Depositing Station And Device For Generating Contact Metallizations

Abstract

The invention relates to a depositing station comprising a basin arrangement (11) having a basin (13) forming a processing chamber (12) and serving to receive a solution of a metal, in particular nickel, zinc, palladium, gold or the like, dissolved in a liquid, for a, preferably electroless, deposition on an object receivable in the processing chamber, in particular on a terminal face of a wafer receivable in the processing chamber, the basin having at least one inlet (17) for introducing the solution into the basin, the basin having a perforation (18) which forms at least part of the inlet of the basin and which is configured to homogeneously introduce the solution into the processing chamber. Furthermore, the invention relates to a device for producing contact metallizations on terminal faces of wafers, comprising at least one depositing station.

Description

The invention relates to a depositing station comprising a basin arrangement having a basin forming a processing chamber and serving to receive a solution of a metal, in particular nickel, zinc, palladium, gold or the like, dissolved in a liquid, for a, preferably electroless, deposition on an object receivable in the processing chamber, in particular on a terminal face of a wafer receivable in the processing chamber, the basin having at least one inlet for introducing the solution into the basin. Furthermore, the invention relates to a device for producing contact metallizations on terminal faces of wafers, comprising at least one depositing station of this kind.

Producing contact metallizations on the terminal face of chips, which is also referred to as under bump metallizations (UBM) in specialized terminology, is generally carried out on the wafer plane, i.e., the entire wafer having the plurality of chips formed thereon undergoes a chemical process before the chips are singulated from the wafer, a process in which the intermediate metallization (referred to as under bump metallization) is applied on the terminal faces of the chips, which have a surface metallization made of aluminum or copper in their initial state, said intermediate metallization serving as an adhesive primer for subsequently applied solder bumps made of a solder material. Only after the solder bumps have been applied, the chips are eventually singulated from the wafer.

A device for producing contact metallizations of this kind, which is known from CN 203760439 U, for example, typically comprises a depositing station having a basin forming a processing chamber and serving to receive, for example, a nickel solution, which typically comprises nickel dissolved in nitric acid. With a wafer received in the process chamber, nickel can then be separated as a contact metal from the nickel solution on a terminal face of the wafer. Furthermore, the depositing station typically has a circulating pump which circulates the nickel solution and supplies the processing chamber with the nickel solution. The solution is introduced into the basin or into the processing chamber via an inlet of the basin, which is a simple opening or a simple hole in practice, which can be formed in a bottom wall of the basin, for example.

A particular disadvantage of a depositing station of this kind is that the solution cannot be introduced homogenously into the processing chamber through an inlet of this kind, such that a homogenous flow of the solution cannot be formed in the processing chamber, whereby the metal cannot be separated evenly on the terminal face of the wafers. The aforementioned disadvantage significantly impairs the quality of the contact metallizations which have been generated by means of the depositing station or the device comprising the depositing station for producing contact metallizations.

The object of the present invention is therefore to propose a depositing station and a device for producing contact metallizations which allows producing contact metallizations of a higher quality.

This object is attained by a depositing station having the features of claim 1 and a device for producing contact metallizations having the features of claim 26.

The depositing station according to the invention comprises a basin arrangement having a basin forming a processing chamber and serving to receive a solution of a metal, in particular nickel, zinc, palladium, gold or the like, dissolved in a liquid, for a, preferably electroless, deposition on an object receivable in the processing chamber, in particular on a terminal face of a wafer receivable in the processing chamber, the basin having at least one inlet for introducing the solution into the basin, the basin having a perforation which forms at least part of the inlet of the basin and which is configured to homogenously introduce the solution into the processing chamber.

According to the invention, the depositing station comprises a basin arrangement having a basin forming a processing chamber and serving to receive a solution of a metal dissolved in a liquid for a deposition on an object receivable in the processing chamber, in particular on a terminal face of a wafer receivable in the processing chamber. In particular, the metal can be nickel. Consequently, the solution can be a nickel solution, which can comprise nickel dissolved in nitric acid, for example. With a wafer received in the process chamber, nickel can then be separated as a contact metal from the nickel solution on a terminal face of the wafer. However, in general, any other suitable metal can be used. For example, the metal can also be zinc, palladium or gold. Advantageously, the deposition can be carried out electroless. However, it is also conceivable that the deposition is carried out galvanically. In principle, any object suitable for undergoing a deposition process can be considered as an object, whereby a material of the object can include metallic materials, plastics and/or ceramic materials. If necessary, a pretreatment can be applied to the object or the material in order to subsequently enable the deposition. The deposition can be carried out on a surface of the object. Advantageously, the object is a wafer, the deposition being carried out on a terminal face of the wafer. Hereinafter, the depositing station is generally described in connection with a wafer. This is not intended to be limiting. Hereinafter, the term “wafer” can also be understood to mean the object in general. The basin can have an opening through which the wafer is inserted, preferably from above, into the processing chamber for performing a deposition process and, subsequently, can be removed from the processing chamber. Furthermore, the basin can have a rectangular surface area or cross-sectional area. Furthermore, the basin can have one bottom wall and four side walls. The bottom wall and the side walls can limit the processing chamber, which can extend from the bottom wall to the opening.

According to the invention, the basin has at least one inlet for introducing the solution into the basin or the processing chamber, the basin having a perforation which forms at least part of the inlet of the basin and which is configured to homogenously introduce the solution into the processing chamber or into the basin. Thus, it is intended that the solution is not introduced via a simple opening or a simple hole, as it is in the state of the art, but rather that it is introduced into the processing chamber through a perforation, which is configured such that the solution can flow homogenously and/or evenly into the processing chamber. The solution can flow into the processing chamber flowing through the perforation, an essentially homogenous and/or even flow of the solution being formable in the processing chamber in order to achieve a uniform deposition of the metal on the terminal face of the wafer. As a result, the depositing station according to the invention thus allows the generation of contact metallizations of a higher quality.

The basin arrangement and/or the basin can be configured to be integrated into a fluid circuit. The basin arrangement can have an inlet for introducing the solution from an area outside of the basin arrangement into the basin arrangement, the inlet of the basin arrangement being formable by the inlet of the basin, and an outlet for draining the solution from the basin arrangement to the area outside of the basin arrangement. For forming a fluid circuit, it thereby becomes possible in general to fluidically connect the inlet of the basin arrangement to the outlet of the basin arrangement, for example by means of a tube assembly, such that the solution can flow from the basin arrangement to the area outside of the basin arrangement via the outlet of the basin arrangement and, subsequently, can return into the basin arrangement from the area outside of the basin arrangement via the inlet of the basin arrangement. The basin arrangement and/or the basin being integrable into the fluid circuit generally allows the solution in the fluid circuit to be set in a circulating motion, for example by means of a pumping device, whereby the solution can be introduced into the processing chamber or flow into the processing chamber. Additionally, the basin arrangement and/or the basin being integrable into the fluid circuit generally also allows the solution to be cleaned during an ongoing process, for example by means of a filter device.

