Molded cable interconnect
Latest Monster Cable Products, Inc. Patents:
A portion of the disclosure of this design patent application document contains material to which a claim for copyright is also made. The copyright owner has no objection to the facsimile reproduction of this design patent application by anyone as it appears in the Patent and Trademark Office patent file or records, but reserves all other copyrights whatsoever.
FIG. 1 is a perspective view of a first embodiment of a molded cable interconnect, in accordance with the present invention.
FIG. 2 is a plan view of a first embodiment of a molded cable interconnect, in accordance with the present invention, as depicted in FIG. 1.
FIG. 3 is an underside view of a first embodiment of a molded cable interconnect, in accordance with the present invention, as depicted in FIG. 1.
FIG. 4 is a side view of a first embodiment of a molded cable interconnect, in accordance with the present invention, as depicted in FIG. 1.
FIG. 5 is a corresponding side view of a first embodiment of a molded cable interconnect, in accordance with the present invention, as depicted in FIG. 1, as depicted in FIG. 1.
FIG. 6 is a rear view of a first embodiment of a molded cable interconnect, in accordance with the present invention, as depicted in FIG. 1.
FIG. 7 is a frontal view of a first embodiment of a molded cable interconnect, in accordance with the present invention, as depicted in FIG. 1.
FIG. 8 is a perspective view of a second embodiment of a molded cable interconnect, in accordance with the present invention.
FIG. 9 is a plan view of a second embodiment of a molded cable interconnect, in accordance with the present invention, as depicted in FIG. 8.
FIG. 10 is an underside view of a second embodiment of a molded cable interconnect, in accordance with the present invention, as depicted in FIG. 8.
FIG. 11 is a side view of a second embodiment of a molded cable interconnect, in accordance with the present invention, as depicted in FIG. 8.
FIG. 12 is a corresponding side view of a second embodiment of a molded cable interconnect, in accordance with the present invention, as depicted in FIG. 8.
FIG. 13 is a rear view of a second embodiment of a molded cable interconnect, in accordance with the present invention, as depicted in FIG. 8; and,
FIG. 14 is a frontal view of a second embodiment of a molded cable interconnect, in accordance with the present invention, as depicted in FIG. 8.
Claims
The ornamental design for a molded cable interconnect, as shown and described.
| D347208 | May 24, 1994 | Martin et al. |
| D387733 | December 16, 1997 | Lee |
| D392942 | March 31, 1998 | Lee |
| D429218 | August 8, 2000 | Lee |
| 5243136 | September 7, 1993 | Chen |
| 5322972 | June 21, 1994 | Fitch et al. |
| 5347089 | September 13, 1994 | Barrat et al. |
| 5726388 | March 10, 1998 | Ferland |
| 5792986 | August 11, 1998 | Lee |
| 5937950 | August 17, 1999 | Adams et al. |
| 5984717 | November 16, 1999 | Lee |
Type: Grant
Filed: Sep 27, 2000
Date of Patent: Aug 28, 2001
Assignee: Monster Cable Products, Inc. (Brisbane, CA)
Inventor: Kendrew Lee (Fremont, CA)
Primary Examiner: Joel Sincavage
Attorney, Agent or Law Firm: LaRiviere, Grubman & Payne, LLP
Application Number: 29/130,163
International Classification: 1303;
