Housing for printed circuit boards
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FIG. 1 is a top, left side and front perspective view of a housing for printed circuit boards showing my new design, the right side being a mirror image of the left side;
FIG. 2 is a top plan view thereof on a reduced scale, the bottom view being a mirror image;
FIG. 3 is a rear elevational view thereof on a reduced scale;
FIG. 4 is a top left side and front perspective view of a second embodiment of my design;
FIG. 5 is a top plan view thereof on a reduced scale, the bottom being a mirror image;
FIG. 6 is a rear elevational view thereon on a reduced scale; and
FIG. 7 is a sectional view on a greatly enlarged scale of the first embodiment taken along line 7--7 in FIG. 2, the second embodiment being similar thereto however including a spacer between the top and bottom sections.
Type: Grant
Filed: May 11, 1981
Date of Patent: Jan 24, 1984
Assignee: Paradyne Corporation (Largo, FL)
Inventor: James L. Korzik (Palm Harbor, FL)
Primary Examiner: Susan J. Lucas
Law Firm: Kane, Dalsimer, Kane, Sullivan & Kurucz
Application Number: 6/262,683
International Classification: D1303; D1402;