Combined pair of earphones and charging case

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Description

FIG. 1 is a perspective view of the pair of earphones of the combined pair of earphones and charging case showing my new design;

FIG. 2 is another perspective view thereof;

FIG. 3 is a front elevational view thereof;

FIG. 4 is a rear elevational view thereof;

FIG. 5 is a left side elevational view of each earphone;

FIG. 6 is a right side elevational view of each earphone;

FIG. 7 is a top plan view thereof;

FIG. 8 is a bottom plan view thereof;

FIG. 9 is a perspective view of the charging case of the combined pair of earphones and charging case;

FIG. 10 is another perspective view thereof;

FIG. 11 is a front elevational view thereof;

FIG. 12 is a rear elevational view thereof;

FIG. 13 is a left side elevational view thereof;

FIG. 14 is a right side elevational view thereof;

FIG. 15 is a top plan view thereof;

FIG. 16 is a bottom plan view thereof; and,

FIG. 17 is a perspective view of the combined pair of earphones and charging case, shown with the earphones received in the charging case.

The dash-dash broken lines in the drawings depict portions of the combined pair of earphones and charging case that form no part of the claimed design.

Claims

The ornamental design for a combined pair of earphones and charging case, as shown and described.

Referenced Cited
U.S. Patent Documents
D806684 January 2, 2018 Tsai
D853358 July 9, 2019 Damboulev et al.
D863265 October 15, 2019 Hu
D881850 April 21, 2020 Zhang
D883259 May 5, 2020 Ma
D904762 December 15, 2020 Koneru
D905002 December 15, 2020 Koneru
D916055 April 13, 2021 Xiao
D916056 April 13, 2021 Boyd
D926731 August 3, 2021 Deng
D928123 August 17, 2021 Gao
D941806 January 25, 2022 Liu
D954029 June 7, 2022 Guo
D974335 January 3, 2023 Ma
D980195 March 7, 2023 Tan
D984421 April 25, 2023 Deng
Foreign Patent Documents
308116558 July 2023 CN
308197874 August 2023 CN
015027817-0004 July 2023 EM
Other references
  • Occiam, first available Jul. 29, 2023 [online], [retrieved Oct. 10, 2023]. Available from the Internet, URL:<https://a.co/d/03pxNJK>. (Year: 2023).
  • Telnp, first available Jun. 30, 2023 [online], [retrieved Oct. 10, 2023]. Available from the Internet, URL:<https://www.amazon.com/dp/B0C9TDMFKD?ref_=cm_sw_r_cp_ud_dp_KN8NTDTBM1BJSV6DPQM9>. (Year: 2023).
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Patent History
Patent number: D1013664
Type: Grant
Filed: Sep 28, 2023
Date of Patent: Feb 6, 2024
Inventor: Xiang Tan (Shenzhen)
Primary Examiner: Jack Reickel
Assistant Examiner: Russell Carnell Smith, Jr.
Application Number: 29/903,910
Classifications
Current U.S. Class: Headphone (D14/223)