ELECTRONIC ATOMIZATION DEVICE, ATOMIZATION ASSEMBLY, ATOMIZATION ELEMENT AND MANUFACTURING METHOD THEREFOR
A vaporization element of an electronic vaporization device includes: a porous substrate; and a heating layer. The porous substrate includes a vaporization surface and the heating layer covers the vaporization surface. The heating layer includes a conductive layer and a stabilizing layer, the conductive layer covers the vaporization surface, and the stabilizing layer covers a surface of the conductive layer far from the porous substrate. A resistivity of the stabilizing layer is higher than a resistivity of the conductive layer. An oxidation resistance of the stabilizing layer is lower than an oxidation resistance of the conductive layer.
This application is a continuation of International Patent Application No. PCT/CN2021/075810, filed on Feb. 7, 2021, which claims priority to Chinese Patent Application No. 202010123152.6, filed on Feb. 27, 2020. The entire disclosure of both applications is hereby incorporated by reference herein.
FIELDThe present invention relates to the field of electronic vaporization technologies, and specifically, to an electronic vaporization device, a vaporization assembly, a vaporization element, and a manufacturing method for the vaporization element.
BACKGROUNDAs more attention is paid to the health of human bodies, people are aware of harm of tobacco to the bodies. Therefore, an electronic vaporization device is produced. The electronic vaporization device has an appearance and taste similar to the cigarette, but generally does not include tar, suspended particles, and other harmful ingredients in the cigarette, which greatly reduces harm to a user's body. Therefore, the electronic vaporization device is generally used as a substitute for the cigarette and used for smoking cessation.
The electronic vaporization device generally includes a vaporization assembly and a power supply assembly. A heating body of the vaporization assembly of the electronic vaporization device currently on the market includes a spring-shaped heating wire. In a manufacturing process of the heating body, the linear heating wire is wound around a fixed shaft; and when the heating wire is powered on, an e-liquid stored on the storage medium are adsorbed onto the fixed shaft and then are vaporized under the heating effect of the heating wire. Another heating body includes a nested combination of a ceramic and a heating wire, but the vaporization efficiency is low and e-liquid frying is prone to occur. The technology related to the heating body further includes manufacturing a thin-film heating body on a porous ceramic substrate. However, the thin-film heating body has a poor stability of the resistance value and a short service life.
SUMMARYIn an embodiment, the present invention provides a vaporization element of an electronic vaporization device, the vaporization element comprising: a porous substrate; and a heating layer, wherein the porous substrate comprises a vaporization surface and the heating layer covers the vaporization surface, wherein the heating layer comprises a conductive layer and a stabilizing layer, the conductive layer covers the vaporization surface, and the stabilizing layer covers a surface of the conductive layer far from the porous substrate, wherein a resistivity of the stabilizing layer is higher than a resistivity of the conductive layer, and wherein an oxidation resistance of the stabilizing layer is lower than an oxidation resistance of the conductive layer.
Subject matter of the present disclosure will be described in even greater detail below based on the exemplary figures. All features described and/or illustrated herein can be used alone or combined in different combinations. The features and advantages of various embodiments will become apparent by reading the following detailed description with reference to the attached drawings, which illustrate the following:
In an embodiment, the present invention provides an electronic vaporization device, a vaporization assembly, a vaporization element, and a manufacturing method for the vaporization element, to resolve the problem that a resistance value of a conductive layer increases excessively fast.
In an embodiment, the present invention provides a vaporization element of an electronic vaporization device, the vaporization element including: a porous substrate and a heating layer, where the porous substrate includes a vaporization surface, and the heating layer covers the vaporization surface. The heating layer includes a conductive layer and a stabilizing layer, the conductive layer covers the vaporization surface, and the stabilizing layer covers a surface of the conductive layer far away from the porous substrate; and a resistivity of the stabilizing layer is higher than a resistivity of the conductive layer, and oxidation resistance of the stabilizing layer is lower than oxidation resistance of the conductive layer.
A material of the stabilizing layer is one or any combination of aluminum, zinc, tin, magnesium, or titanium; and a material of the conductive layer is one or any combination of titanium, zirconium, niobium, tantalum, or 316 stainless steel.