The perforation can be configured as a hole arrangement which can have a plurality of preferably uniform holes. The holes can be disposed such that the solution can flow evenly into each area of the processing chamber. The holes can have a cross section with a circular or square geometry, for example. A size of the cross section of the holes can be selected such that an optimal flow of the solution can be formed in the processing chamber. It can also be intended that the size of the cross section of the holes, viewed in a flow direction of the solution through the holes, increases or decreases. The holes can then serve as diffusors or nozzles. In general, a geometry and/or a size of the cross section can be selected so as to be suitable. The perforation can also fully form the inlet of the basin.

Advantageously, the inlet of the basin is disposed on the bottom of the basin, a bottom wall of the basin having the perforation. The holes of the hole arrangement can be disposed so as to be distributed, preferably evenly, over a surface of the bottom wall of the basin, preferably over the entire surface of said bottom wall of the basin. The bottom wall of the basin can be a hole perforation plate or a perforated plate. After being introduced into the processing chamber, the solution can evenly flow upwards in the processing chamber in order to achieve a uniform deposition of the metal on the terminal face of the wafers. Alternatively or additionally, at least one side wall of the basin can also have the perforation.

In a constructively advantageous embodiment of the invention, the basin can have a substructure which forms part of the inlet of the basin and which is disposed below the bottom wall of the basin, said substructure forming a cavity through which the solution can flow and which can be limited at least by the bottom wall of the basin and a bottom wall of the substructure, the basin having an inlet socket which forms part of the inlet of the basin and is inserted in a passage opening penetrating at least the bottom wall of the substructure, said inlet socket having a perforation on at least the circumference of a portion of the inlet socket protruding into the cavity, said perforation being configured to introduce the solution into the cavity. From the portion, the solution can flow radially or laterally outwards into the cavity and, from there, continue to flow upwards through the perforation of the bottom wall of the basin into the processing chamber. This configuration of the inlet socket allows an advantageous widening and/or expanding of a solution flow in the cavity, which can serve as a distribution chamber, such that the liquid can subsequently flow evenly into the processing chamber through all holes of the hole arrangement forming the perforation of the bottom wall of the basin. The perforation of the inlet socket can also be formed by a hole arrangement having a plurality of holes. Furthermore, the portion of the inlet socket can also have the perforation on the end face.

Advantageously, the portion of the inlet socket can be cylindrical, the holes of the hole arrangement being distributed, preferably evenly, over a lateral surface, preferably of the entire lateral surface, of the portion or cylinder. Furthermore, the outlet socket can be disposed in the passage opening on the bottom wall of the substructure so as to be impermeable to liquid. In addition to the bottom wall, the substructure can have four side walls, which can further limit the cavity. Preferably, the inlet socket can be disposed centrally below the bottom wall of the basin, such that the solution can flow into the processing chamber centrally through the perforation of the bottom wall of the basin. The perforation of the bottom wall of the basin, the substructure and the inlet socket can jointly form the inlet of the basin.

Advantageously, the basin can have an outlet, preferably disposed on the side of the basin, for draining the solution from the basin. Preferably, the outlet can be disposed in an area near an edge of a side wall of the basin, such that the solution can preferably flow through the entire processing chamber. The outlet of the basin can be a simple opening or a simple hole in the side wall of the basin.

Advantageously, each side wall of the basin can have a perforation which is preferably formed in an area of an edge of the side walls and which can form the outlet of the basin. The perforation of the side walls can also be formed by a hole arrangement having a plurality of holes, a geometry and a size of a cross section of the holes being selectable so as to be suitable. Advantageously, all four side walls of the basin can have a perforation of this kind, such that the solution can evenly flow out of the basin, whereby the forming of an even flow of the solution inside the basis is advantageously further facilitated. In a preferred embodiment of the invention, the perforation or the hole arrangement has at least one, preferably exactly one, row of holes parallel to the edge, which is located in the area of the opening of the basin.

Advantageously the basin arrangement can comprise an additional basin, the basin being insertable into the additional basin. The additional basin can form an outer basin and the basin can form an inner basin. This configuration of the basin arrangement allows, in particular, outsourcing of components, such as a filling level measuring device and/or a heating device, which the basin or the processing chamber can have, from the processing chamber into the additional basin, whereby a flow of the solution formable in the processing chamber can be made more even or homogenized further for improving a quality of the deposition of the metal and/or the quality of the contact metallizations and, additionally, the processing chamber can be used more effectively in terms of volume for disposing the wafer(s). The basin arrangement can comprise at least two parts and comprise the basin and the additional basin as components. The basin can be detachably connected to the additional basin, for example by means of a plurality of screw means of the basin arrangement, which, in particular, allows easier maintenance of the basin arrangement. Furthermore, the additional basin can have an opening through which the basin can be inserted from above. Additionally, the additional basin can have a rectangular surface area or cross-sectional area. Furthermore, the additional basin can have a bottom wall and four side walls. The bottom wall of the additional basin can also have a pass-through, which can be flush with the pass-through of the bottom wall of the substructure, such that the pass-through of the bottom wall of the additional basin and the pass-through of the bottom wall of the substructure can jointly form the passage opening, in which the outlet socket can be inserted. The outlet socket can be disposed in the passage opening, resting on the bottom wall of the substructure and on the bottom wall of the additional basin, so as to be impermeable to fluids. Furthermore, the bottom wall of the substructure can rest on the bottom wall of the additional basin or be disposed so as to be spaced apart therefrom. Furthermore, the outlet of the basin can be provided for draining the solution from the basin into the additional basin.

Advantageously, the additional basin can have an outlet, which is preferably disposed at the bottom of the additional basin, for draining the solution from the additional basin. The outlet of the additional basin can be provided for draining the liquid from the additional basin into the area outside of the basin arrangement. Thus, the outlet of the additional basin can form the outlet of the basin arrangement. Furthermore, the additional basin can have two outlets of this kind which can be connected to each other via a tube section of a tube assembly of the depositing station. One outlet can be disposed at a front end of the bottom of the additional basin and another outlet can be disposed at a rear end of the bottom of the additional basin, preferably transversely at an offset, in order to allow the solution to be drained effectively from the additional basin. The outlet of the additional basin can be a simple opening or a simple hole in the bottom wall of the additional basin.

