of conductive material located around a perimeter of the lead frame.
The wall may be located on a perimeter of the package.
The conductive layer may form at least one of an EMI shield for the package and a thermal shield for the package.
The conductive layer may be a conductive sheet material.
The conductive layer may be sintered conductive material.
The sintered conductive material may be sintered metal.
The sintered conductive material may be sintered silver.
The sintered conductive material may be thermally conductive.
The sintered conductive material may be electrically conductive.
The package may further comprise a thermal pad beneath the semiconductor die. A conductive path may connect the at least one conductive pillar structure to the thermal pad.
Another aspect of the disclosure provides a method of packaging a semiconductor die comprising: forming a lead frame by depositing conductive material onto a surface of a carrier at locations where elements of the lead frame are required; forming at least one conductive pillar structure by depositing the conductive material onto the surface of the carrier at a locations where the at least one conductive pillar structure is required, wherein the conductive material is sintered conductive material; attaching a semiconductor die; connecting the semiconductor die to the lead frame; encapsulating the semiconductor die, the lead frame and the at least one conductive pillar structure to form an encapsulated package; adding a conductive layer to an upper face of the encapsulated package, the conductive layer conductively connecting to the at least one conductive pillar; and removing the carrier.
The at least one conductive pillar structure may be formed with a height which is greater than a height of the lead frame.
The at least one conductive pillar structure may be formed by a plurality of stages of depositing the conductive material with curing between the stages.
Adding a conductive layer may comprise depositing a layer of the conductive material on the upper face of the encapsulated package.
Adding a conductive layer may comprise attaching a conductive sheet to the upper face of the encapsulated package.
Depositing the conductive material may comprise one of: screen printing the conductive material; printing the conductive material.
The preferred features may be combined as appropriate, as would be apparent to a skilled person, and may be combined with any of the aspects of the invention.
Embodiments of the invention will be described, by way of example, with reference to the following drawings, in which:
Common reference numerals are used throughout the figures to indicate similar features.
DETAILED DESCRIPTIONEmbodiments of the present invention are described below by way of example only. These examples represent the best ways of putting the invention into practice that are currently known to the Applicant although they are not the only ways in which this could be achieved. The description sets forth the functions of the example and the sequence of steps for constructing and operating the example. However, the same or equivalent functions and sequences may be accomplished by different examples.
At
At
At
At
In a subsequent stage, not shown, the conductive material is subjected to a set of process conditions in which heat is applied for a defined period of time under a set of recommended environmental conditions which evaporates the suspension component of the paste to form a sintered solid at
Conductive material is deposited in a plurality of stages to achieve a desired height of the at least one pillar 23. An example thickness of material deposited in a stage is 25 microns. The elements 22 of the lead frame may only require a single stage of deposition and sintering. The at least one pillar 23 may require multiple stages of material deposition. FIG. 3E shows a further stage of the manufacturing process, with a further stencil 32. Stencil 32 can be applied over other elements 22 of the lead frame, as shown in
At
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The package shown in
At
The conductive layer 29 provides EMI shielding to the semiconductor die 26. The EMI shielding can shield the die from sources of EMI which are external to the package. Additionally, or alternatively, the EMI shielding can shield any device external to the package from EMI arising from the die 26. Additionally, or alternatively, the conductive layer 29 can conduct heat, and can help to spread/dissipate heat generated by the die 26. Links 23A connect pillars 23 to the thermal pad 24. The thermal pad 24 is typically connected to the PCB 45, 46 by solder 47. The PCB 46 may include thermal vias to dissipate the heat.
The further iteration, or iterations, of blocks 106-108 provides the at least one conductive pillar structure with a height which is greater than a combined height of the semiconductor die, wire loop height, die attach, minimum separation between wire loop height and package top surface and the lead frame.
As the pillar structure(s) 23 and elements 22 of the lead frame are formed at the same time, this reduces the number of manufacturing process stage needed to provide a connection between a conductive shield layer. For example, the method described above does not require any further stages after the conductive shield layer has been fitted to the package.
Any range or device value given herein may be extended or altered without losing the effect sought, as will be apparent to the skilled person.