The material of the stabilizing layer is aluminum; and the material of the conductive layer is a titanium-zirconium alloy.
A thickness of the heating layer ranges from 1.5 μm to 5 μm, where a thickness of the stabilizing layer ranges from 0.5 μm to 2 μm, and a thickness of the conductive layer ranges from 2 μm to 3 μm.
The vaporization element further includes: a first electrode and a second electrode located on the stabilizing layer far away from the porous substrate and covering a part of the stabilizing layer.
Materials of the first electrode and the second electrode are silver.
To resolve the foregoing technical problem, a second technical solution provided in the present invention is to provide a vaporization assembly of an electronic vaporization device, the vaporization assembly including: a liquid storage cavity configured to store an e-liquid and the vaporization element according to any one of the foregoing items, where the e-liquid in the liquid storage cavity is deliverable to the vaporization surface.
To resolve the foregoing technical problem, a third technical solution provided in the present invention is to provide an electronic vaporization device, including: a power supply assembly and the foregoing vaporization assembly, where the power supply assembly is electrically connected to the vaporization assembly to supply power to the vaporization element of the vaporization assembly.
To resolve the foregoing technical problem, a fourth technical solution provided in the present invention is to provide a manufacturing method for a vaporization element of an electronic vaporization device, the method including: providing a porous substrate, where the porous substrate includes a vaporization surface; arranging a conductive layer on the vaporization surface of the porous substrate; and arranging a stabilizing layer on a surface of the conductive layer far away from the porous substrate. A resistivity of the stabilizing layer is higher than a resistivity of the conductive layer, and oxidation resistance of the stabilizing layer is lower than oxidation resistance of the conductive layer.
The arranging a conductive layer on the vaporization surface of the porous substrate includes: arranging the conductive layer on the vaporization surface of the porous substrate by using a direct-current sputtering deposition process or a magnetron sputtering deposition process; and/or the step of arranging a stabilizing layer on a surface of the conductive layer far away from the porous substrate includes: forming the stabilizing layer on one side of the conductive layer far away from the porous substrate by using the direct-current sputtering deposition process or the magnetron sputtering deposition process.
The method further includes: arranging a first electrode and a second electrode covering a part of the stabilizing layer on one side of the stabilizing layer far away from the porous substrate in a screen-printing manner, and performing low-temperature sintering on the first electrode and the second electrode.
A total thickness of the stabilizing layer and the conductive layer ranges from 1.5 μm to 5 μm, where a thickness of the stabilizing layer ranges from 0.5 μm to 2 μm, and a thickness of the conductive layer ranges from 2 μm to 3 μm; and/or a material of the stabilizing layer is one or any combination of aluminum, zinc, tin, magnesium, or titanium; and a material of the conductive layer is one or any combination of titanium, zirconium, niobium, tantalum, or 316 stainless steel.
The material of the stabilizing layer is aluminum; and the material of the conductive layer is a titanium-zirconium alloy.
Beneficial effects of the present invention are as follows: Different from the related art, in the present invention, a conductive layer and a stabilizing layer are formed on a vaporization surface of a porous substrate, a resistivity of the stabilizing layer is higher than a resistivity of the conductive layer, and oxidation resistance of the stabilizing layer is lower than oxidation resistance of the conductive layer. The stabilizing layer is made of such a material, so that a resistance value of the conductive layer is relatively stable during heating, and does not dramatically increase, thereby resolving the problem that the resistance value of the conductive layer increases excessively fast, and bringing an excellent and stable taste to the user.
The following clearly and completely describes the technical solutions in the embodiments of the present invention with reference to the accompanying drawings in the embodiments of the present invention. Apparently, the described embodiments are merely some rather than all of the embodiments of the present invention. All other embodiments obtained by a person of ordinary skill in the art based on the embodiments of the present invention without creative efforts shall fall within the protection scope of the present invention.