In an advantageous embodiment of the invention, the inlet of the basin can be provided for introducing the solution from an area outside of the basin arrangement into the basin, the outlet of the basin can be provided for draining the solution from the basin into the additional basin and the outlet of the additional basin can be provided for draining the solution from the additional basin to the area outside of the basin arrangement.

In a preferred embodiment of the invention, the basin can be inserted into the additional basin, preferably so as to be centered, such that the solution can be introduced from the basin into an area of the additional basin limited at least by side walls of the basin and side walls of the additional basin, through the outlet of the basin disposed on the side of the basin, each side wall of the basin having a rim in an area of an edge of the side walls of the basin which preferably protrudes perpendicular from the side walls of the basin to a direction of the side walls of the additional basin and which abuts against the side walls of the additional basin in such a manner that an opening or a remaining opening of the additional basin can be covered. As a result, the additional basin and/or the solution in the additional basin is protected against contamination from outside. Additionally, the centered configuration of the basin in the additional basin allows the solution to flow evenly from the basin into the additional basin. Furthermore, each side wall of the additional basin can also have a rim in an area of an edge of the side walls of the additional basin, the rim protruding preferably perpendicularly outwards from the side walls of the additional basin into the area outside of the basin arrangement. Thus, the rim of the side walls of the basin can be seated, at least in sections, on the rim of the side walls of the additional basin. Furthermore, the screw means, which can engage into the rim of the side walls of the basin and into the side walls of the additional basin, for example, can be provided for mounting the basin on the additional basin or for a detachable connection.

Advantageously, the additional basin can have at least one inlet, preferably disposed on the side of the additional basin, for introducing the solution from an area outside of the basin arrangement into the additional basin. Advantageously, the additional basin can have two inlets of this kind. The two inlets can be disposed on different side walls, preferably on opposite side walls, of the additional basin and connected to each other with a tube section of a tube assembly of the depositing station, the tube section having a connector for connecting the tube section to the fluid circuit in order to introduce the preferably filtered solution into the tube section, and from there into the additional basin via the two inlets. The connector can be connected, for example, to a filter device of the deposition station via an additional tube section of the tube assembly. The inlet of the additional basin can be a simple opening or a simple hole in the side wall of the additional basin.

Advantageously, the basin can be configured such that a transport receptacle having a plurality of objects, in particular wafers, received therein is insertable into the basin from above. It is thus possible to subject a plurality of wafers to the deposition process simultaneously. The transport receptacle can be a basket. In the transport receptacle, the wafers can be disposed parallel to each other, at an even distance, positioned in vertical or horizontal alignment. On the bottom wall of the basin, supporting elements of the basin or the basin arrangement can be disposed and/or fixed which can support the transport receptacle having the wafers received therein.

Furthermore, for handling the transport receptacle, the depositing station can have a manipulator which can be configured in particular to move the transport receptacle in a vertical direction in order to insert the transport receptacle into the basin or the processing chamber from above for carrying out a deposition process and, subsequently, remove said transport receptacle from the basin or the processing chamber. The manipulator can also be a component of a device for producing contact metallizations which can comprise the depositing station in addition to the manipulator. In general, it is also possible to manually move the transport receptacle.

Advantageously, the basin arrangement can have a filling level measuring device which can be configured to measure a filling level. The filling level measuring device can be disposed for measuring the filling level in the basin in the basin and/or for measuring the filling level in the additional basin in the additional basin. Advantageously, the filling level measuring device can be disposed in the additional basin by itself so that it cannot impair the flow of the solution in the processing chamber and so that the processing chamber can be used preferably completely for disposing wafers. By monitoring the filling level, in particular with a filling level that is too low, new or fresh solution can be subsequently dispensed or refilled in a timely manner. The filling level measuring device can have at least one filling level sensor. Said filling level sensor can be formed by two electrodes, for example, between which an electric current can be conducted if a certain filling level has been reached.

Advantageously, the basin arrangement and/or the depositing station can have a heating device which can be configured to heat the solution. Thus, a temperature of the solution can be adjusted or adapted for reaching optimal deposition conditions. The heating device can be disposed in the basin and/or the additional basin. Advantageously, the heating device can be disposed in the additional basin by itself so that it cannot impair the flow of the solution in the processing chamber and so that the processing chamber can be used preferably completely for disposing wafers. The heating device can be disposed so as to surround the circumference of the basin in the area between the side walls of the basin and the side walls of the additional basin, preferably only in a lower part of the area between the side walls of the basin and the side walls of the additional basin. Arranging the heating device in this manner saves space. The basin can be made of a material with a good thermal conductivity, for example a metal, such that heat can be exchanged between the solution in the additional basin and the solution in the basin. The heating device can have a heating circuit in which a heating fluid, for example hot water, can circulate. Furthermore, the heating device can have a temperature control for controlling the temperature. Advantageously, the surface temperature of the heating device can be controlled, in particular in order to prevent local overheating. Furthermore, the basin arrangement can have a cooling device disposed in the basin and/or the additional basin, preferably only in the additional basin. The cooling device can have a cooling circuit in which a cooling liquid, for example cold water, can circulate. Furthermore, the cooling device can have a temperature control for controlling the temperature. The cooling device can be thermally coupled to the heating device. Combining the heating device with the cooling device allows a flexible adjustment of the temperature of the solution. It is also conceivable that the solution is heated via an external heating device of the depositing station, which can be a heat exchanger, for example.

Advantageously, the basin arrangement can have a lid which can cover an opening of the basin in a closed position of the lid. The lid can reduce a heat exchange between the solution in the basin and an environment and/or the area outside of the basin arrangement. Additionally, the solution in the basin can thus be protected against contamination from outside. The lid can be opened for inserting the wafer into processing chamber and for removing the wafer from the processing chamber and, subsequently, be closed again. The lid can be configured so as to be pivotable or displaceable, for example. The lid can be configured so as to open laterally. Furthermore, the lid can be heatable and/or coated in order to prevent condensates.

