METHODS OF MANUFACTURING STACKED SEMICONDUCTOR DIE ASSEMBLIES WITH HIGH EFFICIENCY THERMAL PATHS
Method for packaging a semiconductor die assemblies. In one embodiment, a method is directed to packaging a semiconductor die assembly having a first die and a plurality of second dies arranged in a stack over the first die, wherein the first die has a peripheral region extending laterally outward from the stack of second dies. The method can comprise coupling a thermal transfer structure to the peripheral region of the first die and flowing an underfill material between the second dies. The underfill material is flowed after coupling the thermal transfer structure to the peripheral region of the first die such that the thermal transfer structure limits lateral flow of the underfill material.
This application is a divisional of U.S. patent application Ser. No. 17/335,994, filed Jun. 1, 2021, which is a divisional of U.S. patent application Ser. No. 16/020,567, filed Jun. 27, 2018, which is a continuation of U.S. application Ser. No. 15/498,321, filed Apr. 26, 2017, now U.S. Pat. No. 10,163,755, which is a divisional of U.S. patent application Ser. No. 14/330,805, filed Jul. 14, 2014, now U.S. Pat. No. 9,691,746, each of which is incorporated herein by reference in its entirety.
TECHNICAL FIELDThe disclosed embodiments relate to semiconductor die assemblies. In particular, the present technology relates to stacked semiconductor die assemblies with highly efficient thermal paths and associated systems and methods.
BACKGROUNDPackaged semiconductor dies, including memory chips, microprocessor chips, and imager chips, typically include a semiconductor die mounted on a substrate and encased in a plastic protective covering. The die includes functional features, such as memory cells, processor circuits, and imager devices, as well as bond pads electrically connected to the functional features. The bond pads can be electrically connected to terminals outside the protective covering to allow the die to be connected to higher level circuitry.
Market pressures continually drive semiconductor manufacturers to reduce the size of die packages to fit within the space constraints of electronic devices, while also pressuring them to increase the functional capacity of each package to meet operating parameters. One approach for increasing the processing power of a semiconductor package without substantially increasing the surface area covered by the package (i.e., the package's “footprint”) is to vertically stack multiple semiconductor dies on top of one another in a single package. The dies in such vertically-stacked packages can be interconnected by electrically coupling the bond pads of the individual dies with the bond pads of adjacent dies using through-silicon vias (TSVs).
A challenge associated with vertically-stacked die packages is that the heat from the individual dies is additive and it is difficult to dissipate the aggregated heat generated by the stacked die. This increases the operating temperatures of the individual dies, the junctions between the dies, and the package as a whole, which can cause the stacked dies to reach temperatures above their maximum operating temperatures (Tmax). The problem is also exacerbated as the density of the dies in the package increases. Moreover, when devices have different types of dies in the die stack, the maximum operating temperature of the device is limited to the die with the lowest maximum operating temperature.
Specific details of several embodiments of stacked semiconductor die assemblies with highly efficient thermal paths and associated systems and methods are described below. The term “semiconductor die” generally refers to a die having integrated circuits or components, data storage elements, processing components, and/or other features manufactured on semiconductor substrates. For example, semiconductor dies can include integrated circuit memory and/or logic circuitry. Semiconductor dies and/or other features in semiconductor die packages can be said to be in “thermal contact” with one another if the two structures can exchange energy through heat via, for example, conduction, convection and/or radiation. A person skilled in the relevant art will also understand that the technology may have additional embodiments, and that the technology may be practiced without several of the details of the embodiments described below with reference to
As used herein, the terms “vertical,” “lateral,” “upper” and “lower” can refer to relative directions or positions of features in the semiconductor die assemblies in view of the orientation shown in the Figures. For example, “upper” or “uppermost” can refer to a feature positioned closer to the top of a page than another feature. These terms, however, should be construed broadly to include semiconductor devices having other orientations, such as inverted or inclined orientations where top/bottom, over/under, above/below, up/down and left/right can be interchanged depending on the orientation.
