Mold produced housing for enclosing the connection between a cable and a connector

Skip to: Description  ·  Claims  ·  References Cited  · Patent History  ·  Patent History
Description

FIG. 1 is a front elevational view of a mold produced housing for enclosing the connection between a cable and a connector showing my new design;

FIG. 2 is a rear elevational view thereof;

FIG. 3 is a top plan view thereof;

FIG. 4 is a bottom plan view thereof;

FIG. 5 is a right side elevational view thereof; and,

FIG. 6 is a left side elevational view thereof.

The broken lines in FIG. 1 are included for the purpose of illustrating environmental structure only and form no part of the claimed design.

Claims

The ornamental design for a mold produced housing for enclosing the connection between a cable and a connector, as shown and described.

Referenced Cited
U.S. Patent Documents
D303656 September 26, 1989 Wong et al.
D304028 October 17, 1989 Matsuzaki
D358802 May 30, 1995 Kunz
D379177 May 13, 1997 Chu
D402266 December 8, 1998 Siemon et al.
D412314 July 27, 1999 Lee
D430541 September 5, 2000 Lee et al.
D434380 November 28, 2000 Watanabe
5334044 August 2, 1994 Falossi et al.
5462457 October 31, 1995 Schroepfer et al.
5493475 February 20, 1996 Lin
5538438 July 23, 1996 Orlando
5600885 February 11, 1997 Schroepfer et al.
5620335 April 15, 1997 Siemon
5685731 November 11, 1997 Lin
5685736 November 11, 1997 Lung
6080001 June 27, 2000 Wong
Patent History
Patent number: D443593
Type: Grant
Filed: Nov 10, 2000
Date of Patent: Jun 12, 2001
Inventor: Henry Milan (Rochester Hills, MI)
Primary Examiner: Joel Sincavage
Attorney, Agent or Law Firm: Marshall & Melhorn, LLC
Application Number: 29/132,483