Advantageously, the lid can be pivotable, the lid forming a guiding portion in an area of a pivot axis of the lid, said guiding portion being configured to guide condensate, which may have formed on an inner surface of the lid, into the basin when the lid is moved to an open position of the lid. By means of the guiding portion, the condensate, which may have formed on the inner surface of the lid and which can originate from the vaporized or evaporated and subsequently condensed solution, can advantageously be guided back into the basin, such that less new or fresh solution must be subsequently dispensed or refilled. The guiding portion can be formed by a correspondingly bent portion of the lid. In general, however, it is also conceivable to form the lid without the guiding portion. Advantageously, the depositing station can comprise a tube assembly which can integrate the depositing station and/or the basin arrangement in a fluid circuit. To this end, the tube assembly can fluidically connect at least the inlet of the basin arrangement to the outlet of the basin arrangement. The tube assembly can be disposed in the area outside of the basin arrangement and/or on the outside of the basin arrangement and/or on the additional basin. Furthermore, the tube assembly can comprise a plurality of tube sections. Each tube section can have at least one tube element, several tube elements being configured so as to be connectable to each other. At least one tube section can fluidically connect the outlet of the additional basin to the inlet of the basin in order to form a closed fluid circuit. Furthermore, the tube assembly can comprise at least one valve and/or at least one bypass tube section, for example to bypass a filter device of the depositing station and/or a pumping device of the depositing station, which can be advantageous for emptying the basin arrangement, for example. Furthermore, a filling tube section can be provided which can serve to refill the basin arrangement or the basin and/or the additional basin.

Advantageously, the depositing station can comprise a pumping device which is configured to circulate the solution in the fluid circuit. By means of the pumping device, the solution can then be introduced into the processing chamber or flow into the processing chamber. The pumping device can be integrated in the tube assembly and/or the fluid circuit. The pumping device can be an impeller pump, for example. Advantageously, the pumping device can be disposed in the area outside of the basin arrangement.

Advantageously, the depositing station can comprise a filter device which preferably has a preliminary filter and a main filter and which is configured to clean the solution flowing in the fluid circuit. Contaminants on the wafers, which could get into the solution, wafer pieces, which could also get into the solution, can thus be removed or filtered out of the solution. The main filter can serve for fine filtration. A preliminary filtration in combination with a fine filtration advantageously allows prolonging the service life of fine filter inserts, such that the depositing station can remain in operation longer until a corresponding filter change is required. Advantageously, the filter device can be disposed in the area outside of the basin arrangement. The filter device can be integrated in the tube assembly and/or the fluid circuit. Advantageously, the filter device can be disposed downstream of the pumping device in a flow direction of the solution in the fluid circuit. One tube section of the tube assembly can connect the outlet of the additional basin to the pumping device, an additional tube section of the tube assembly can connect the pumping device to the filter device and at least one additional tube section of the tube assembly can connect the filter device to the inlet of the basin.

Advantageously, the depositing station can comprise a volume flow device which can be configured to measure and/or adjust a volumetric flow rate of the solution in the fluid circuit. The volume flow device, which can have a volume flow meter and/or volume flow sensor for measuring the volumetric flow rate, can be integrated in the tube assembly and/or the fluid circuit. Furthermore, the volume flow device can have a volume flow controller which can be coupled to the pumping device in order to adjust the volumetric flow rate. In accordance with a measured volumetric flow rate or the actual value of the volumetric flow rate, the volumetric flow rate can then be adjusted to a desired volumetric flow rate or target value of the volumetric flow rate in order to achieve an optimal flow around the wafer in the processing chamber.

Furthermore, the depositing station can comprise a valve arrangement which can be configured to empty the basin arrangement. In particular, the valve arrangement can empty the basin and/or the additional basin. It can also be intended that the basin and/or the additional basin is/are filled via the valve arrangement. The valve arrangement can be integrated in the tube assembly and, in particular, be engaged with the bypass tube section. Advantageously, the valve arrangement can comprise two valves.

Advantageously, the depositing station can comprise a sample-analysis device which can be configured to retrieve a sample of the solution, preferably from the basin arrangement or the basin and/or the additional basin, and analyze it, in particular regarding the pH value of the sample. The sample can be retrieved during an ongoing process. The sample-analysis device can be disposed on the outside of the additional basin. Furthermore, the sample-analysis device can be configured as a measuring loop, such that the sample can be returned into the basin arrangement and/or the fluid circuit after the analysis.

Furthermore, the depositing station can have a cooling device. The cooling device can cool the retrieved sample before the analysis. The cooling device can also be provided as a counter cooler in order to quickly adjust the temperature of the solution or cool the solution to a transfer temperature, in particular during maintenance of the depositing station. The cooling device can have a cooling circuit in which a cooling liquid, for example cold water, can circulate.

Advantageously, the depositing station can comprise a dosing arrangement having at least one container for receiving a component contained in the solution and having at least one dosing pump which is assigned to the container, the dosing arrangement being configured to dose the component in the solution. In particular, the component can be refilled or added in order to keep the chemical process stable in accordance with an analytical result obtained by means of the sample-analysis device. The sample-analysis device can be coupled to the dosing arrangement in order to automatically trigger a dosing procedure. The container can be connected to the tube assembly and/or the basin and/or the additional basin. Advantageously, the dosing arrangement can comprise three containers, each container having one associated dosing pump. In principle, it is also possible to refill or add the component manually. Advantageously, the additional basin can have a connector which can be connected to the dosing arrangement.

Advantageously, the basin arrangement can have a moving device which can be configured to preferably vertically move the object and/or the transport receptacle in the processing chamber or the basin. By means of the movement, an even more uniform deposition of the metal can be achieved. Preferably, the movement is a vertical upward and downward movement. However, it is also conceivable that the movement is a horizontal or rotatory movement. A combination of the aforementioned types of movement is also conceivable. The moving device can comprise a moving element which is moveable preferably vertically, which is formed preferably frame-like and a guiding portion of which can be guided in a guiding system of the moving device, said guiding system being preferably disposed on the side of the additional basin. The moving element can be provided, at least in sections, preferably fully, with a chemically stable coating, in particular against the solution, for example a nickel solution, zinc solution, palladium solution, gold solution or the like. In particular, the chemical resistance can also be provided against nitric acid, hydrochloric acid, aqua regia and/or sodium hydroxide or sodium hydroxide solution, which can be a component of the solution and/or which can be intended as cleaning chemicals or aluminum cleaners. In general, the chemical resistance can be provided against all chemicals used for the deposition.