The assembly 100 further includes an underfill material 160 between each of the second dies 120 and between the first die 110 and the bottom second die 120. The underfill material 160 can form a fillet 162 that extends outwardly from the stack 122 of second dies 120 in a region proximate the first die 110. The assembly 100 is expected to provide enhanced thermal dissipation of heat from the first die 110 and the stack 122 of second dies 120. For example, the TTS 130 can be made from a material with a high thermal conductivity to efficiently transfer heat along a first path directly from a large portion of the peripheral region 112 of the first die 110 and along a second path through the second dies 120. The first portion 131 of the TTS 130 is attached to a large percentage of the available area of the peripheral region 112 of the first die 110 because the first portion 131 provides a dam that prevents the fillet 162 of underfill material 160 from covering a significant percentage of the peripheral region 112. This enhances the efficiency of the first heat path because, compared to devices where the underfill material is deposited before the first portion 131 is attached to the peripheral region 112 of the first die 110, more surface area of the peripheral region 112 can be covered by the first portion 131 of the TTS 130.
Several embodiments of the assembly 100 shown in
As shown in
The first and second dies 110, 120 can include various types of semiconductor components and functional features, such as dynamic random-access memory (DRAM), static random-access memory (SRAM), flash memory, other forms of integrated circuit memory, processing circuits, imaging components, and/or other semiconductor features. In various embodiments, for example, the assembly 100 can be configured as an HMC in which the stacked second dies 120 are DRAM dies or other memory dies that provide data storage and the first die 110 is a high-speed logic die that provides memory control (e.g., DRAM control) within the HMC. In other embodiments, the first and second dies 110 and 120 may include other semiconductor components and/or the semiconductor components of the individual second dies 120 in the stack 122 may differ.
The first and second dies 110, 120 can be rectangular, circular, and/or other suitable shapes and may have various different dimensions. For example, the individual second dies 120 can each have a length L1 of about 10-11 mm (e.g., 10.7 mm) and a width of about 8-9 mm (e.g., 8.6 mm, 8.7 mm). The first die 110 can have a length L2 of about 12-13 mm (e.g., 12.67 mm) and a width of about 8-9 mm (e.g., 8.5 mm, 8.6 mm, etc.). In other embodiments, the first and second dies 110 and 120 can have other suitable dimensions and/or the individual second dies 120 may have different dimensions from one another.
The peripheral region 112 (known to those skilled in the art as a “porch” or “shelf”) of the first die 110 can be defined by the relative dimensions of the first and second dies 110 and 120 and the position of the stack 122 on a forward-facing surface 114 of the first die 110. In the embodiment illustrated in
As shown in
As further shown in
In various embodiments, the assembly 100 may also include a plurality of thermally conductive elements 128 (shown in broken lines) positioned interstitially between the electrically conductive elements 124. The individual thermally conductive elements 128 can be at least generally similar in structure and composition as that of the electrically conductive elements 124 (e.g., copper pillars). However, the thermally conductive elements 128 are not electrically coupled to the TSVs 126 or other electrically active components of the dies 110 and 120, and therefore do not provide electrical connections between the second dies 120. Instead, the thermally conductive elements 128 are electrically isolated “dumb elements” that increase the overall thermal conductivity through the stack 122 to enhance the heat transfer along a first thermal path. For example, in embodiments where the assembly 100 is configured as a HMC, the addition of the thermally conductive elements 128 between the electrically conductive elements 124 has been shown to decrease the operating temperature of the HMC by several degrees (e.g., about 6-7° C.).
The underfill material 160 is injected (I) into the cavity 538 via the inlet 540a such that the underfill material 160 fills the interstitial spaces between the second dies 120 and between the first die and the bottom second die 120. In one embodiment, the underfill material 160 can be injected into the cavity 538 until the underfill material 160 flows out of the outlet 540b (0). The inlet 540a and outlet 540b can be sealed by filling these passageways with the underfill material 160, or in other embodiments the exterior openings of the inlet 540a and outlet 540b can be capped with another material to seal the cavity 538 within the TTS 530. As a result, the TTS 530 provides a dam member that effectively contains the underfill material 160 while also providing coverage of a large surface area of the peripheral region 112 of the first die 110 by the shoulder 537 of the sidewall 534. Moreover, the underfill material 160 also contacts the sides of the second die 120 to also enhance the heat transfer laterally away from the second dies 120.