Existing common ceramic heating wires cannot heat evenly, and e-liquid frying is prone to occur during vaporization. A heating film of a nitride type has a poor stability and a short heating service life. A heating wire of a precious metal type has high costs, and particle agglomeration is prone to occur. To reduce an increase in the resistance value, the present invention provides a novel electronic vaporization device, vaporization assembly, vaporization element, and a manufacturing method for the vaporization element, which are described below with reference to the accompanying drawings and specific embodiments.
Referring to
In this embodiment, the power supply assembly 200 is detachably connected to the vaporization assembly 100, so that any one of the assemblies can be replaced if the assembly is damaged. In other embodiments, the power supply assembly 200 and the vaporization assembly 100 may alternatively share a same housing, so that the electronic vaporization device is of an integral structure and then is more convenient to carry. A connection manner of the power supply assembly 200 and the vaporization assembly 100 is not specifically limited in the embodiments of the present invention.
As shown in
Specifically, in this embodiment, the upper cover 20 may include a guide portion 22, an engagement portion 24, and an accommodation portion 26 that are connected in sequence. The guide portion 22 is provided with a liquid inlet hole 222 and an air outlet hole 224, where the liquid inlet hole 222 is in communication with the liquid storage cavity 10, and the air outlet hole 224 is in communication with the airflow channel 30. An accommodation cavity 262 for accommodating the vaporization element 40 is formed on the accommodation portion 26, and the vaporization element 40 is accommodated in the accommodation cavity 262. The engagement portion 24 is configured to cause the guide portion 22 to be in communication with the accommodation portion 26, to deliver an e-liquid in the liquid inlet hole 222 to the vaporization element 40.
The vaporization element 40 is configured to convert the delivered an e-liquid into vapor in a heating manner. The air outlet hole 224 is in communication with the vaporization surface of the vaporization element 40, the e-liquid is heated on the vaporization surface and vaporized into vapor, and the vapor is delivered through the airflow channel 30 from the air outlet hole 224.
In this embodiment, referring to
By using a structure where the guide portion 22, the engagement portion 24, and the accommodation portion 26 are integrally formed, the quantity of elements of the vaporization assembly 100 can be reduced, so that the mounting is more convenient and faster and the related sealing performance is better.
The porous substrate 42 is made of a material of a porous structure, and to be specific, the material may be a porous ceramic, porous glass, porous plastic, a porous metal, and the like. The material of the porous substrate 42 is not specifically limited in this application. In a specific embodiment, the porous substrate 42 may be made of a material having relatively low temperature resistance, for example, the porous plastic. In another embodiment, the porous substrate 42 may be made of a conductive material having a conductive function, for example, the porous metal.
The porous ceramic has stable chemical properties, and does not chemically react with an e-liquid; the porous ceramic can withstand a high temperature and does not deform due to an excessively high heating temperature; the porous ceramic is an insulator, and is not electrically connected to the conductive layer 44 formed on the porous ceramic to cause a short circuit; and the porous ceramic is conveniently manufactured and has low costs. Therefore, in this embodiment, the porous ceramic is selected to manufacture the porous substrate 42.
In an embodiment, a porosity of the porous ceramic may range from 30% to 70%. The porosity refers to a ratio of a total volume of tiny pores in a porous medium to a total volume of the porous medium. The magnitude of the porosity may be adjusted according to ingredients of the e-liquid. For example, a relatively high porosity is selected when a viscosity of the e-liquid is relatively large, to ensure the e-liquid guide effect.
In another embodiment, the porosity of the porous ceramic may range from 50% to 60%. The porosity of the porous ceramic is controlled to range from 50% to 60%. According to an aspect, it can be ensured that the porous ceramic has higher e-liquid guide efficiency, and dry burning caused by unsmooth e-liquid circulation is avoided, thereby improving the vaporization effect. According to another aspect, the case that the e-liquid is guided too fast by the porous ceramic, making it difficult to lock the e-liquid and causing a greatly increased probability of e-liquid leakage can be avoided.
Further, in this embodiment, the conductive layer 44 and the stabilizing layer 46 are both porous films. The conductive layer 44 may be arranged on the vaporization surface 422 of the porous substrate 42 by using a direct-current sputtering deposition process or a magnetron sputtering deposition process. The stabilizing layer 46 may be formed on one side of the conductive layer 44 far away from the porous substrate 42 by using the direct-current sputtering deposition process or the magnetron sputtering deposition process.
