Detachable integrated circuit module
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Description
FIG. 1 is a perspective view of the detachable integrated circuit module illustrating its cooperative relationship with a packaged integrated circuit. The broken line showing of the packaged integrated circuit is included for the purpose of illustrating an environmental element only, and forms no part of the claimed design;
FIGS. 2 and 3 are opposing side elevation views of the detachable module;
FIG. 4 is an end elevation view of the detachable module from its end nearer the lockout key;
FIG. 5 is an end elevation view of the detachable module from its end opposite that from the lockout key;
FIG. 6 is a top plan view of the detachable module; and,
FIG. 7 is a bottom plan view of the detachable module.
Referenced Cited
U.S. Patent Documents
Patent History
Patent number: D358804
Type: Grant
Filed: Sep 2, 1993
Date of Patent: May 30, 1995
Assignee: SGS-Thomson Microelectronics, Inc. (Carrollton, TX)
Inventors: Harry M. Siegel (Hurst, TX), Michael J. Hundt (Double Oak, TX), Krishnan Kelappan (Carrollton, TX)
Primary Examiner: Joel Sincavage
Attorneys: Rodney M. Anderson, Lisa K. Jorgenson, Richard K. Robinson
Application Number: 0/12,514
Type: Grant
Filed: Sep 2, 1993
Date of Patent: May 30, 1995
Assignee: SGS-Thomson Microelectronics, Inc. (Carrollton, TX)
Inventors: Harry M. Siegel (Hurst, TX), Michael J. Hundt (Double Oak, TX), Krishnan Kelappan (Carrollton, TX)
Primary Examiner: Joel Sincavage
Attorneys: Rodney M. Anderson, Lisa K. Jorgenson, Richard K. Robinson
Application Number: 0/12,514
Classifications
Current U.S. Class:
Semiconductor, Transistor Or Integrated Circuit (24) (D13/182)