Heat sink clip for surface-mount integrated circuit

- Motorola, Inc.
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Description

FIG. 1 is a front, top, and right side perspective view showing our new design for a heat sink clip for surface-mount integrated circuit;

FIG. 2 is a left elevational view thereof;

FIG. 3 is a rear elevational view thereof;

FIG. 4 is a bottom plan view thereof; and,

FIG. 5 is a front, top, and right side perspective view showing an alternate embodiment for a heat sink clip for surface mount integrated circuit, the front, top, and left side perspective view being a mirror image.

Referenced Cited
U.S. Patent Documents
D262203 December 8, 1981 Johnson et al.
D275749 October 2, 1984 McCarthy
D282838 March 4, 1986 McCarthy
D283503 April 22, 1986 McCarthy
4203488 May 20, 1980 Johnson et al.
4508163 April 2, 1985 McCarthy
4961125 October 2, 1990 Jordan et al.
Foreign Patent Documents
0220199 March 1985 DEX
Patent History
Patent number: D339110
Type: Grant
Filed: Sep 3, 1991
Date of Patent: Sep 7, 1993
Assignee: Motorola, Inc. (Schaumburg, IL)
Inventors: Carl A. Steen, Jr. (Park Ridge, IL), Robert B. Widmayer (Palatine, IL)
Primary Examiner: Wallace R. Burke
Assistant Examiner: Joel Sincavage
Attorney: James A. Coffing
Application Number: 7/754,133
Classifications
Current U.S. Class: Heat Sink (D13/179)