Further, in this application, the vaporization element further includes a first electrode 47 and a second electrode 48 located on the stabilizing layer 46 far away from the porous substrate 42 and covering a part of the stabilizing layer 46.
In a specific implementation, a resistivity of the stabilizing layer 46 is higher than a resistivity of the conductive layer 44, and oxidation resistance of the stabilizing layer is lower than oxidation resistance of the conductive layer 44. Specifically, a material of the stabilizing layer 46 is one or any combination of aluminum, zinc, tin, magnesium, or titanium. A material of the conductive layer 44 is one or any combination of titanium, zirconium, niobium, tantalum, or 316 stainless steel. Materials of the first electrode 47 and the second electrode 48 are silver. Specifically, in an embodiment, the material of the stabilizing layer 46 is aluminum. The material of the conductive layer 44 is a titanium-zirconium alloy.
Titanium and zirconium are characterized as follows:
(1) Titanium and zirconium are both metals having good biocompatibility, and especially, titanium is a biophile metal element having higher safety performance.
(2) Titanium and zirconium have larger resistivities among metal materials. In a normal temperature state, the alloy has a resistivity three times an original resistivity after titanium is alloyed with zirconium according to a specific proportion, which is more suitable for being used as a heating film material.
(3) Titanium and zirconium have small thermal expansion coefficients, and the alloy has a smaller thermal expansion coefficient after titanium is alloyed with zirconium, to better thermally match the porous ceramic. After titanium is alloyed with zirconium according to a specific proportion, the alloy has a lower melting point, and the film-forming property of magnetron sputtering coating is better.
(4) After coating of a metal, it can be seen by electron microscope analysis that microscopic particles of the metal are spherical, and the particles are crowded together to form a microscopic morphology similar to cauliflower; while it can be seen by electron microscope analysis that microscopic particles of a film formed by the titanium-zirconium alloy are sheet-shaped, and some grain boundaries between particles disappear, to provide better continuity.
(5) Titanium and zirconium both have very good plasticity and elongation rates, and the titanium-zirconium alloy film has better resistance to thermal cycling and current impact.
(6) Titanium is usually used as a stress buffer layer of metals and ceramics and an activation element of ceramic metallization, and titanium reacts with a ceramic boundary to form a relatively strong chemical bond, which may improve the adhesion of the film.
Further, since the titanium-zirconium in a titanium-zirconium alloy film has poor stability in the air at high temperature, zirconium easily absorbs hydrogen gas, nitrogen gas, and oxygen gas, and the alloy has better gas absorption performance after zirconium is alloyed with titanium, the stabilizing layer 46 further needs to cover the conductive layer 44 after the conductive layer 44 is manufactured, where the material of the stabilizing layer 46 is aluminum.
In an embodiment, after the stabilizing layer 46 (which is an aluminum layer) is manufactured, the first electrode 47 and the second electrode 48 are manufactured in a screen-printing manner, and then low-temperature sintering is performed on the first electrode 47 and the second electrode 48. The first electrode 47 and the second electrode 48 cover a part of the stabilizing layer 46. When the first electrode 47 and the second electrode 48 are formed in a low-temperature sintering manner, a relatively dense aluminum oxide layer is formed on a surface of the stabilizing layer 46, so that the conductive layer 44 can be isolated from air, thereby preventing a resistance value of the conductive layer 44 from being increased, to resolve the problem of taste change and stability due to an increase in a resistance value of the heating layer. According to another aspect, when the first electrode 47 and the second electrode 48 are manufactured in the low-temperature sintering manner, as the first electrode 47 and the second electrode 48 are sintered, the stabilizing layer 46 prevents a region of the stabilizing layer 46 covered by the first electrode 47 and the second electrode 48 from being oxidized, thereby avoiding the formation of a contact resistance.