It will be understood that the benefits and advantages described above may relate to one embodiment or may relate to several embodiments. The embodiments are not limited to those that solve any or all of the stated problems or those that have any or all of the stated benefits and advantages.
Any reference to ‘an’ item refers to one or more of those items. The term ‘comprising’ is used herein to mean including the method blocks or elements identified, but that such blocks or elements do not comprise an exclusive list and a method or apparatus may contain additional blocks or elements.
The steps of the methods described herein may be carried out in any suitable order, or simultaneously where appropriate. Additionally, individual blocks may be deleted from any of the methods without departing from the spirit and scope of the subject matter described herein. Aspects of any of the examples described above may be combined with aspects of any of the other examples described to form further examples without losing the effect sought.
It will be understood that the above description of a preferred embodiment is given by way of example only and that various modifications may be made by those skilled in the art. Although various embodiments have been described above with a certain degree of particularity, or with reference to one or more individual embodiments, those skilled in the art could make numerous alterations to the disclosed embodiments without departing from the spirit or scope of this invention.
Claims
1. An integrated circuit package comprising:
- a semiconductor die;
- a lead frame lying in a first plane;
- at least one conductive pillar structure extending outwardly from the first plane, wherein the lead frame and the at least one conductive pillar structure are formed of sintered conductive material;
- encapsulation material which encapsulates the semiconductor die, the lead frame and the at least one conductive pillar structure;
- a conductive layer on an upper face of the package, the conductive layer conductively connecting to the at least one conductive pillar.
2. The package of claim 1 wherein the at least one conductive pillar structure has a height which is greater than a height of the lead frame.
3. The package of claim 1 wherein the at least one conductive pillar structure extends perpendicularly to the first plane.
4. The package of claim 1 comprising a plurality of the conductive pillars.
5. The package of claim 4 wherein the plurality of the conductive pillars are spaced around a perimeter of the lead frame.
6. The package of claim 1 wherein the at least one conductive pillar is located on a perimeter of the package.
7. The package of claim 1 wherein the at least one conductive pillar comprises a continuous wall of conductive material located around a perimeter of the lead frame.
8. The package of claim 7 wherein the wall is located on a perimeter of the package.
9. The package of claim 1 wherein the conductive layer forms at least one of: an EMI shield for the package and a thermal shield for the package.
10. The package of claim 1 wherein the conductive layer is a conductive sheet material.
11. The package of claim 1 wherein the conductive layer is sintered conductive material.
12. The package of claim 1 wherein the sintered conductive material is sintered metal.
13. The package of claim 1 wherein the sintered conductive material is sintered silver.
14. The package of claim 1 further comprising a thermal pad beneath the semiconductor die, and wherein a conductive path connects the at least one conductive pillar structure to the thermal pad.
15. A method of packaging a semiconductor die comprising:
- forming a lead frame by depositing conductive material onto a surface of a carrier at locations where elements of the lead frame are required;
- forming at least one conductive pillar structure by depositing the conductive material onto the surface of the carrier at a locations where the at least one conductive pillar structure is required, wherein the conductive material is sintered conductive material;
- attaching a semiconductor die;
- connecting the semiconductor die to the lead frame;
- encapsulating the semiconductor die, the lead frame and the at least one conductive pillar structure to form an encapsulated package;
- adding a conductive layer to an upper face of the encapsulated package, the conductive layer conductively connecting to the at least one conductive pillar; and
- removing the carrier.
16. The method of claim 15 wherein the at least one conductive pillar structure has a height which is greater than a height of the lead frame.
17. The method of claim 15 wherein the forming at least one conductive pillar structure comprises a plurality of stages of depositing the conductive material with curing between the stages.
18. The method of claim 15 wherein adding a conductive layer comprises depositing a layer of the conductive material on the upper face of the encapsulated package.
19. The method of claim 15 wherein adding a conductive layer comprises attaching a conductive sheet to the upper face of the encapsulated package.
20. The method of claim 15 wherein forming the at least one conductive pillar structure by depositing the conductive material comprises one of:
- screen printing the conductive material;
- printing the conductive material.
Type: Application
Filed: Nov 19, 2014
Publication Date: May 19, 2016
Inventor: Kevin Cannon (Cambridge)
Application Number: 14/548,056