By means of an actuator system of the moving device, the moving element can displaced, preferably vertically, said actuator system preferably also being disposed on the side of the additional basin and preferably being programmable, the object and/or the transport receptacle being retainable by a retaining portion of the moving element, which can protrude into the basin. A movement type and/or a movement range and/or a speed of movement can be programmable and/or adjustable. If the basin arrangement has a, preferably pivotable, lid, the lid can have cavities or openings which can be penetrated by the moving element when the lid is closed. This configuration of the lid allows the preferably vertical movement to be carried out when the lid is closed, which can be useful, in particular in terms of safety, in order to prevent accidents or damages during the movement. The moving device can be a module in order to be able to retrofit it in the case of a basin arrangement or a depositing station.

The device according to the invention for producing contact metallizations on terminal faces of wafers comprises at least one depositing station according to the invention, a processing chamber of the depositing station being configured to receive a transport receptacle having a plurality of wafers received therein, the device having a manipulator for handling the transport receptacle.

Advantageously, the device can comprise a plurality of workstations which are preferably disposed in a line, each workstation having a processing chamber for receiving the transport receptacle having the wafers received therein, the plurality of workstations comprising the depositing station as a workstation, the device having a conveyor on which the manipulator is disposed, the manipulator, in interaction with the conveyor, allowing the transport receptacle to be disposed in a selectable order of the processing chambers in a conveying direction. A respective dwelling time of the transport receptacle in the processing chambers, which can be programmable, can be considered. The workstations can be modules.

The device can be provided with an operator interface to allow an operator to operate the device and/or to interact with the device. In particular, process parameters can be input or set by means of the operator interface and/or error messages, instruction notices, maintenance notices, warning notices and/or other signals and/or other notices can be output by means of the operator interface. The operator interface can have a display, such as a screen, and/or control elements, such as control knobs and/or control panels.

Advantageously, the manipulator can have a horizontally movable carrier which is connected to a conveyor belt of the conveyor and which has at least one gripping arm which is vertically moveable with respect to the carrier. The conveyor belt can be driven by a drive motor of the conveyor. The carrier can have a conveyor belt by means of which the gripping arm can be displaced with respect to the carrier, the conveyor belt being drivable by a drive motor of the carrier. The gripping arm can be a receptacle. The device can comprise a sensor unit for monitoring a current of one of the drive motors or of the drive motors, a temperature of one of the drive motors or of the drive motors, a position of the carrier and/or the gripping arm, an acceleration of the carrier and/or the gripping arm and/or a tension of one of the conveyor belts or of the conveyor belts.

The transport receptacle can have receptacle elements which serve to grip the transport receptacle by means of the gripping arm. The transport receptacle can have an identification element, for example a bar code or a RFID transponder, the device being able to comprise a reading unit and/or identification unit for reading and/or identifying the identification element. This makes it possible to assign the transport receptacle to the process sequence and/or to monitor the transport receptacle in the process sequence.

Advantageously, the device can comprise an input/output station serving to equip the device with at least one transport receptacle and/or to remove the transport receptacle from the device and/or the plurality of workstations can comprise at least one cleaning station, at least one rinsing station for removing any residue from wafer surfaces and/or a drying station. The input/output station can have drawers which are preferably automatically retractable and extendable. Each drawer can be retractable and extendable by means of a drive motor of the drawer. Alternatively or additionally, a respective handle of the drawer can allow the drawer to be retracted or extended manually. Furthermore, each drawer can have a bottom with positioning elements disposed on the bottom for positioning the transport receptacle. A detection unit of the device or the drawer can detect that a drawer is equipped with a transport receptacle, such that the gripping arm can pick up the transport receptacle after a retraction of the drawer automatically triggered as a result of the detection of the equipped state of the drawer. As soon as the transport receptacle has been received by means of the gripping arm, the device can show that the drawer can be equipped again with a transport receptacle by automatically extending the drawer and/or by displaying a message. A transport receptacle with finished wafers, i.e., in particular with contact metallizations generated on their terminal faces, can be placed in a drawer by means of the gripping arm, such that the transport receptacle can be removed subsequently from the preferably automatically extended drawer. The drawers can comprise entry drawers for equipping the device with at least one transport receptacle and exit drawers for removing the transport receptacle from the device. Advantageously, the entire process can be essentially fully automated.

Hereinafter, preferred embodiments of the invention will be described in more detail with reference to the accompanying drawings.

FIG. 1 shows a perspective side view of a depositing station at an angle from above, having partly exploded components;

FIG. 2 shows a perspective view of the rear of the depositing station at an angle from above, having partly exploded components;

FIG. 3 shows a perspective view of another side of the depositing station at an angle from above, having partly exploded components;

FIG. 4 shows a perspective view of the front of the depositing station at an angle from above, having partly exploded components;

FIG. 5 shows a top view of the depositing station having partly exploded components;

FIG. 6 shows an exploded side view of a basin arrangement of the depositing station at an angle from above;

FIG. 7 shows an exploded side view of the basin arrangement at an angle from below;

FIG. 8 shows an exploded front view of the basin arrangement at an angle from above;

FIG. 9 shows an exploded view of another side of the basin arrangement at an angle from above;

FIG. 10 shows a perspective view of the rear of the basin arrangement at an angle from above;

FIG. 11 shows a perspective view of the front of the basin arrangement at an angle from below;

FIG. 12 shows a sectional view of the rear of the basin arrangement;

FIG. 13 shows a sectional side view of the basin arrangement;

FIG. 14 shows a perspective partial side view of a device for producing contact metallizations with the transport receptacle being positioned outside of a processing chamber;

FIG. 15 shows a perspective partial side view of the device with the transport receptacle being positioned inside the processing chamber;

FIG. 16 shows a partial sectional side view of the device with the transport receptacle being positioned inside the processing chamber;

FIG. 17 shows another partial sectional side view of the device with the transport receptacle being positioned inside the processing chamber;

FIG. 18 shows a perspective side view, in particular of a dosing arrangement of the depositing station, at an angle from above;

FIG. 19 shows a perspective side view of an additional embodiment of a depositing station;

FIG. 20 shows a perspective side view of an additional embodiment of a depositing station;

FIG. 21 shows a perspective view of the rear of an additional embodiment of a basin arrangement at an angle from above, with the lid of the basin arrangement being closed in the embodiment;

FIG. 22 shows a perspective view of the rear of the additional embodiment of the basin arrangement at an angle from above, with the lid of the basin arrangement being closed in the additional embodiment;

FIG. 23 shows a perspective side view of the additional embodiment of the basin arrangement at an angle from below, with the lid of the basin arrangement being open in the additional embodiment;

FIG. 24 shows a perspective side view of a conveyor of an additional embodiment of a device for producing contact metallizations, with a manipulator of the additional embodiment of the device being disposed thereon;

FIG. 25 shows a perspective side view of the manipulator;

FIG. 26 shows a perspective view of a drawer of an input/output station of the additional embodiment of the device;

FIG. 27 shows a side view of the drawer;

FIG. 28 shows a perspective view of the additional embodiment of the device.