Since a melting point of aluminum is 660° C. and a melting point of aluminum oxide is 2054° C., the stabilizing layer 46 can maintain its own stability and agglomeration is not prone to occur during vaporization. Compared with the case that agglomeration is prone to occur in a precious-metal passivation layer such as Au/Ag during vaporization, causing failure of a heating body, selecting aluminum as the material of the stabilizing layer 46 can resolve such problems. According to another aspect, aluminum oxide has same main ingredients as the ceramic, has a low thermal expansion coefficient, and has smaller deformation during current impact.
The stabilizing layer 46 is made of aluminum whose overall resistivity is larger than that of a precious metal. A resistivity of the precious metal ranges from 0.8 ohms to 1.2 ohms, and the resistivity of aluminum has a minimum value of about 1 ohm through parameter adjustment and substantially ranges from 1.5 ohms to 3 ohms. In addition, resistivities of the conductive layer 44 and the stabilizing layer 46 are relatively close by using the foregoing process, which can prevent a current of one of the layers from being excessively large. Theoretically, a thermal expansion coefficient of the precious metal gold is 14.2, but a thermal expansion coefficient of aluminum oxide formed after aluminum is sintered is about half that of gold, that is, 7.1. Therefore, a deformation rate of the conductive layer is lower during inhaling, and then the stability is improved.
In a specific embodiment, a thickness of the heating layer ranges from 1.5 μm to 5 μm, where the heating layer includes the conductive layer 44 and the stabilizing layer 46. Specifically, a thickness of the conductive layer 44 ranges from 2 μm to 3 μm, and a thickness of the stabilizing layer 46 ranges from 0.5 μm to 2 μm.
Based on the above, in the embodiments of the present invention, the material of the conductive layer 44 is set to one or any combination of titanium, zirconium, niobium, tantalum, or 316 stainless steel, and the material of the stabilizing layer 46 is set to one or any combination of aluminum, zinc, tin, magnesium, or titanium. In addition, the first electrode 47 and the second electrode 48 are manufactured in the low-temperature sintering manner, to prolong the service life of the heating body, reduce the increase in the resistance value, and eliminate the contact resistance.
Step S51: Provide a porous substrate, where the porous substrate includes a vaporization surface.
The porous substrate is made of a material of a porous structure, and to be specific, the material may be a porous ceramic, porous glass, porous plastic, a porous metal, and the like. The material of the porous substrate is not specifically limited in this application. In a specific embodiment, the porous substrate may be made of a material having relatively low temperature resistance, for example, the porous plastic. In another embodiment, the porous substrate may be made of a conductive material having a conductive function, for example, the porous metal. The porous substrate includes the vaporization surface.
Step S52: Arrange a conductive layer on the vaporization surface of the porous substrate.
The conductive layer is formed on the vaporization surface of the porous substrate by using a magnetron sputtering deposition process or a direct-current sputtering deposition process. Specifically, a material of the conductive layer is one or any combination of titanium, zirconium, niobium, tantalum, or 316 stainless steel. Using an example in which the conductive layer is arranged by using the direct-current sputtering deposition process, a specific process is as follows: A vacuum degree is kept in a range of 8×10−4 Pa to 2×10−3 Pa; a power is kept in a range of 1500 W to 2500 W, and a time is kept in a range of 70 min to 110 min; and a pressure is kept in a range of 0.3 Pa to 0.8 Pa, a temperature is kept in a range of a room temperature to 300° C., and a particle diameter is kept approximately in a range of 200 nm to 400 nm.
Step S53: Arrange a stabilizing layer on a surface of the conductive layer far away from the porous substrate.
The stabilizing layer is arranged on the surface of the conductive layer far away from the porous substrate by using the magnetron sputtering deposition process or the direct-current sputtering deposition process. Specifically, a material of the stabilizing layer is one or any combination of aluminum, zinc, tin, magnesium, or titanium. Using an example in which the stabilizing layer is arranged by using the direct-current sputtering deposition process, a specific process is as follows: A time ranges from 40 min to 60 min, a power ranges from 500 W to 1500 W, a pressure ranges from 1 Pa to 1.5 Pa, and a temperature ranges from a room temperature to 300° C. A particle diameter ranges approximately from 100 nm to 200 nm.
