LIQUID-COOLING HEAT DISSIPATING APPARATUS AND HEAT DISSIPATING STRUCTURE THEREOF

A liquid-cooling heat dissipating apparatus includes a heat dissipating structure and a cover. The heat dissipating structure includes a vapor chamber, a heat exchanger and a heat dissipating component. The vapor chamber has a hollow slot. The heat exchanger is installed to the vapor chamber and has plural heat exchange plates and a through hole. The through holes of the upper and lower heat exchange plates communicate with each other to form a fluid channel. The heat dissipating component includes a substrate and plural fins, and the heat dissipating component seals the hollow slot by the substrate. The cover covers the vapor chamber and forms a liquid cavity, and the heat exchanger and each fin are formed in the liquid cavity, and the cover has a water inlet and a water outlet communicating with the liquid cavity.

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Description
FIELD OF THE INVENTION

The technical field relates to heat dissipation, more particularly to a liquid-cooling heat dissipating apparatus applied to heat generating electronic components, and a heat dissipating structure of the heat dissipating apparatus.

BACKGROUND OF THE INVENTION

As the computing speed of electronic components becomes increasingly higher, the heat generated by the electronic components also becomes greater. To overcome the high heat issue effectively, manufacturers have used heat sinks, heat pipes or vapor chambers made of aluminum and copper alloys extensively, but such heat dissipating structures still require further improvements on their thermal conduction and manufacturability.

The conventional heat sink generally comprises a bottom plate and a heat dissipating fin extended from the bottom plate. Although such conventional heat sink has the feature of good heat dissipation, the thermal conductivity of the heat sink cannot be improved. Therefore, a heat dissipating structure including a vapor chamber and the aforementioned heat sink has been developed, wherein the heat sink is mounted onto the vapor chamber by a soldering material such as a solder paste, and the vapor chamber comprises an upper casing plate and a lower casing plate, and a capillary tissue is installed in an internal space of the upper and lower casing plates, and then the upper and lower casing plates are engaged with each other by soldering, and a working fluid is filled into the interior of the upper and lower casing plates, and finally the manufacturing processes of removing air and sealing take place to complete the manufacture of the heat sink.

Although the conventional heat dissipating structure has the effects of conducting and dissipating heat, its actual application still has the following problems. Since the vapor chamber is limited by space, and thus is capable of dispersing heat by a traverse flow way, so that the thermal conduction and dissipation cannot be enhanced effectively. In addition, a soldering material is coated onto the interface of the vapor chamber and the heat sink, and such material may hinder the heat transfer. Obviously, the conventional heat sink requires improvements.

In view of the aforementioned problems of the prior art, the discloser of this disclosure based on years of experience in the related industry to conduct extensive researches and experiments, and finally provided a feasible solution to overcome the problems of the prior art.

SUMMARY OF THE INVENTION

It is a primary objective of this disclosure to provide a liquid-cooling heat dissipating apparatus and a heat dissipating structure of the apparatus, and use a vapor chamber, a heat exchanger, and a heat dissipating component to improve the thermal conduction and dissipation of the liquid-cooling heat dissipating apparatus and the heat dissipating structure.

To achieve the aforementioned and other objectives, this disclosure provides a liquid-cooling heat dissipating apparatus comprising a heat dissipating structure and a cover, and the heat dissipating structure further comprises a vapor chamber, a heat exchanger and a heat dissipating component, and the vapor chamber has a hollow slot penetrating through the vapor chamber; the heat exchanger is installed above the vapor chamber, and the heat exchanger includes a plurality of heat exchange plates stacked on one another, and each heat exchange plate has at least one through hole formed thereon, and at least one through hole of each heat exchange plate communicates with at least one through hole of another adjacent heat exchange plate to form at least one fluid channel; the heat dissipating component comprises a substrate and a plurality of fins integrally extended from the substrate, and the heat dissipating component seals the hollow slot by the substrate; the cover covers on the vapor chamber, and a liquid cavity is formed between the cover and the vapor chamber, and the heat exchanger and each of the fins are formed in the liquid cavity, and the cover has a water inlet and a water outlet formed thereon and communicated with the liquid cavity.

