RFID inlay

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Description

FIG. 1 is a top view of an RFID inlay, showing our design;

FIG. 2 is a bottom view thereof; and,

FIG. 3 is an isometric view thereof.

The broken line showing in the Figures shows environment and forms no part of the claimed design.

Claims

The ornamental design for an RFID inlay, as shown and described.

Referenced Cited
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Patent History
Patent number: D1015316
Type: Grant
Filed: Dec 10, 2021
Date of Patent: Feb 20, 2024
Assignee: Advanide Holdings Pte. Ltd. (Singapore)
Inventors: Holger Roessner (Singapore), Joe Lo (Singapore), Alejandro Placitelli (Montevideo)
Primary Examiner: Daniel J Domino
Assistant Examiner: Samina Vieth
Application Number: 29/818,834
Classifications