A combined view of FIGS. 1 to 18 shows a depositing station 10 comprising a basin arrangement 11 having a basin 13 forming a processing chamber 12 and serving to receive a solution (not shown) of a metal dissolved in a liquid, for a deposition on a terminal face of a plurality of wafers 15 received in a transport receptacle 14 receivable in processing chamber 12, said plurality of wafers 15 being insertable into basin 13 from above for carrying out a deposition process, and/or being removable from basin 13 afterwards and being manageable by means of a manipulator 16.

Basin 13 has an inlet 17 for introducing the solution into basin 13, basin 13 having a perforation 18 which forms at least part of inlet 17 of basin 13 and which is configured to homogeneously introduce the solution into processing chamber 12. Inlet 17 of basin 13 is disposed on the bottom of basin 13, such that a bottom wall 19 of basin 13 has perforation 18.

Furthermore, basin 13 has a substructure 20 which forms part of inlet 17 of basin 13 and which is disposed below bottom wall 19 of basin 13, said substructure 20 forming a cavity 21 through which the solution can flow and which is limited by bottom wall 19 of basin 13, side walls 22 of substructure 20 and a bottom wall 23 of substructure 20, basin 13 having an inlet socket 27 which forms part of inlet 17 of basin 13 and is inserted in a passage opening 26 penetrating at least bottom wall 23 of substructure 20 and a bottom wall 24 of an additional basin 34 of basin arrangement 11, said inlet socket 27 having a perforation 29 on a circumference of a portion 28 of inlet socket 27 protruding into cavity 21, said perforation 29 being configured to introduce the solution into cavity 21. In this case, inlet socket 27 is disposed centrally below bottom wall 19 of basin 13.

Furthermore, basin 13 has an outlet 30 disposed on the side of basin 13 for draining the solution from basin 13, each side wall 31 of basin 13 having a perforation 33 which is preferably formed in an area of an edge 32 of side walls 31 and which forms outlet 30 of basin 13.

Furthermore, basin arrangement 11 comprises an additional basin 34, basin 13 being inserted into additional basin 34.

Additional basin 34 has outlets 35, 36 disposed on the bottom of additional basin 34 for draining the solution from additional basin 34, said outlets 35, 36 being preferably disposed at the end of bottom wall 24 of additional basin 34 and transversely at an offset.

In case at hand, inlet 17 of basin 13 is provided for introducing the solution from an area 25 outside of basin arrangement 11 into basin 13, outlet 30 of basin 13 is provided for draining the solution from basin 13 into additional basin 34 and outlets 35, 36 of additional basin 34 are provided for draining the solution from additional basin 34 to area 25 outside of basin arrangement 11.

Furthermore, additional basin 34 has two inlets 37, 38 disposed on the side of additional basin 34 for introducing the solution from an area 25 outside of basin arrangement 11 into additional basin 34.

Basin 13 is inserted into additional basin 34 so as to be centered, such that the solution can be introduced from basin 13 into an area 40 of additional basin 34 limited in particular by side walls 31 of basin 13 and side walls 39 of additional basin 34 through outlet 30 of basin 13, each side wall 31 of basin 13 having a rim 41 in an area of edge 32 of side walls 31 of basin 13 which protrudes perpendicular from side walls 31 of basin 13 to a direction of side walls 39 of additional basin 34 and which abuts against a correspondingly formed rim 42 of side walls 39 of additional basin 34 in such a manner that an opening 43 of additional basin 34 is covered. Basin 13 is detachably connected to additional basin 34 by means of screw means 44 of basin arrangement 11.

Furthermore, basin arrangement 11 has a filling level measuring device 45 disposed in additional basin 34 which is configured to measure a filling level in additional basin 34.

Furthermore, basin arrangement 11 has a heating device 46 which is disposed in additional basin 34 and which is configured to heat the solution. Heating device 46 is disposed in a lower part 48 of area 40 so as to surround the circumference of basin 13.

Furthermore, basin arrangement 11 has a pivotable lid 49 which covers an opening 50 of basin 13 in a closed position of lid 49, lid 49 forming a guiding portion 52 in an area of a pivot axis 51 of lid 49, said guiding portion 52 being configured to guide condensate, which may have formed on an inner surface 53 of lid 49, into basin 13 when lid 49 is moved to an open position of lid 49.

Depositing station 10 comprises a tube assembly 54 which integrates depositing station 10 into a fluid circuit 55.

Furthermore, depositing station 10 comprises a pumping device 56 which is configured to circulate the solution in fluid circuit 55.

Furthermore, depositing station 10 comprises a filter device 57 which is configured to clean the solution flowing in fluid circuit 55.

Additionally, depositing station 10 comprises a volume flow device 58, which is configured to measure and/or adjust a volumetric flow rate of the solution in fluid circuit 55, a valve arrangement 59, which is configured to empty basin arrangement 11, a sample-analysis device 60, which is configured to take and analyze a sample of the solution, in particular regarding the pH value of the sample, a cooling device 47, and a dosing arrangement 61 having three containers 62 for receiving a component (not shown) contained in the solution, each container 62 being assigned one dosing pump 63 of dosing arrangement 61, dosing arrangement 61 being configured to dose the component in the solution.

Cooling device 47, sample-analysis device 60 and dosing arrangement 61 are shown exploded off basin arrangement 11 and can be correspondingly disposed on or connected to basin arrangement 11 in particular.

Tube assembly 54 comprises a plurality of tube sections, the tube sections consisting of several connected tube elements in some instances, which are generally evident in the Figures, but will not be described individually hereinafter.

A tube section 64 connects outlets 35, 36 of additional basin 34 to pumping device 56. An additional tube section 65 connects pumping device 56 to filter device 57, an additional tube section 66 connecting filter device 57 to inlet 17 of basin 13. Furthermore, an additional tube section 67 is provided which connects filter device 57 to inlets 37, 38 of additional basin 34. Additionally, a bypass tube section 68 connects tube section 64 to additional tube section 66.