To achieve the aforementioned objective, this disclosure provides a heat dissipating structure of a liquid-cooling heat dissipating apparatus comprising a vapor chamber, a heat exchanger and a heat dissipating component, and the vapor chamber has a hollow slot penetrating through the vapor chamber; the heat exchanger is installed above the vapor chamber, and the heat exchanger includes a plurality of heat exchange plates stacked on one another, and each heat exchange plate has at least one through hole formed thereon, and at least one through hole of each heat exchange plate communicates with at least one through hole of another adjacent heat exchange plate to form at least one fluid channel; the heat dissipating component includes a substrate and a plurality of fins integrally extended from the substrate, and the heat dissipating component seals the hollow slot by the substrate.

This disclosure further has the following effects: Each heat exchange plate is laid out with high density to improve the heat dissipating effect. The fluid channel formed by attaching the vapor chamber to the heat exchanger and each heat exchange plate is provided for flowing liquid in both transversal and longitudinal directions to dissipate heat. The vapor chamber and the substrate are used simultaneously for transferring the heat of heat generating source and transferring the heat quickly with a low thermal resistance. Since the heat dissipating component is formed in the middle area of the vapor chamber for transferring heat from the hottest area of the heat generating source to achieve the effect of dissipating the heat of the heat generating source to the outside quickly and effectively.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 is a perspective exploded view of a heat dissipating structure in accordance with a first preferred embodiment of the present invention;

FIG. 2 is a perspective exploded view of a heat exchanger as depicted in FIG. 1;

FIG. 3 is a perspective view of a heat dissipating structure in accordance with the first preferred embodiment of the present invention;

FIG. 4 is an perspective cross-sectional view of a heat dissipating structure in accordance with the first preferred embodiment of the present invention;

FIG. 5 is a cross-sectional exploded view of a heat dissipating structure in accordance with a second preferred embodiment of the present invention;

FIG. 6 is a perspective cross-sectional view of a heat dissipating structure in accordance with the second preferred embodiment of the present invention;

FIG. 7 is a cross-sectional exploded view of a heat dissipating structure in accordance with a third preferred embodiment of the present invention;

FIG. 8 is a perspective cross-sectional view of a heat dissipating structure in accordance with the third preferred embodiment of the present invention; and

FIG. 9 is a perspective cross-sectional view of a liquid-cooling heat dissipating apparatus of this disclosure.

 DESCRIPTION OF THE PREFERRED EMBODIMENTS

The technical contents of this disclosure will become apparent with the detailed description of preferred embodiments accompanied with the illustration of related drawings as follows. It is intended that the embodiments and figures disclosed herein are to be considered illustrative rather than restrictive.

With reference to FIGS. 1 to 4 for a liquid-cooling heat dissipating apparatus and a heat dissipating structure of the apparatus in accordance with this disclosure, the heat dissipating structure 1 comprises a vapor chamber 10, a heat exchanger 20 and a heat dissipating component 30.

The vapor chamber 10 has a cavity 11 formed therein, a first capillary tissue 12 composed of woven meshes and sintered metals and filled in the cavity 11, and a support member such as a spiral spring or a pillar (not shown in the figure), and a working fluid 13 such as pure water is filled into the vapor chamber 10 and provided for a vapor-liquid phase change of the working fluid 13 to achieve a thermal conduction effect. The vapor chamber 10 of this embodiment is substantially a rectangular member, but this disclosure is not limited to the rectangular shape only, and a circular shape or any other shape may be used instead. In addition, the outer bottom side of the vapor chamber 10 has a heated surface 14, and the middle area of the vapor chamber 10 has a hollow slot 15 penetrating through the vapor chamber 10, and a stepped upper receiving section 16 is disposed at the top of the vapor chamber 10 disposed at the external periphery of the hollow slot 15.

The heat exchanger 20 includes a plurality of first heat exchange plates 21 and a plurality of second heat exchange plates 22, and each heat exchange plate 21, 22 may be made of copper, aluminum, or their alloy, and any second heat exchange plate 22 is clamped by the upper and lower first heat exchange plates 21 and stacked together, and a communicating slot 23 is formed in the middle area of each first heat exchange plate 21 and the middle area of each second heat exchange plate 22, and each first heat exchange plate 21 has a plurality of strip portions 210 arranged parallel to one another, and each strip portion 210 includes a plurality of first through hole groups 211 and a plurality of second through hole groups 214, wherein each first through hole group 211 and each second through hole group 214 are arranged apart from each other, and the first through hole group 211 includes a plurality of through holes 213 and a plurality of plate portions 212 staggered with one another, and the second through hole group 214 includes a plurality of plate portions 215 and a plurality of through holes 216 staggered with one another, and the through hole 213 and the through hole 216 of any two adjacent strip portions 210 are also staggered with each other. Similarly, the second heat exchange plate 22 also has the same structure of the aforementioned first heat exchange plate 21 and comprises a strip portion 220, a third through hole group 221, a plate portion 222, a through hole 223, a fourth through hole group 224, a plate portion 225 and a through hole 226.

