Housing for electronic components

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Description

FIG. 1 is an isometric view of the top, left side, and front side of a housing for electronic components showing a first embodiment of the design.

FIG. 2 is a rear elevational view of the housing for electronic components of FIG. 1.

FIG. 3 is a front elevational view of the housing for electronic components of FIG. 1.

FIG. 4 is a left side elevational view of the housing for electronic components of FIG. 1.

FIG. 5 is a right side elevational view of the housing for electronic components of FIG. 1.

FIG. 6 is a top plan view of the housing for electronic components of FIG. 1.

FIG. 7 is a bottom plan view of the housing for electronic components of FIG. 1.

FIG. 8 is an isometric view of the top, left side, and front side of a housing for electronic components showing a second embodiment of the design.

FIG. 9 is a rear elevational view of the housing for electronic components of FIG. 8.

FIG. 10 is a front elevational view of the housing for electronic components of FIG. 8.

FIG. 11 is a left side elevational view of the housing for electronic components of FIG. 8.

FIG. 12 is a right side elevational view of the housing for electronic components of FIG. 8.

FIG. 13 is a top plan view of the housing for electronic components of FIG. 8; and,

FIG. 14 is a bottom plan view of the housing for electronic components of FIG. 8.

The evenly-spaced broken lines in the figures form no part of the claimed design. The dot-dash broken lines in the figures define areas that form no part of the claimed design.

Claims

The ornamental design for a housing for electronic components, as shown and described.

Referenced Cited
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Other references
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Patent History
Patent number: D1018520
Type: Grant
Filed: Apr 28, 2020
Date of Patent: Mar 19, 2024
Assignee: Odenwälder Kunststoffwerke Gehäusesysteme GmbH (Buchen)
Inventor: Martin Nussberger (Munich)
Primary Examiner: Kathleen L Jones
Application Number: 29/732,874