Headphone

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Description

FIG. 1 is a top, front, and left side perspective view of a headphone showing our new design;

FIG. 2 is a bottom, rear and right side perspective view thereof;

FIG. 3 is a front elevational view thereof;

FIG. 4 is a rear elevational view thereof;

FIG. 5 is a left side view thereof;

FIG. 6 is a right side view thereof;

FIG. 7 is a top plan view thereof;

FIG. 8 is a bottom plan view thereof;

FIG. 9 is an enlarged view of portion 9 in FIG. 1; and,

FIG. 10 is an enlarged view of portion 10 in FIG. 1.

The broken lines in the drawings illustrate portions of the headphone which form no part of the claimed design.

The dot-dash broken lines encircling portions of the headphone in FIG. 1 and illustrated in enlarged views in FIGS. 9 and 10 and forms no part of the claimed design.

Claims

The ornamental design for a headphone, as shown and described.

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Patent History
Patent number: D1001773
Type: Grant
Filed: Jul 29, 2021
Date of Patent: Oct 17, 2023
Assignee: YEALINK (XIAMEN) NETWORK TECHNOLOGY CO., LTD. (Xiamen)
Inventors: Canhong Lin (Fujian), Jiancheng Zhang (Fujian)
Primary Examiner: Paula Allen Greene
Application Number: 29/801,642