The strip portion 210 of each first heat exchange plate 21 is configured to be corresponsive to the strip portion 220 of the adjacent second heat exchange plate 21, and they are coupled closely with each other. The first through hole group 211 of each first heat exchange plate 21 is configured to be corresponsive to the fourth through hole group 224 of the adjacent second heat exchange plate 22, so that the through holes 213 of the first through hole groups 211 of the first heat exchange plate 21 are configured to be corresponsive to the plate portions 225 of the fourth through hole groups 224 of the adjacent second heat exchange plate 22 respectively, and the length in the fluid flowing direction is greater than the plate portion 212, so as to communicate with the through holes 213, 226 of the adjacent first heat exchange plate 21 and second heat exchange plate 22 to form a fluid channel C. The second through hole group 214 of each first heat exchange plate 21 is configured to be corresponsive to the third through hole group 221 of the adjacent second heat exchange plate 22, so that the through hole 216 of the second through hole group 214 of the first heat exchange plate 21 is aligned precisely with the plate portion 222 of the third through hole group 221 of the adjacent second heat exchange plate 22, and the length of the fluid flowing direction is greater than the plate portion 222, so as to communicate the through holes 216, 223 of the adjacent first heat exchange plate 21 and second heat exchange plate 22 to form a fluid channel C.

The heat dissipating component 30 may be made of copper, aluminum, or their alloy, and the heat dissipating component 30 comprises a rectangular substrate 31 and a plurality of fins 32, and the substrate 31 has a bottom side 311. In this embodiment, the substrate 31 comprises a base section 312, a vertical plate section 313 bent and extended upwardly from both sides of the base section 312, and a bridging section 314 bent and extended horizontally from the vertical plate section 313, and the bottom side 311 is formed at the exterior of the base section 312. The fins 32 may be arranged with an interval apart from one another and formed on the base section 312 and the bridging section 314 by an extruding and chipping process.

The heat dissipating component 30 is installed at a position corresponsive to the hollow slot 15 of the vapor chamber 10 and the communicating slot 23 of the heat exchanger 20, wherein the base section 312 seals the bottom end of the hollow slot 15, and the bridging section 314 is attached to the respective upper receiving section 16, and the vertical plate section 313 is attached to an inner wall surface of the hollow slot 15, and a thermally conductive medium (not shown in the figure) is provided for fixing the bridging section 314 with the upper receiving section 16 and the vertical plate section 313 with the inner wall surface of the hollow slot 15, so that the bottom side 311 of the substrate 31 and the heated surface 14 of the vapor chamber 10 form a common surface structure A, and the common surface structure A is provided for attaching and contacting a heat generating source (not shown in the figure).

During use, the bottom side 311 of the substrate 31 and the heated surface 14 of vapor chamber 10 are in contact with the heat generating source simultaneously, and a portion of the heat is transferred along the base section 312 to the fin 32 directly and dissipated to the outside, and the other portion of the heat is dissipated quickly through a vapor-liquid phase change of the vapor chamber 10 and dispersed to the outside through each heat exchange plate 21, 22 of the heat exchanger 20, so as to improve the heat dissipating effect.

With reference to FIGS. 5 and 6 for a heat dissipating structure 1a in accordance with another embodiment of this disclosure, the heat dissipating structure 1a of this embodiment comprises a stepped lower receiving section 18 disposed at the bottom of the vapor chamber 10 which is disposed at the external periphery of the hollow slot 15, and the substrate 31 of the heat dissipating component 30a comprises a base section 312 and a bridging section 314 extended horizontally from both sides of the base section 312, wherein the base section 312 seals the bottom end of the hollow slot 15, and the bridging sections 314 are attached to the lower receiving sections 18 respectively, and a thermally conductive medium is fixed between the bridging section 314 and the lower receiving section 18, so that the bottom side 311 of the substrate 31 and the heated surface 14 of the of the vapor chamber 10 form a common surface structure A.