In this embodiment, the conductive layer and the stabilizing layer are sequentially formed on the vaporization surface. An e-liquid in the liquid storage cavity is delivered to the porous substrate through the upper cover and is further delivered onto the vaporization surface by the porous substrate. Therefore, the e-liquid on the vaporization surface may be heated when the conductive layer and/or the stabilizing layer 46 is powered on to generate heat, thereby vaporizing the e-liquid into vapor.
In an embodiment, a total thickness of the conductive layer and the stabilizing layer is 1.5 where a thickness of the conductive layer ranges from 2 μm to 3 μm, and a thickness of the stabilizing layer ranges from 0.5 μm to 2 μm.
In an embodiment, a resistivity of the stabilizing layer is higher than a resistivity of the conductive layer, and oxidation resistance of the stabilizing layer is lower than oxidation resistance of the conductive layer. Specifically, the material of the stabilizing layer is aluminum, and the material of the conductive layer is a titanium-zirconium alloy.
In the present invention, the material of the conductive layer is set to one or any combination of titanium, zirconium, niobium, tantalum, or 316 stainless steel, and the material of the stabilizing layer is set to one or any combination of aluminum, zinc, tin, magnesium, or titanium. Therefore, the stabilizing layer can form a dense aluminum oxide layer on the conductive layer, and the conductive layer can be isolated from air, thereby reducing the increase in the resistance value of the conductive layer, to resolve the problem of poor and unstable taste due to the increase in the resistance value of the conductive layer.
Specifically, materials of the first electrode and the second electrode are silver. The first electrode and the second electrode covering a part of the stabilizing layer are arranged on one side of the stabilizing layer far away from the porous substrate in the screen-printing manner. The first electrode and the second electrode cover a part of the stabilizing layer. Then low-temperature sintering is performed on the first electrode and the second electrode. During low-temperature sintering, a relatively dense aluminum oxide layer is formed on a surface of the stabilizing layer, so that the conductive layer can be isolated from air, thereby preventing a resistance value of the conductive layer from being increased, to resolve the problem of taste change and stability due to an increase in a resistance value of the heating layer. According to another aspect, when the first electrode and the second electrode are manufactured in the low-temperature sintering manner, as the first electrode and the second electrode are sintered, the stabilizing layer prevents a region of the stabilizing layer covered by the first electrode and the second electrode from being oxidized, thereby avoiding the formation of a contact resistance.
The foregoing descriptions are merely embodiments of the present invention, and the protection scope of the present invention is not limited thereto. All equivalent structure or process changes made according to the content of this specification and accompanying drawings in the present invention or by directly or indirectly applying the present invention in other related technical fields shall fall within the protection scope of the present invention.
While the invention has been illustrated and described in detail in the drawings and foregoing description, such illustration and description are to be considered illustrative or exemplary and not restrictive. It will be understood that changes and modifications may be made by those of ordinary skill within the scope of the following claims. In particular, the present invention covers further embodiments with any combination of features from different embodiments described above and below. Additionally, statements made herein characterizing the invention refer to an embodiment of the invention and not necessarily all embodiments.
The terms used in the claims should be construed to have the broadest reasonable interpretation consistent with the foregoing description. For example, the use of the article “a” or “the” in introducing an element should not be interpreted as being exclusive of a plurality of elements. Likewise, the recitation of “or” should be interpreted as being inclusive, such that the recitation of “A or B” is not exclusive of “A and B,” unless it is clear from the context or the foregoing description that only one of A and B is intended. Further, the recitation of “at least one of A, B and C” should be interpreted as one or more of a group of elements consisting of A, B and C, and should not be interpreted as requiring at least one of each of the listed elements A, B and C, regardless of whether A, B and C are related as categories or otherwise. Moreover, the recitation of “A, B and/or C” or “at least one of A, B or C” should be interpreted as including any singular entity from the listed elements, e.g., A, any subset from the listed elements, e.g., A and B, or the entire list of elements A, B and C.
