Low profile integrated circuit dip socket

- Zero Corporation
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Description

FIG. 1 is a right front perspective view of a low profile integrated circuit socket showing our new design;

FIG. 2 is a front end elevational view thereof;

FIG. 3 is a rear end elevational view thereof;

FIG. 4 is a bottom plan view thereof;

FIG. 5 is a right front perspective view of an eight pin socket embodiment thereof;

FIG. 6 is a bottom plan view of the socket of FIG. 5;

FIG. 7 is a front end elevational view thereof;

FIG. 8 is a rear end elevational view thereof;

FIG. 9 is a rear perspective view of the socket of FIG. 1; and

FIG. 10 is a rear perspective view of the socket of FIG. 5.

Referenced Cited
U.S. Patent Documents
2832942 April 1958 French
3732529 May 1973 Weisenburger
Other references
  • Electronic Molding Corp. Product Bulletin FS-16, Rec'd May 1971, Sockets.
Patent History
Patent number: D247032
Type: Grant
Filed: Jun 16, 1975
Date of Patent: Jan 24, 1978
Assignee: Zero Corporation (Burbank, CA)
Inventors: Gene C. Hollingsworth (Cerritos, CA), Eugene G. Freehauf (Ontario, CA)
Primary Examiner: Susan J. Lucas
Attorney: Edward J. Da Rin
Application Number: 5/587,394
Classifications
Current U.S. Class: D13/24
International Classification: D1303;