With reference to FIGS. 7 and 8 for a heat dissipating structure 1b in accordance with another embodiment of this disclosure, the base section 312 seals the bottom end of the hollow slot 15, and the fins 32 on both sides are attached to the inner wall surface of the hollow slot 15, and a thermally conductive medium is fixed between the fin 32 and the inner wall surface of the hollow slot 15, so that the bottom side 311 of the substrate 31 and the heated surface 14 of the vapor chamber 10 form a common surface structure A.

With reference to FIG. 9 for a liquid-cooling heat dissipating apparatus of this disclosure, the liquid-cooling heat dissipating apparatus comprises a heat dissipating structure 1 and a cover 5, wherein the cover 5 covers the vapor chamber 10, and the bottom edge of the cover 5 is embedded into the insert slot 17 to seal the insert slot 17, and a liquid cavity B is formed between the cover 5 and the vapor chamber 10, and the heat exchanger 20 and each fin 32 are formed in the liquid cavity B, and the cover 5 further includes a water inlet 51 and two water outlets 52 formed thereon and communicated with the liquid cavity B.

In addition, the liquid-cooling heat dissipating apparatus of this disclosure further comprises a water inlet pipe 6, two water outlet pipes 7 and a partition plate 8, wherein the water inlet pipe 6 is coupled to the water inlet 51 correspondingly, and each water outlet pipe 7 is coupled to the water outlet 52 correspondingly, and the partition plate 8 is clamped between the heat exchanger 20 and the top of each fin 32 and the top of the cover 5, and a fluid channel 81 is formed at the middle position of the partition plate 8 of the corresponsive water inlet pipe 6. After the fluid enters from the water inlet pipe 6 into the liquid cavity B, the fluid will impact each fin 32 and the base section 312 directly and carries away the primary heat generated by each fin 32 and the base section 312 and then will continue flowing through both front and rear sides of the heat exchanger 20 to carry away the secondary heat from both left and right sides, and finally flows along the channel formed by the partition plate 8 and the top of the cover 5 and out from each water outlet pipe 7, so as to complete the process of circulating the fluid in the liquid-cooling heat dissipating apparatus.

While this disclosure has been described by means of specific embodiments, numerous modifications and variations could be made thereto by those skilled in the art without departing from the scope and spirit of this disclosure set forth in the claims.

Claims

1. A liquid-cooling heat dissipating apparatus, comprising:

a heat dissipating structure, further comprising:
a vapor chamber, having a hollow slot penetrating through the vapor chamber;
a heat exchanger, installed above the vapor chamber, and including a plurality of heat exchange plates vertically stacked on one another, and each heat exchange plate having at least one through hole formed thereon, and at least one through hole formed on each heat exchange plate communicating with at least one through hole of another adjacent heat exchange plate to form at least one fluid channel; and
a heat dissipating component, comprising a substrate and a plurality of fins integrally extended from the substrate, and the heat dissipating component sealing the hollow slot by the substrate; and
a cover, covered onto the vapor chamber, and a liquid cavity being formed between the cover and the vapor chamber, and the heat exchanger and each of the fins being formed in the liquid cavity, and the cover having a water inlet and a water outlet communicating with the liquid cavity.

2. The liquid-cooling heat dissipating apparatus according to claim 1, wherein the substrate has a bottom side, and the vapor chamber has a heated surface, and the bottom side of the substrate and the heated surface of the vapor chamber form a common surface structure.

3. The liquid-cooling heat dissipating apparatus according to claim 2, wherein each heat exchange plate has a communicating slot formed in a middle area of the heat exchange plate and provided for passing and installing each respective fin.

4. The liquid-cooling heat dissipating apparatus according to claim 2, wherein the hollow slot is formed in a middle area of the vapor chamber, and an upper receiving section is disposed at the top of the vapor chamber at the external periphery of the hollow slot, and the substrate includes a base section, a vertical plate section bent and extended upwardly from both sides of the base section, and a bridging section bent and extended horizontally from the vertical plate section, and the bottom side is formed at the exterior of the base section, and the base section seals a bottom end of the hollow slot, and the bridging sections are attached to the upper receiving sections respectively.

5. The liquid-cooling heat dissipating apparatus according to claim 4, wherein each vertical plate section is attached onto an inner wall surface of the hollow slot.

6. The liquid-cooling heat dissipating apparatus according to claim 4, wherein the fins are arranged with an interval apart from each other and formed on the base section and each of the bridging sections by an extruding or chipping process.

