Chip packaging device

- Affymetrix, Inc.
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Description

FIG. 1 is a perspective view of a chip packaging device showing our new design;

FIG. 2 is a top plan view thereof;

FIG. 3 is a left side elevational view thereof;

FIG. 4 is a front elevational view, the left side elevational view being a mirror image;

FIG. 5 is a rear elevational view thereof;

FIG. 6 is a right side elevational view thereof; and,

FIG. 7 is a bottom plan view thereof.

Referenced Cited
U.S. Patent Documents
D358481 May 23, 1995 Abrams et al.
D406759 March 16, 1999 Lawrence
4747483 May 31, 1988 Grabbe
4767984 August 30, 1988 Bakker
4954088 September 4, 1990 Fujizaki et al.
5038248 August 6, 1991 Mwyer
5109980 May 5, 1992 Matsuoka et al.
5567177 October 22, 1996 Foerstel et al.
5839918 November 24, 1998 Matsuoka
Patent History
Patent number: D430024
Type: Grant
Filed: Nov 4, 1998
Date of Patent: Aug 29, 2000
Assignee: Affymetrix, Inc. (Santa Clara, CA)
Inventors: Donald M. Besemer (Los Altos Hills, CA), Virginia W. Goss (Santa Barbara, CA), James L. Winkler (Sunnyvale, CA)
Primary Examiner: Prabhakar Deshmukh
Attorney: Townsend Townsend & Crew
Application Number: 0/96,089
Classifications
Current U.S. Class: D/9430
International Classification: 0907;