The assembly 600 further includes a thermally conductive dielectric liquid 670 in the cavity 638. The dielectric liquid 670 can be injected into the cavity 638 (I) via the inlet 640a. The outlet 640b can accordingly provide a vent through which air or other matter can escape (0) from the cavity 638 as the dielectric liquid 670 is injected. The dielectric liquid 670 can be injected as a liquid and remain in the liquid state within the cavity 638, or it can be injected as a liquid and partially cured to a gel-like substance or fully cured to a solid. Suitable thermally conductive dielectric liquids 670 include, for example, paraffin fluid and Dowtherm™ manufactured by the Dow Chemical Company. Suitable Dowtherm™ heat transfer fluids include Dowtherm A™, Dowtherm G™, Dowtherm Q™ and Dowtherm T™, all of which are manufactured by the Dow Chemical Company. The dielectric liquid 670 should have a boiling point greater than the maximum operating temperature of the assembly 600 to avoid generating a gas in the cavity. In some embodiments, the dielectric liquid 670 can be selected to cure to a solid or semi-solid material at ambient temperatures, but undergo a phase change to a liquid state at or near maximum operating temperatures to potentially enhance the heat transfer and provide a steady state operating temperature when maximum operating temperatures are reached.
The dielectric liquid 670 can fill the interstitial spaces between the second dies 120 and between the first die 110 and the bottom second die 120 such that a separate underfill material is not necessarily required. In other embodiments, an underfill material may be deposited between the second dies 120 and between the first die 110 and the bottom second die 120 before filling the cavity 638 with the dielectric liquid 670. The underfill material is generally desirable when the dielectric liquid 670 remains in the liquid state to provide structural support for the dies 110, 120. However, the underfill material can be eliminated when the dielectric liquid 670 cures to a sufficiently solid state.
In operation, the dielectric liquid 670 contacts not only the peripheral region 112 of the first die 110, but also the second dies 120 to efficiently transfer heat to the TTS 630. This provides significantly more surface contact between a material with high thermal conductivity and the dies 110 and 120 compared to devices that use an underfill material and/or have voids between the casing and the dies 110 and 120. In some embodiments, the cavity 638 is completely filled to prevent voids within the TTS 630, and the inlet 640a and outlet 640b are capped to seal the cavity 638. The embodiment of the assembly 600 is expected to provide highly efficient heat transfer from the first and second dies 110 and 120.
Any one of the stacked semiconductor die assemblies described above with reference to
From the foregoing, it will be appreciated that specific embodiments of the technology have been described herein for purposes of illustration, but that various modifications may be made without deviating from the disclosure. For example, although many of the embodiments of the semiconductor dies assemblies are described with respect to HMCs, in other embodiments the semiconductor die assemblies can be configured as other memory devices or other types of stacked die assemblies. In addition, the semiconductor die assemblies illustrated in
Claims
1. A method of packaging a semiconductor die assembly having a first semiconductor die coupled to a package substrate and a plurality of second semiconductor dies arranged in a stack on the first semiconductor die, wherein the first semiconductor die has a peripheral region extending laterally outward from the stack of second semiconductor dies, the method comprising:
- attaching a sidewall of a thermal transfer structure to the peripheral region of the first semiconductor die, wherein the sidewall extends to a height equal to or greater than an elevation of an uppermost one of the second semiconductor dies in the stack, and wherein the sidewall extends around a perimeter of the stack of the second semiconductor dies;
- depositing an underfill material around the second semiconductor dies; and
- attaching a top of the thermal transfer structure to the sidewall of the thermal transfer structure, wherein the sidewall and the top of the thermal transfer structure together define a cavity that encloses the stack of the second semiconductor dies.
2. The method of claim 1 wherein the method further comprises attaching the sidewall of the thermal transfer structure to the package substrate.
3. The method of claim 1 wherein depositing the underfill material comprises depositing the underfill material into contact with an interior surface of the sidewall.
4. The method of claim 1 wherein depositing the underfill material comprises depositing the underfill material such that the underfill material has a fillet positioned between the sidewall and the stack of the second semiconductor dies.
5. The method of claim 1 wherein attaching the sidewall of the thermal transfer structure to the peripheral region of the first semiconductor die comprises attaching the sidewall such that sidewall is spaced apart from the stack of the second semiconductor dies by a gap.
6. The method of claim 5 wherein depositing the underfill material comprises depositing the underfill material into the gap.
7. The method of claim 1 wherein attaching the top of the thermal transfer structure to the sidewall of the thermal transfer structure comprises attaching the top to the sidewall via a thermal interface material.