7. The liquid-cooling heat dissipating apparatus according to claim 2, wherein the hollow slot is formed at a middle area of the vapor chamber, and the bottom of the vapor chamber disposed at the external periphery of the hollow slot has a lower receiving section, and the substrate includes a base section and a bridging section extended horizontally from both sides of the base section, and the bottom side is formed at the exterior of the base section, and the base section seals the bottom end of the hollow slot, and the bridging sections are attached to the lower receiving sections respectively.

8. The liquid-cooling heat dissipating apparatus according to claim 2, wherein the substrate includes a base section, and the bottom side is formed at the exterior of the base section, and the base section seals the bottom end of the hollow slot, and each of the fins is attached onto an inner wall surface of the hollow slot.

9. The liquid-cooling heat dissipating apparatus according to claim 2, wherein the vapor chamber has a circular insert slot formed at the top surface of the vapor chamber, and the bottom of the cover is embedded and sealed to the corresponsive insert slot.

10. The liquid-cooling heat dissipating apparatus according to claim 2, further comprising a water inlet pipe and at least one water outlet pipe, and the water inlet pipe is coupled to the water inlet correspondingly, and the water outlet pipe is coupled to the water outlet correspondingly.

11. The liquid-cooling heat dissipating apparatus according to claim 10, further comprising a partition plate clamped between the heat exchanger and the cover, and a liquid channel formed at a position of the partition plate corresponsive to the water inlet pipe.

12. A heat dissipating structure of a liquid-cooling heat dissipating apparatus, comprising:

a vapor chamber, having a hollow slot penetrating through the vapor chamber, and further having a cavity;
a heat exchanger, installed above the vapor chamber, and including a plurality of heat exchange plates stacked on one another, and each heat exchange plate having at least one through hole formed thereon, and at least one through hole formed on each heat exchange plate communicating with at least one through hole of at least one adjacent the heat exchange plate to form at least one fluid channel; and
a heat dissipating component, including a substrate and a plurality of fins integrally extended from the substrate, and the heat dissipating component sealing the hollow slot by the substrate.

13. The heat dissipating structure of a liquid-cooling heat dissipating apparatus according to claim 12, wherein the substrate has a bottom side, and the vapor chamber has a heated surface, and the bottom side of the substrate and the heated surface of the vapor chamber form a common surface structure.

14. The heat dissipating structure of a liquid-cooling heat dissipating apparatus according to claim 13, wherein the middle area of each heat exchange plate has a communicating slot for passing and installing each of the fins.

15. The heat dissipating structure of a liquid-cooling heat dissipating apparatus according to claim 13, wherein the hollow slot is formed in a middle area of the vapor chamber.

16. The heat dissipating structure of a liquid-cooling heat dissipating apparatus according to claim 15, wherein the top of the vapor chamber disposed at the external periphery of the hollow slot has an upper receiving section, and the substrate includes a base section, a vertical plate section bent and extended upwardly from both sides of the base section, and a bridging section bent and extended horizontally from the vertical plate section, and the bottom side is formed at the exterior of the base section, and the base section seals the bottom end of the hollow slot, and the bridging sections are attached to the upper receiving sections respectively.

17. The heat dissipating structure of a liquid-cooling heat dissipating apparatus according to claim 16, wherein each vertical plate section is attached to an inner wall surface of the hollow slot.

18. The heat dissipating structure of a liquid-cooling heat dissipating apparatus according to claim 16, wherein the fins are separated with an interval apart from one another and formed on the base section and each of the bridging sections by an extruding or chipping process.

19. The heat dissipating structure of a liquid-cooling heat dissipating apparatus according to claim 15, wherein the bottom of the vapor chamber disposed at the external periphery of the hollow slot has a lower receiving section, and the substrate includes a base section and a bridging section extended horizontally from both sides of the base section, and the bottom side is formed at the exterior of the base section, and the base section seals the bottom end of the hollow slot, and the bridging sections are attached to the lower receiving sections respectively.

20. The heat dissipating structure of a liquid-cooling heat dissipating apparatus according to claim 15, wherein the substrate includes a base section, and the bottom side is formed at the exterior of the base section, and the base section seals the bottom end of the hollow slot, and each of the fins is attached onto an inner wall surface of the hollow slot.

Patent History
Publication number: 20170268828
Type: Application
Filed: Jul 18, 2016
Publication Date: Sep 21, 2017
Inventor: Chun-Hung LIN (New Taipei City)
Application Number: 15/212,719
Classifications
International Classification: F28D 15/02 (20060101);