Volume flow device 58 is integrated in additional tube section 66. Furthermore, valve arrangement 59 is connected to tube section 64 and also to additional tube section 66 via bypass tube section 68 in order to make it possible to empty basin 13 and additional basin 34.

By means of manipulator 16, which is a component of a device for producing contact metallizations 69, to which depositing station 10 also belongs, transport receptacle 14 having wafers 15 vertically positioned therein can be inserted in and/or removed from processing chamber 12, transport receptacle 14, which has been inserted into processing chamber 12, being supported by four supporting elements 70, which are disposed on bottom wall 19 of basin 13, of basin arrangement 11.

FIG. 19 shows a depositing station 71. A filter device 72 of the depositing station comprises a preliminary filter 73 and a main filter 74 in this case. Additionally, a sample-analysis device 75 of depositing station 71 and a cooling device 76 of depositing station 71 are disposed on a basin arrangement 77 of depositing station 71. Furthermore, a filling tube section 79 is provided which serves to refill basin arrangement 77. In addition, the essential components of depositing station 71 correspond to depositing station 10.

FIG. 20 shows a depositing station 78, which essentially corresponds to depositing station 71.

A combined view of FIGS. 21 to 23 shows a basin arrangement 80 having a basin 81, an additional basin 82 and a pivotable lid 83, a transport receptacle 83 having a plurality of wafers 85 received therein being inserted into basin 81. Furthermore, basin arrangement 80 has a moving device 86, which is configured to vertically move transport receptacle 84 in basin 81. Moving device 86 comprises a vertically moveable frame-like moving element 87, which is guided by a guiding portion 88 of moving elements 87 in a guiding system 89 of moving device 86, said guiding system 89 being disposed on the side of additional basin 82. By means of a programmable actuator system 90, which is also disposed on the side of additional basin 82, of moving device 86, moving element 87 can be moved vertically, transport receptacle 84 being held by a retaining portion 91 of moving element 87, said retaining portion 91 protruding into basin 81. Lid 83 has cavities 92 which are protruded by moving element 87 when lid 83 is closed. This configuration of lid 83 allows a vertical movement to be carried out when lid 83 is closed, moving element 87 alternately moving out of lid 83 and into lid 84 during the vertical movement. Furthermore, the inside of lid 83 has a coating 93 to prevent condensates. Moreover, the essential components of basin arrangement 80 correspond to basin arrangement 11.

A combined view of FIGS. 24 to 28 shows a device 94 for producing contact metallizations on terminal face of wafers 96 received in a transport receptacle 95, said device 94 comprising an input/output station 97 for equipping device 94 with transport receptacles 95 and a plurality of workstations, of which only two depositing stations 98, 99 can be seen in this case. Input/output station 97 and the workstations and depositing stations 98, 99 are disposed in a line. In each of the two free areas 100, 101 of device 94, one additional workstation can be disposed. Each workstation and depositing station 98, 99 has a processing chamber (not shown) for receiving transport receptacle 95. Furthermore, device 94 has a manipulator 102 for handling transport receptacle 95, device 94 having a conveyor 103, on which manipulator 102 is disposed, manipulator 102 in interaction with conveyor 103 allowing an arrangement of transport receptacle 95 in a selectable order of the processing chambers in a conveying direction (not shown). Additionally, device 94 is provided with an operator interface 104. Furthermore, manipulator 102 has a horizontally moveable carrier 106 which is connected to a conveyor belt 105 of conveyor 103 and which has a gripping arm 107 which is vertically moveable with respect to carrier 106. Conveyor belt 105 is driven by a drive motor 108 of conveyor 103. Carrier 106 has a conveyor belt 110 driven by a drive motor 109 of carrier 106 by means of which gripping arm 107 is moveable with respect to carrier 106. Input/output station 97 has drawers 111 which can each be automatically retracted and extended by means of a drive motor 112 of drawer 111. Additionally, a respective handle 113 of drawer 111 allows an operator to manually retract and extend drawer 111. Furthermore, each drawer 111 has a bottom 114 with positioning elements 115 disposed on bottom 114 for positioning transport receptacle 95. Furthermore, receptacle elements 116 of transport receptacle 95 can be seen which serve to grip transport receptacle 95 by means of gripping arm 107.

The objects shown in FIGS. 1 to 28 can be combined in any useful manner.

Claims

1. A depositing station (10, 71, 78, 98, 99) comprising a basin arrangement (11, 77, 80) having a basin (13, 81) forming a processing chamber (12) and serving to receive a solution of a metal, in particular nickel, zinc, palladium, gold or the like, dissolved in a liquid, for a, preferably electroless, deposition on an object receivable in the processing chamber, in particular on a terminal face of a wafer (15, 85, 96) receivable in the processing chamber, the basin having at least one inlet (17) for introducing the solution into the basin,

characterized in that

the basin has a perforation (18) which forms at least part of the inlet of the basin and which is configured to homogeneously introduce the solution into the processing chamber.

2. The depositing station according to claim 1,

characterized in that

the inlet (17) of the basin (13, 81) is disposed on the bottom of the basin, a bottom wall (19) of the basin having the perforation (18).

3. The depositing station according to claim 2,

characterized in that

the basin (13, 81) has a substructure (20) which forms part of the inlet (17) of the basin and which is disposed below the bottom wall (19) of the basin, said substructure (20) forming a cavity (21) through which the solution can flow and which is limited at least by the bottom wall of the basin and a bottom wall (23) of the substructure, the basin having an inlet socket (27) which forms part of the inlet of the basin and is inserted in a passage opening (26) penetrating at least the bottom wall of the substructure, said inlet socket (27) having a perforation (29) on at least the circumference of a portion (28) of the inlet socket protruding into the cavity, said perforation (29) being configured to introduce the solution into the cavity.

4. The depositing station according to any one of the preceding claims,

characterized in that

the basin (13, 81) has an outlet (30), preferably disposed on the side of the basin, for draining the solution from the basin.

5. The depositing station according to claim 4,

characterized in that

each side wall (31) of the basin (13, 81) has a perforation (33) which is preferably formed in an area of an edge (32) of the side walls and which forms the outlet (30) of the basin.

6. The depositing station according to any one of the preceding claims,

characterized in that

the basin arrangement (11, 80) comprises an additional basin (34, 82), the basin (13, 81) being inserted into the additional basin.

