Microneedle instrument
Description
The broken lines shown in the drawings are included for the purpose of illustrating portions of the microneedle instrument that form no part of the claimed design.
Claims
The ornamental design for a microneedle instrument, as shown and described.
Referenced Cited
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Patent History
Patent number: D1010810
Type: Grant
Filed: Jun 6, 2022
Date of Patent: Jan 9, 2024
Inventor: Shunli He (Guangdong)
Primary Examiner: Sandra Snapp
Assistant Examiner: Gilbert B Ford
Application Number: 29/841,390
Type: Grant
Filed: Jun 6, 2022
Date of Patent: Jan 9, 2024
Inventor: Shunli He (Guangdong)
Primary Examiner: Sandra Snapp
Assistant Examiner: Gilbert B Ford
Application Number: 29/841,390