8. The method of claim 1 wherein attaching the top of the thermal transfer structure to the sidewall of the thermal transfer structure further comprises attaching the top to the uppermost one of the second semiconductor dies via a thermal interface material.
9. The method of claim 1 wherein the top of the thermal transfer structure has a generally constant thickness in a direction orthogonal to the package substrate.
10. A method of packaging a semiconductor die assembly having a first semiconductor die coupled to a package substrate and a plurality of second semiconductor dies arranged in a stack on the first semiconductor die, wherein the first semiconductor die has a peripheral region extending laterally outward from the stack of second semiconductor dies, the method comprising:
- attaching a foundation of a first portion of a thermal transfer structure to the package substrate and a shoulder of the first portion of the thermal transfer structure to the peripheral region of the first semiconductor die such that (a) the first portion surrounds a perimeter of the first semiconductor die and (b) an upper surface of the first portion is positioned at a height equal to or greater than an elevation of an uppermost one of the second semiconductor dies in the stack;
- depositing an underfill material around the second semiconductor dies; and
- attaching a second portion of the thermal transfer structure to the upper surface of the first portion of the thermal transfer structure to enclose the second semiconductor dies in a cavity defined by the first portion and the second portion of the thermal transfer structure.
11. The method of claim 10 wherein depositing the underfill material around the second semiconductor dies comprises depositing the underfill material through an opening defined in the upper surface of the first portion of the thermal transfer structure.
12. The method of claim 10 wherein the second portion of the thermal transfer structure has a generally constant thickness in a direction orthogonal to the package substrate.
13. The method of claim 10 wherein attaching the foundation of the first portion of the thermal transfer structure to the package substrate and the shoulder of the first portion of the thermal transfer structure to the peripheral region of the first semiconductor die comprises attaching the shoulder such that an inner surface of the first portion faces and surrounds the stack of the second semiconductor dies, and wherein depositing the underfill material comprises depositing the underfill material such that the underfill material contacts at least a portion of the inner surface of the first portion.
14. The method of claim 13 wherein the inner surface extends generally orthogonal to the first semiconductor die.
15. The method of claim 10 wherein depositing the underfill material comprises depositing the underfill material such that the underfill material has a fillet positioned between the first portion of the thermal transfer structure and the stack of the second semiconductor dies.
16. The method of claim 10 wherein the method further comprises attaching the second portion of the thermal transfer structure to the uppermost one of the second semiconductor dies in the stack.
17. The method of claim 10 wherein the upper surface of the first portion is positioned at a height equal to the elevation of the uppermost one of the second semiconductor dies in the stack.
18. The method of claim 10 wherein the first portion and the second portion of the thermal transfer structure are formed from a metal.
19. A method of packaging a semiconductor die assembly having a first semiconductor die coupled to a package substrate and a plurality of second semiconductor dies arranged in a stack on the first semiconductor die, wherein the first semiconductor die has a peripheral region extending laterally outward from the stack of second semiconductor dies, the method comprising:
- attaching a base of a thermal structure to the package substrate and the peripheral region of the first semiconductor die such that (a) the base surrounds a perimeter of the first semiconductor die and (b) an upper surface of the base is positioned at a height equal to or greater than an elevation of an uppermost one of the second semiconductor dies in the stack;
- depositing an underfill material, through an opening defined in the upper surface of the base, around the second semiconductor dies; and
- attaching a cover of the thermal transfer structure to the upper surface of the base of the thermal transfer structure to enclose the second semiconductor dies in a cavity defined by the base and the cover of the thermal transfer structure.
20. The method of claim 19 wherein attaching the base of the thermal transfer structure to the package substrate and the peripheral region of the first semiconductor die comprises attaching the base such that an inner surface of the base faces and surrounds the stack of the second semiconductor dies, and wherein depositing the underfill material comprises depositing the underfill material such that the underfill material has a fillet (a) positioned between the stack of the second semiconductor dies and the inner surface and (b) that contacts at least a portion of the inner surface.
Type: Application
Filed: Aug 23, 2023
Publication Date: Dec 7, 2023
Inventors: Sameer S. Vadhavkar (Boise, ID), Xiao Li (Boise, ID), Steven K. Groothuis (Boise, ID), Jian Li (Boise, ID), Jaspreet S. Gandhi (Boise, ID), James M. Derderian (Boise, ID), David R. Hembree (Boise, ID)
Application Number: 18/454,703