7. The depositing station according to claim 6,

characterized in that

the additional basin (34, 82) has an outlet (35, 36), which is preferably disposed on the bottom of the additional basin, for draining the solution from the additional basin.

8. The depositing station according to at least claims 4 and 7,

characterized in that

the inlet (17) of the basin (13, 81) is provided for introducing the solution from an area (25) outside of the basin arrangement (11, 77, 80) into the basin, the outlet (30) of the basin is provided for draining the solution from the basin into the additional basin (34, 82) and the outlet (35, 36) of the additional basin is provided for draining the solution from the additional basin to the area outside of the basin arrangement.

9. The depositing station according to at least claims 4 and 6,

characterized in that

the basin (13, 81) is inserted into the additional basin (34, 82), preferably so as to be centered, such that the solution is introduced from the basin into an area (40) of the additional basin limited at least by side walls (31) of the basin and side walls (39) of the additional basin, through the outlet (30) of the basin disposed on the side of the basin, each side wall of the basin having a rim (41) in an area of an edge (32) of the side walls of the basin which preferably protrudes perpendicular from the side walls of the basin to a direction of the side walls of the additional basin and which abuts against the side walls of the additional basin in such a manner that an opening (43) of the additional basin is covered.

10. The depositing station according to any one of claims 6 to 9,

characterized in that

the additional basin (34, 82) has at least one inlet (37, 38), preferably disposed on the side of the additional basin, for introducing the solution from an area (25) outside of the basin arrangement (11, 77, 80) into the additional basin.

11. The depositing station according to any one of the preceding claims,

characterized in that

the basin (13, 81) is configured such that a transport receptacle (14, 84, 95) having a plurality of objects, in particular wafers (15, 85, 96), received therein is insertable into the basin from above.

12. The depositing station according to claim 11,

characterized in that

the depositing station (10, 71, 78, 98, 99) comprises a manipulator (16, 102) which is configured to insert the transport receptacle (14, 84, 95) into the basin (13, 81) and remove said transport receptacle (14, 84, 95) from the basin.

13. The depositing station according to any one of the preceding claims,

characterized in that

the basin arrangement (11, 77, 80) has a filling level measuring device (45) which is configured to measure a filling level.

14. The depositing station according to any one of the preceding claims,

characterized in that

the basin arrangement (11, 77, 80) and/or the depositing station (10, 71, 78, 98, 99) has a heating device (46) which is configured to heat the solution.

15. The depositing station according to any one of the preceding claims,

characterized in that

the basin arrangement (11, 77, 80) has a lid (49, 83) which covers an opening (50) of the basin (13, 81) in a closed position of the lid.

16. The depositing station according to claim 15,

characterized in that

the lid (49, 83) is pivotable, the lid forming a guiding portion (52) in an area of a pivot axis (51) of the lid, said guiding portion (52) being configured to guide condensate, which may have formed on an inner surface (53) of the lid, into the basin when the lid is moved to an open position of the lid.

17. The depositing station according to any one of the preceding claims,

characterized in that

the depositing station (10, 71, 78, 98, 99) comprises a tube assembly (54) which integrates the depositing station into a fluid circuit (55).

18. The depositing station according to claim 17,

characterized in that

the depositing station (10, 71, 78, 98, 99) comprises a pumping device (56) which is configured to circulate the solution in the fluid circuit (55).

19. The depositing station according to claim 17 or 18,

characterized in that

the depositing station (10, 71, 78, 98, 99) comprises a filter device (57, 72) which preferably has a preliminary filter (73) and a main filter (74) and which is configured to clean the solution flowing in the fluid circuit (55).

20. The depositing station according to any one of claims 17 to 19,

characterized in that

the depositing station (10, 71, 78, 98, 99) comprises a volume flow device (58) which is configured to measure and/or adjust a volumetric flow rate of the solution in the fluid circuit (55).

21. The depositing station according to any one of the preceding claims,

characterized in that

the depositing station (10, 71, 78, 98, 99) comprises a valve arrangement (59) which is configured to empty the basin arrangement (11, 77, 80).

22. The depositing station according to any one of the preceding claims,

characterized in that

the depositing station (10, 71, 78, 98, 99) comprises a sample-analysis device (60, 75) which is configured to take a sample of the solution, preferably from the basin arrangement (11, 77, 80), and to analyze said sample, in particular regarding a pH value of the sample.

23. The depositing station according to any one of the preceding claims,

characterized in that

the depositing station (10, 71, 78, 98, 99) comprises a cooling device (47, 76).

24. The depositing station according to any one of the preceding claims,

characterized in that

the depositing station (10, 71, 78, 98, 99) comprises a dosing arrangement (61) having at least one container (62) for receiving a component contained in the solution and having at least one dosing pump (63) which is assigned to the container, the dosing arrangement being configured to dose the component in the solution.

25. The depositing station according to any one of the preceding claims,

characterized in that

the basin arrangement (11, 77, 80) has a moving device (86) which is configured to preferably vertically move the object in the processing chamber (12).

26. A device (69, 94) for producing contact metallizations on terminal faces of wafers, comprising at least one depositing station (10, 71, 78, 98, 99) according to any one of the preceding claims, a processing chamber (12) of the depositing station being configured to receive a transport receptacle (14, 84, 95) having a plurality of wafers (15, 85, 96) received therein, the device having a manipulator (16, 102) for handling the transport receptacle.

27. The device according to claim 26,

characterized in that

the device (69, 94) comprises a plurality of workstations which are preferably disposed in a line, each workstation having a processing chamber (12) for receiving the transport receptacle (14, 84, 95) having the wafers (15, 85, 96) received therein, the plurality of workstations comprising the depositing station (10, 71, 78, 98, 99) as a workstation, the device having a conveyor (103) on which the manipulator (16, 102) is disposed, the manipulator, in interaction with the conveyor, allowing the transport receptacle to be disposed in a selectable order of the processing chambers in a conveying direction.

28. The device according to claim 27,

characterized in that

the manipulator (16, 102) has a horizontally movable carrier (106) which is connected to a conveyor belt (105) of the conveyor (103) and which has at least one gripping arm (107) which is vertically moveable with respect to the carrier.

29. The device according to claim 27 or 28,

characterized in that

the device (69, 94) comprises an input/output station (97) which preferably has drawers (111), said drawers (111) preferably being automatically retractable and extendable, and serves to equip the device with at least one transport receptacle (14, 84, 95), and/or the plurality of workstations comprise at least one cleaning station, at least one rinsing station for removing any residue from wafer surfaces and/or a drying station.