Claims
1. A vaporization element of an electronic vaporization device, the vaporization element comprising:
- a porous substrate; and
- a heating layer,
- wherein the porous substrate comprises a vaporization surface and the heating layer covers the vaporization surface,
- wherein the heating layer comprises a conductive layer and a stabilizing layer, the conductive layer covers the vaporization surface, and the stabilizing layer covers a surface of the conductive layer far from the porous substrate,
- wherein a resistivity of the stabilizing layer is higher than a resistivity of the conductive layer, and
- wherein an oxidation resistance of the stabilizing layer is lower than an oxidation resistance of the conductive layer.
2. The vaporization element of claim 1, wherein a material of the stabilizing layer comprises at least one of aluminum, zinc, tin, magnesium, or titanium, and
- wherein a material of the conductive layer comprises at least one of titanium, zirconium, niobium, tantalum, or 316 stainless steel.
3. The vaporization element of claim 2, wherein the material of the stabilizing layer comprises aluminum, and
- wherein the material of the conductive layer comprises a titanium-zirconium alloy.
4. The vaporization element of claim 1, wherein a thickness of the heating layer ranges from 1.5 μm to 5 μm,
- wherein a thickness of the stabilizing layer ranges from 0.5 μm to 2 μm, and
- wherein a thickness of the conductive layer ranges from 2 μm to 3 μm.
5. The vaporization element of claim 1, further comprising:
- a first electrode and a second electrode located on the stabilizing layer far from the porous substrate and covering a part of the stabilizing layer.
6. The vaporization element of claim 5, wherein materials of the first electrode and the second electrode comprise silver.
7. A vaporization assembly of an electronic vaporization device, the vaporization assembly comprising:
- a liquid storage cavity configured to store an e-liquid; and
- the vaporization element of claim 1,
- wherein the e-liquid in the liquid storage cavity is deliverable to the vaporization surface.
8. An electronic vaporization device, comprising:
- a power supply assembly; and
- the vaporization assembly of claim 7,
- wherein the power supply assembly is electrically connected to the vaporization assembly to supply power to the vaporization element of the vaporization assembly.
9. A manufacturing method for a vaporization element of an electronic vaporization device, the method comprising:
- providing a porous substrate, the porous substrate comprising a vaporization surface;
- arranging a conductive layer on the vaporization surface of the porous substrate; and
- arranging a stabilizing layer on a surface of the conductive layer far from the porous substrate,
- wherein a resistivity of the stabilizing layer is higher than a resistivity of the conductive layer, and
- wherein an oxidation resistance of the stabilizing layer is lower than an oxidation resistance of the conductive layer.
10. The manufacturing method of claim 9, wherein arranging the conductive layer on the vaporization surface of the porous substrate comprises arranging the conductive layer on the vaporization surface of the porous substrate using a direct-current sputtering deposition process or a magnetron sputtering deposition process, and/or
- wherein arranging the stabilizing layer on the surface of the conductive layer far from the porous substrate comprises forming the stabilizing layer on one side of the conductive layer far from the porous substrate using the direct-current sputtering deposition process or the magnetron sputtering deposition process.
11. The manufacturing method of claim 9, further comprising:
- arranging a first electrode and a second electrode covering a part of the stabilizing layer on one side of the stabilizing layer far from the porous substrate in a screen-printing manner; and
- performing low-temperature sintering on the first electrode and the second electrode.
12. The manufacturing method of claim 9, wherein a total thickness of the stabilizing layer and the conductive layer ranges from 1.5 μm to 5 μm, a thickness of the stabilizing layer ranges from 0.5 μm to 2 μm, and a thickness of the conductive layer ranges from 2 μm to 3 μm, and/or
- wherein a material of the stabilizing layer comprises aluminum, zinc, tin, magnesium, or titanium, and
- wherein a material of the conductive layer comprises titanium, zirconium, niobium, tantalum, or 316 stainless steel.
13. The manufacturing method of claim 12, wherein the material of the stabilizing layer comprises aluminum, and
- wherein the material of the conductive layer comprises a titanium-zirconium alloy.
Type: Application
Filed: Aug 25, 2022
Publication Date: Dec 29, 2022
Inventors: Hongxia LV (Shenzhen), Zhenlong JIANG (Shenzhen), Pei LI (Shenzhen)
Application Number: 17/822,218
